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DSAUTAZ0017567.pdf
by Xilinx
Partial File Text
DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package T
Datasheet Type
Original
RoHS
Unknown
Pb Free
Unknown
Lifecycle
Unknown
Price & Stock
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User Tagged Keywords
ak 957
BGA 31 x 31 mm
flip chip bga 0,8 mm
jedec MS-026-A
mo 83
MO-047
MO-113-AA-AD
MO-151 AAL-1
MO-151-AAJ-1
MO-151-AAN-1
MO-151-BAU
MO-83-AH
mo151
MS-034 1152 BGA
MS-034 AAF-1
MS-034 AAL-1
MS-034-AAn-1
MS-034-AAU-1
MS026-ACD
OBG0009
OBG0036
OPD0002
OPQ0010
OPQ0014
PGA package weight