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    X 13 V Search Results

    X 13 V Result Highlights (2)

    Part ECAD Model Manufacturer Description Download Buy
    TPS2300IPW Texas Instruments 3-13V Dual HotSwap IC w/ Independent Channel Circuit Breaking & Power Good Report, Act-Low Enable 20-TSSOP -40 to 85 Visit Texas Instruments Buy
    TPS2310IPW Texas Instruments 3-13V Dual HotSwap IC w/ Inter-dependent Channel Circuit Breaking & Pwr Good Report, Act-Low Enable 20-TSSOP -40 to 85 Visit Texas Instruments Buy
    SF Impression Pixel

    X 13 V Price and Stock

    Panduit Corp STP6X13VL

    COPPER PATCH CORD, CAT 6A, VIOLE
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    DigiKey STP6X13VL Bulk 10
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    Avnet Americas STP6X13VL Bulk 8 Weeks 10
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    Newark STP6X13VL Bulk 10
    • 1 $44.9
    • 10 $44.9
    • 100 $36.96
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    Sager STP6X13VL 1
    • 1 $45.94
    • 10 $41.47
    • 100 $36.86
    • 1000 $36.41
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    Panduit Corp UTP6AX13VL

    CABLE MOD 8P8C PLUG TO PLUG 13'
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    DigiKey UTP6AX13VL Bulk 10
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    Avnet Americas UTP6AX13VL Bulk 8 Weeks 10
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    Sager UTP6AX13VL 1
    • 1 $40.13
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    • 100 $30.72
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    Panduit Corp UTP28X13VL

    CAT 6A 28AWG UTP PATCH CORD, CM/
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    Newark UTP28X13VL Bulk 10
    • 1 $36.66
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    Sager UTP28X13VL 1
    • 1 $39.33
    • 10 $33.86
    • 100 $30.1
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    Panduit Corp STP6X13VL-Q

    COPPER PATCH CORD, CAT 6A, VIOLE
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    Renesas Electronics Corporation DF3067RVX13V

    IC MCU 16BIT 128KB FLASH 100QFP
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    DigiKey DF3067RVX13V Tray
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    Avnet Americas DF3067RVX13V Bulk 4 Weeks 12
    • 1 $31.55
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    Rochester Electronics DF3067RVX13V 1,945 1
    • 1 $31.55
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    Find more X 13 V price and stock on Findchips.com

    X 13 V Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Low Voltage Supplementary Fuses 13 ⁄32” x 13⁄8” Fast-acting fuses BBS KTQ Specifications Class: Supplemental Description: Fast-acting supplementary fuse. Dimensions: 13⁄32” x 13⁄8” 10.3 x 34.9mm . Construction: Fiber cartridge. Ratings: Volts — 600Vac (1⁄10-5A)


    Original     		PDF 600Vac 250Vac 48Vac 2-30A) 0-30A A/600V, E19180, 600Vac)

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 5, 06/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


    Original     		PDF IMX50CEC MCIMX50

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 6, 08/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


    Original     		PDF IMX50CEC MCIMX50

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 3, 11/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


    Original     		PDF IMX50CEC MCIMX50

    samsung eMMC 4.5

    Abstract: eMMC 4.51 Samsung eMMC 4.41 emmc 4.5 spec Samsung eMMC 4.51 emmc 4.41 spec eMMC PoP samsung lpddr2 153 ball eMMC memory 0.8 emmc spec samsung
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


    Original     		PDF IMX50CEC MCIMX50 samsung eMMC 4.5 eMMC 4.51 Samsung eMMC 4.41 emmc 4.5 spec Samsung eMMC 4.51 emmc 4.41 spec eMMC PoP samsung lpddr2 153 ball eMMC memory 0.8 emmc spec samsung

    Samsung eMMC 4.51

    Abstract: samsung eMMC 4.5
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


    Original     		PDF IMX50CEC MCIMX50 Samsung eMMC 4.51 samsung eMMC 4.5

    samsung eMMC 4.5

    Abstract: Samsung eMMC 4.41 lpddr2 emmc emmc 4.41 spec emmc 4.5 spec 153 ball eMMC memory Samsung eMMC 4.51 samsung* lpddr2* pop package emmc Pin assignment eMMC 4.4
    Text: Freescale Semiconductor Data Sheet: Advanced Information Document Number: IMX50CEC Rev. 2, 04/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


