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    DSAUD0067215.pdf by Fujitsu

    • ASIC Technology Brief Ball Grid Array (BGA) Packages SEPTEMBER 1995 Fujitsu, a world leader in packaging and interconnect technology now offers Ball Grid Array (BGA) packaging options in both ou
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    BGA 256 PACKAGE power dissipation BGA-256 BGA-576 BGA256 BGA256 fujitsu bga256 power dissipation BGA352 BGA416 BGA576 CE-5-12 CE51364 CE51484 CE51654 CG5111 CG51114 CG51284 CG51364 LSI 2603 micron 100 ball BGA QFP PACKAGE thermal resistance QFP PACKAGE thermal resistance die down sieben
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