DSAUTAZ0015055.pdf by Philips Semiconductors

Partial File Text PDF: 1999 Sep 10 Philips Semiconductors Package outline HBCC24: plastic, heatsink bottom chip carrier; 24 terminals; body 4 x 4 x 0.65 mm SOT564-1 D pin 1 index area x B b1 w M w M b
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