This site uses third-party website tracking technologies to provide and continually improve our services, and to display advertisements according to users' interests. I agree and may revoke or change my consent at any time with effect for the future.
Taping and Packing
1 1.1
Taping of chip capacitors Blister tape (taping in accordance with IEC 286-3)
Section AA
Direction of unreeling
Dimensions (mm) A0 × B0 K0 T2 D0 D1 P0 P2 P1 W E