    Original     		PDF IMX50CEC MCIMX50 samsung eMMC 4.5 Samsung eMMC 4.41 lpddr2 emmc emmc 4.41 spec emmc 4.5 spec 153 ball eMMC memory Samsung eMMC 4.51 samsung* lpddr2* pop package emmc Pin assignment eMMC 4.4

    samsung eMMC 4.5

    Abstract: emmc 4.4 standard jedec Samsung eMMC 4.41 153 ball eMMC memory emmc 4.5 spec emmc spec emmc 4.41 spec 50 50 mfd CAPACITOR USB_OTG Samsung eMMC 4.51
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 4, 1/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


    Original     		PDF IMX50CEC MCIMX50 samsung eMMC 4.5 emmc 4.4 standard jedec Samsung eMMC 4.41 153 ball eMMC memory emmc 4.5 spec emmc spec emmc 4.41 spec 50 50 mfd CAPACITOR USB_OTG Samsung eMMC 4.51

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 7, 10/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


    Original     		PDF IMX50CEC MCIMX50

    spec RG-179

    Abstract: spec RG-178 59 8483 042
    Text: Style M Connectors Board Layouts STYLE 1/2 M 48.3 1.902 7.62 (0.300) 13 x 2.54 = 33.02 (13 x 0.100 = 1.300) 7.62 (0.300) 7.62 (0.300) 12 x ø1.00 (12 x ø0.039) 2.54 (0.100) 2 x ø2.80 (2 x ø0.110) c 5.08 (0.200) b a 5.30 (0.209) 16 15 14 13 12 11 10 9 8


    Original     		PDF

    20 8484 024 001 025

    Abstract: No abstract text available
    Text: Style M Connectors Board Layouts STYLE 1/2 M 48.3 1.902 7.62 (0.300) 13 x 2.54 = 33.02 (13 x 0.100 = 1.300) 7.62 (0.300) 7.62 (0.300) 12 x ø1.00 (12 x ø0.039) 2.54 (0.100) 2 x ø2.80 (2 x ø0.110) c 5.08 (0.200) b a 5.30 (0.209) 16 15 14 13 12 11 10 9 8


    Original     		PDF

    Fuse 250V 2A G20

    Abstract: weidmuller fuse 1.6A fuse 5AF10
    Text: Fuse terminals 10 mm2 KSKM 1 10 mm2 KSKM 2 5 x 20 1 x 1/4 13 x 69 x 63 6.3 / 16 0.33 . 16 13 x 69 x 63 13 / 16 0.33 . 16 TS 32 / PA TS 32 / PA When using ATEX certified components in hazardous area applications the installation instructions and the rated data for


    Original     		PDF 20/1A/F 20/2A/F Fuse 250V 2A G20 weidmuller fuse 1.6A fuse 5AF10

    Untitled

    Abstract: No abstract text available
    Text: Low Voltage Supplementary Fuses 13 ⁄32” x 11⁄2” Time-delay fuses FNQ Specifications Class: Supplemental Description: Time-delay supplementary fuse. Dimensions: 13⁄32” x 11⁄2” 10.3 x 38.1mm . Construction: Fiber tube. Ratings: Volts — 250Vac (or less)


    Original     		PDF 250Vac 0-30A 250Vac) 0-15A 125Vac) 32Vac) 2-30A

    Weidmuller TS35x7.5

    Abstract: Fuse 0430900000 0430700000 04-4630 043050 5AF10
    Text: Fuse terminals 10 mm2 KSKM 1 10 mm2 KSKM 2 5 x 20 1 x 1/4 13 x 69 x 63 6.3 / 16 0.33 . 16 13 x 69 x 63 13 / 16 0.33 . 16 TS 35 / PA TS 35 / PA When using ATEX certified components in hazardous area ap- A plications the installation instructions and the rated data for


    Original     		PDF TS35x7 SBL/2489 20/2A/F 20/1A/F Weidmuller TS35x7.5 Fuse 0430900000 0430700000 04-4630 043050 5AF10

    Untitled

    Abstract: No abstract text available
    Text: 2.54 A Male headers soldering technique  0,635 mm, Sandwich B 2,54 3,3 2,8 L S = 6 mm C A 2,8 n x 2,54 2,5 11 S n - 1 x 2,54 0,635 art. no. D 13 13 13 13 13 071 097 122 147 187 . . . . . A 7.10 9.70 12.20 14.70 18.70 art. no. L 21.40 24.00 26.50


    Original     		PDF

    RDJ11

    Abstract: FU633 of blown fuse indicator BJS131 FEM13U TH91 56102 PR30 0168 013.10
    Text: T01089 020128 MU 10/13.SF2 Fuse holder terminal blocks for 6,35 x 25,4 mm 1/4 x 1 in. and 6,35 x 32 mm 1/4 x 1 1/4 in. fuses Compression clamp MU 10/14,5.SF2 Spacing 13 mm .512" Spacing 14,5 mm (.571") 13 mm block for blown fuse indicator (to be ordered separately).


