DSAQ00374130.pdf by t-Global Technology

Partial File Text H48-2K Thermal Conductive Pad Features No carrier Low contact thermal impedance Non-Oil Blead High dielectric breakdown voltage Applications Electronic components: IC / CPU / MOS LED / M/B / P/S
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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ASTM D2240 ASTM D412 ASTM D5470 D2240

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