DSA00362252.pdf by International Rectifier

Partial File Text PD - 95826B IRFC3810B HEXFET® Power MOSFET Die in Wafer Form l l D 100% Tested at Probe Available in Chip Pack, Unsawn wafer, Sawn on Film G Key Electrical Characteristics (TO-274 pac
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IRFC3810 IRFC3810B