DSAUTAZ0016100.pdf by STMicroelectronics

Partial File Text ® Thermal Data TQFP 14x14 44, 80,100 leads 44 to 100 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 3.9 W/cm°C 0.01 W/cm°C leadframe die attach copper epox
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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