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    DSA00505760.pdf

    • National Semiconductor
    • Plastic Package Moisture-Induced Cracking Introduction Problem Summary With the older "through-hole" technology packages such as the Dual In-line Package (DIP), soldering to printed circuit b
    • Original
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    DSA00505760.pdf preview Download Datasheet

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    J-STD-033B JEDEC J-STD-033b LEAD FRAME SURFACE MOUNT MIL-B-81705 MIL-D-3464 MIL-D-3464 type 1 MIL-D-3464 type 1 and 2 MIL-D-3464 type 2 MILD-3464 QFP JEDEC tray
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