dram zip
Abstract: Z03 Series AK14Z-N AK16Z-N AK16Z-W AK20Z-N AK20Z-W AK24Z-W AK28Z-W
Text: Accutek Microcircuit Corporation ZIP Adapter Modules DESCRIPTION FEATURES The Accutek family of ZIP Adapter Modules is designed to convert any digital integrated circuit in SOIC package to side-mounted ZIP modules. The Accutek ZIP Modules can be used to save space on thru-hole boards or replace
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AK5464Z
AK20Z-SOJ
AK20Z-QSOP-WPC
AK20ZD-SOIC-WPC
AK20Z-SOIC-WPC
dram zip
Z03 Series
AK14Z-N
AK16Z-N
AK16Z-W
AK20Z-N
AK20Z-W
AK24Z-W
AK28Z-W
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Untitled
Abstract: No abstract text available
Text: ZIP Adapter Modules ACCUTEK MICROCIRCUIT CORPORATION DESCRIPTION FEATURES The Accutek family of ZIP Adapter Modules is designed to convert any digital integrated circuit in SOIC package to side-mounted ZIP modules. The Accutek ZIP Modules can be used to save space on thru-hole boards or replace
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AK20ZD-QSOP-WPC
AK20Z-QSOP-WPC
AK5464Z
AK20Z-SOJ
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AK14Z-N
Abstract: AK16Z-N AK16Z-W AK20Z-N AK20Z-QSOP AK20Z-QSOP-LH AK20Z-QSOP-WPC AK20Z-SOIC-WPC AK20Z-SOJ AK20Z-W
Text: ACCUTEK ZIP Adapter Modules MICROCIRCUIT CORPORATION DESCRIPTION FEATURES The Accutek family of ZIP Adapter Modules is designed to convert any digital integrated circuit in SOIC package to side-mounted ZIP modules. The Accutek ZIP Modules can be used to save space on thru-hole boards or replace
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AK5464Z
AK20Z-SOJ
AK20Z-QSOP-WPC
AK20ZD-SOIC-WPC
AK20Z-SOIC-WPC
AK14Z-N
AK16Z-N
AK16Z-W
AK20Z-N
AK20Z-QSOP
AK20Z-QSOP-LH
AK20Z-QSOP-WPC
AK20Z-SOIC-WPC
AK20Z-SOJ
AK20Z-W
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footprint soic
Abstract: AN-06 FCT244A
Text: AN-06: ZIP Packages for Logic Q ZIP Packages for Logic Provide High-Density and High-Speed Application Note AN-06 ZIP packages for high-speed logic such as the FCT family provide high packing density in a through-hole package coupled with superior speed and ground bounce performance. ZIP packages provide density
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AN-06:
AN-06
FCT244A
AN-01
MAPN-00006-00
footprint soic
AN-06
FCT244A
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LH64256CZ70
Abstract: No abstract text available
Text: DRAM Dynamic RAM Random Access Memory ZIP LH64256CZ70 CMOS 1M 256K x 4
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LH64256CZ70
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20 pin socket zip dip
Abstract: amp zip socket 28
Text: Series 539 ZIP-DRAM to .300 [.76] DIP Adapter FEATURES: • Convert existing ZIP-DRAM device to .300 [.76] center DIP socket. • Designed especially to convert Mitsubishi, Fujitsu, etc., Dynamic RAMS. SPECIFICATIONS: • PCB is black FR-4, .062 [1.56] thick, with 1 ounce Copper traces
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C36000
ASTM-B16-85.
MIL-P-81728
QQ-N-290.
C17200
ASTM-B19RMATION
20 pin socket zip dip
amp zip socket 28
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Untitled
Abstract: No abstract text available
Text: Series 539 ZIP-DRAM to .300 [.76] DIP Adapter FEATURES: • Convert existing ZIP-DRAM device to .300 [.76] center DIP socket. • Designed especially to convert Mitsubishi, Fujitsu, etc., Dynamic RAMS. SPECIFICATIONS: • PCB is black FR-4, .062 [1.56] thick, with 1 ounce Copper
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C36000
ASTM-B16-85.
MIL-P-81728
QQ-N-290.
