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    DSA00367626.pdf

    • Infineon Technologies
    • Power Amplifier for Bluetooth, Home RF and WLAN applications 1 Solder Bump 2 Under Bump Metallization 3 4 2 3 4 Chip Passivation 5 GaAs 5 Products Technology
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    • Part pricing, stock, data attributes from Findchips.com

    DSA00367626.pdf preview Download Datasheet

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    CGB240 CGY196 CGY63 InGaP HBT SCT-598 T628B TSSOP-10 TSSOP10 tSSOP10 Package
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