DSA00260098.pdf by STATS ChipPAC

Partial File Text FBGA Fine Pitch Ball Grid Array · Array molded, cost effective, space saving package solution · Available in 1.40mm (LFBGA), 1.20mm (TFBGA), and 1.00mm (VFBGA), 0.80mm (WFBGA) and 0.55mm (UFBGA
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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AN 7823 JESD51-2 JESD51-9 lfbga Encapsulation thermal resistance tfBGA PACKAGE thermal resistance TRAY 15X15 tray vfbga VFBGA package tray vFBGA* 96 bALL WFBGA

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