C17200
ASTM-B19
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AK62464
Abstract: AK62464Z
Text: Accutek Microcircuit Corporation AK62464Z 65,536 x 24 Bit CMOS/BiCMOS Static Random Access Memory DESCRIPTION 64-Pin ZIP The Accutek AK62464 SRAM Module consists of fast high performance SRAMs mounted on a low profile, 64 pin ZIP Board. The module utilizes four 28 pin 64K x 4 SRAMs in 300 mil SOJ packages
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AK62464Z
64-Pin
AK62464
-450C
AK62464Z
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AK62464
Abstract: AK62464Z
Text: Accutek Microcircuit Corporation AK62464Z 65,536 x 24 Bit CMOS/BiCMOS Static Random Access Memory DESCRIPTION 64-Pin ZIP The Accutek AK62464 SRAM Module consists of fast high performance SRAMs mounted on a low profile, 64 pin ZIP Board. The module utilizes four 28 pin 64K x 4 SRAMs in 300 mil SOJ packages
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AK62464Z
64-Pin
AK62464
-550C
1250C)
-450C
AK62464Z
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AK62464
Abstract: AK62464Z
Text: Accutek Microcircuit Corporation AK62464Z 65,536 x 24 Bit CMOS/BiCMOS Static Random Access Memory DESCRIPTION 64-Pin ZIP The Accutek AK62464 SRAM Module consists of fast high performance SRAMs mounted on a low profile, 64 pin ZIP Board. The module utilizes six 28 pin 64K x 4 SRAMs in 300 mil SOJ packages
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AK62464Z
64-Pin
AK62464
-550C
1250C)
-450C
AK62464Z
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Untitled
Abstract: No abstract text available
Text: AK62464Z 65,536 x 24 Bit CMOS/BiCMOS Static Random Access Memory ACCUTEK MICROCIRCUIT CORPORATION 64-Pin ZIP DESCRIPTION Front View The Accutek AK62464 SRAM Module consists of fast high performance SRAMs mounted on a low profile, 64 pin ZIP Board. The module utilizes six 28 pin 64K x 4 SRAMs in 300 mil SOJ packages
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AK62464Z
64-Pin
AK62464
-550C
1250C)
-450C
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AK62464Z
Abstract: No abstract text available
Text: AK62464Z 65,536 x 24 Bit CMOS/BiCMOS Static Random Access Memory ACCUTEK MICROCIRCUIT CORPORATION 64-Pin ZIP DESCRIPTION Front View The Accutek AK62464 SRAM Module consists of fast high performance SRAMs mounted on a low profile, 64 pin ZIP Board. The module utilizes six 28 pin 64K x 4 SRAMs in 300 mil SOJ packages
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AK62464Z
64-Pin
AK62464
-550C
1250C)
-450C
AK62464Z
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DRAMs
Abstract: MSM5416258A MSM5432126 MSM54V32126 oki Package SOJ msm51v17405b MSM54 TSOP300 msm514260c
Text: OKI Semiconductor DRAMs 1-Meg DRAMs 5 V Part Number Description Organization Pins / Package Access Time Max (ns) MSM511664B-xx Fast page 64K x 16 40 / DIP 70, 80 MSM514256C-xx Fast page 256K x 4 60, 70, 80 MSM514256CL-xx Fast page, low-power 20 / DIP, ZIP
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MSM511664B-xx
MSM514256C-xx
MSM514256CL-xx
MSM511000C-xx
MSM51100CL-xx
MSM54V32126
MSM5432126
16-Meg
MSM5116160A-xx
MSM5116165A-xx
DRAMs
MSM5416258A
MSM5432126
MSM54V32126
oki Package SOJ
msm51v17405b
MSM54
TSOP300
msm514260c
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AK631024
Abstract: AK6321024W AK6321024Z A1658
Text: DESCRIPTION Accutek Microcircuit Corporation AK6321024W / AK6321024Z 1,048,576 x 32 Bit CMOS/BiCMOS Static Random Access Memory Front View The Accutek AK631024 SRAM Module consists of fast high performance SRAMs mounted on a low profile, 72 pin SIM or ZIP PCB.
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AK6321024W
AK6321024Z
AK631024
72-Pin
15nSEC
30nSEC
AK6321024Z
A1658
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AK6321024W
Abstract: AK6321024Z
Text: AK6321024W / AK6321024Z 1,048,576 x 32 Bit CMOS/BiCMOS Static Random Access Memory ACCUTEK MICROCIRCUIT CORPORATION DESCRIPTION Front View The Accutek AK631024 SRAM Module consists of fast high performance SRAMs mounted on a low profile, 72 pin SIM or ZIP PCB.
