The Datasheet Archive
Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
Search
DASF002450.pdf
by Avago Technologies
Partial File Text
HITCE* Ball Grid Array Lead-free Surface Mount Assembly Application Note 5364 Introduction Printed Circuit Design This document outlines the design and assembly guidelines for High Ther
Datasheet Type
Original
RoHS
Unknown
Pb Free
Unknown
Lifecycle
Unknown
DASF002450.pdf
preview
Download Datasheet
User Tagged Keywords
BGA Ball Crack
BGA PACKAGE thermal profile
BGA PROFILING
expansion joint
JEDEC SMT reflow profile
OSP FLIPCHIP CRACK
pcb warpage after reflow