DSAUTAZ0016101.pdf by STMicroelectronics

Partial File Text ® Thermal Data TQFP 7x7 32 leads 32 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 3.9 W/cm°C 0.01 W/cm°C leadframe die attach copper epoxy glue (silver fi
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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