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AK6321024W
AK6321024Z
AK631024
72-Pin
15nSEC
30nSEC
AK6321024W-15
AK6321024Z-17
AK6321024Z
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AK631024
Abstract: AK6321024W AK6321024Z AK63232 AK63264 A1757
Text: DESCRIPTION Accutek Microcircuit Corporation AK6321024W / AK6321024Z 1,048,576 x 32 Bit CMOS/BiCMOS Static Random Access Memory Front View The Accutek AK631024 SRAM Module consists of fast high performance SRAMs mounted on a low profile, 72 pin SIM or ZIP PCB.
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AK6321024W
AK6321024Z
AK631024
72-Pin
15nSEC
30nSEC
AK6321024Z
AK63232
AK63264
A1757
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Untitled
Abstract: No abstract text available
Text: Series 539 ZIP-DRAM to .300 [.76] DIP Adapter FEATURES: •Convert existing ZIP-DRAM device to .300 [.76] center DIP socket. •Designed especially to convert Mitsubishi, Fujitsu, etc., Dynamic RAMS. SPECIFICATIONS: •PCB is black FR-4, .062 [1.56] thick, with 1 ounce
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QQ-B-626.
MIL-T10727
QQ-N-290.
MIL-T-10727
QQ-C-533.
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Untitled
Abstract: No abstract text available
Text: M T4C4003J lEG X 4 DRAM M IC R O N 1 MEG DRAM X 4 DRAM DRAM STATIC COLUMN FEATURES PIN ASSIGNMENT (Top View OPTIONS 20-Pin ZIP (DC-1) (DB-2) DQ1 DQ2 WE RAS A9 MARKING • Timing 70ns access 80ns access • Packages Plastic SOJ (300 mil) Plastic ZIP (350 mil)
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T4C4003J
024-cycle
20/26-Pin
20-Pin
MT4C4003J
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Untitled
Abstract: No abstract text available
Text: MICRON TECHNOLOGY INC ' IME D B b i l l 5 Mi ÒaOOfl'H 2 PRELIMINARY T - y ¿ - 2 3 -1 5 4 MEG X 1 DRAM DRAM FAST PAGE MODE FEATURES OPTIONS 20 Pin DIP p[ • Packages Plastic DIP Ceramic DIP Plastic ZIP Plastic SOJ - A2Ü7 A3 [8 Vcc [9 8 20 Pin ZIP A9 18 ]Vss
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175mW
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jedec bottom
Abstract: No abstract text available
Text: AK62464Z 65,536 x 24 Bit CMOS/BiCMOS Static Random Access Memory MICROCIRCUIT CORPORATION DESCRIPTION 64-Pin ZIP The Accutek AK62464 SRAM Module consists of fast high perfor mance SRAMs mounted on a low profile, 64 pin ZIP Board. The module utilizes four 28 pin 64K x 4 SRAMs in 300 mil SOJ packages
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AK62464
20nSEC
AK62464Z-12
jedec bottom
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Untitled
Abstract: No abstract text available
Text: S ockets HIGH DENSITY ZIP Sockets ICZ Series * Zig-zag pattern allows higher board density than standard DIP sockets * Low profile allows tighter board-to-board spacing * Precision screw machine sockets provide high reliability and retention * Designed specifically for DRAM memory
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orTG30
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Untitled
Abstract: No abstract text available
Text: HIGH DENSITY ZIP Sockets ICZ Series * Zig-zag pattern allows higher board density than standard DIP sockets 9 Low profile allows tighter board-to-board spacing 9 Precision screw machine sockets provide high reliability and retention 9 Designed specifically for DRAM memory
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MARK W1 TSOP
Abstract: weight of SOP 16 package MSM548332 weight of SOP package
Text: O K I Semiconductor Packaging Multiport DRAM Products Packaging OKU Semiconductor Packaging Field Memory Products Package Name MSM514212 No. of Pins zs GS TS TS JS DIP ZIP SOP TSOP Typen TQFP SOJ O 28 r '\ 16 MSM514221B RS r o 20 O 26/20 o 16 MSM514222B o
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MSM514212
MSM514221B
MSM514222B
MSM514223B
MSM518221
MSM518222
MSM5412222
MSM548333
MSM548332
MSM548331
MARK W1 TSOP
weight of SOP 16 package
weight of SOP package
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Untitled
Abstract: No abstract text available
Text: Number Guide SIEM ENS Memory Components Memory Components 1 M & 4 M DRAMS HYB 51 xxxx B J L - 60 ! ¡ ¡ Speed 50 60 70 80 = = = = Power L = low power = standard Package J Z T 50 60 70 80 ns ns ns ns = DIP =SOJ = ZIP = TSOP Design Revision Sem iconductor Group
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