DASF001825.pdf by Avago Technologies

Partial File Text HITCE* Ball Grid Array Surface Mount Assembly for Lead BGA Balls Application Note 5055 Introduction Printed Circuit Design This document outlines the design and assembly guidelines for
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
Powered by Findchips

DASF001825.pdf preview

Download Datasheet

User Tagged Keywords

BGA Ball Crack BGA cte BGA PACKAGE thermal profile BGA Solder Ball 1mm bga thermal cycling reliability entek Cu-56 fine BGA thermal profile JEDEC SMT reflow profile pcb warpage* in smt reflow Solder Paste Indium reflow process control Solder Paste, Indium reflow process control Solder Paste, Indium, Type 3