DSA0086043.pdf by Intel

Partial File Text 13 Pinned Packaging 13.1 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed
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A719-0 a7190 A7190-01 A7646-01 A7647 A7647-01 BGA PACKAGE TOP MARK intel outline of the heat sink for Theta JC socket 615-PIN socket s1 REFLOW

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