    Original     		PDF T01089 RDJ11 FU633 of blown fuse indicator BJS131 FEM13U TH91 56102 PR30 0168 013.10

    Hynix 128Gb Nand flash

    Abstract: Hynix 64Gb Nand flash nand flash HYNIX MLC 128GB Nand flash hynix Hynix 32Gb Nand flash hynix MLC nand flash 64gb nand flash hynix hynix nand flash 1.8v 4Gb hynix nand flash 4Gb Hynix E NAND
    Text: Last Updated: Nov. 2006 NAND Flash PART NUMBERING HY XX X X XX XX X X - X X (X) (X) (X) (1) (2) (3) (4) (5) (6) (7) (8) (9) (10) (11) (13) (12) (1) HYNIX MEMORY (13) OPTION(CUSTOMER) (2) COMPONENT GROUP 27 Customer Initial Option : NAND Flash (12) BAD BLOCK


    Original     		PDF 63ball) 107ball) 149ball) Hynix 128Gb Nand flash Hynix 64Gb Nand flash nand flash HYNIX MLC 128GB Nand flash hynix Hynix 32Gb Nand flash hynix MLC nand flash 64gb nand flash hynix hynix nand flash 1.8v 4Gb hynix nand flash 4Gb Hynix E NAND

    CCD143A

    Abstract: No abstract text available
    Text: Linear Image Sensor Selection Guide CCD Device Maximum Number Pixel Size Pixel Pitch Data Rate of Pixels pm (MHz) 0*m) CCD111 256 13 x 17 13 10.0 CCD112- 256 13 x 17 13 10.0 CCD153A 512 13 x 13 13 20.0 CCD133A 1024 13 x 13 13 20.0 CCD134 1024 13 x 13 13


    OCR Scan     		PDF CCD111 CCD123 CCD145 CCD143A CCD181 CCD182 CCD151 CCD191 CCD192 CCD134 CCD143A

    8613 series

    Abstract: u254 MALE CONNECTOR OF 8613 8613 HE-10 connector HE10 he10 SOCKET 26 contacts connector 2.54 MIL-c-83503 50810
    Text: '" - v - 8613 Box headers Dimensions Card drilling 13:X=4.20±0.35 23:X=2.80±0*2 ANGLED SPILL 13 & 23 14 : X = 4.35 ± 0.35 24:X=2.90±0.2 -*•’ *«-2.54 15:X=15.5±0.35 C 17.91 22.99 25.53 30.61 36.23 43.31 48.39 56.01 68.71 81.41 86.49 [B] 10.16 15.24


    OCR Scan     		PDF 27-Jt> 3M37Tb6 0G03341 8613 series u254 MALE CONNECTOR OF 8613 8613 HE-10 connector HE10 he10 SOCKET 26 contacts connector 2.54 MIL-c-83503 50810

    BXY10

    Abstract: BXY13D BXY10C Z6 DIODE BXY13 BXY11 BXY10D BXY11E BXY13C DIODE G06
    Text: B X Y 10 C, 10 D, 11 E, 13 C, 13 D, 14 E Charge storage varactors for frequency multiplication Epitaxial silicon mesa diodes in a ceramic microwave case T yp e B X Y 10 C BXY10D BXY11E BXY13C B X Y 13 D B X Y 14 E T h e rm a l r e s is t a n c e Junction to case


    OCR Scan     		PDF BXY10 BXY10C BXY10D BXY11E BXY13C BXY13 BXY14 Q60223-Y10-C Q60223-Y10-D Q60223-Y11 BXY13D Z6 DIODE BXY11 DIODE G06

    Untitled

    Abstract: No abstract text available
    Text: IBM0325404 IBM0325804 IBM0325164 IBM03254B4 256Mb Synchronous DRAM - Die Revision A APPLICATION SPEC # 29L0000.E36980 Engineering Change Number 13 ROW /1 1 COL / 2 BS 16Mb x 4 I/O x 4 Bank 13 ROW /1 0 COL / 2 BS (8Mb x 8 I/O x 4 Bank) Date E36980 13 ROW / 9 COL / 2 BS (4Mb x 16 I/O x 4 Bank)


    OCR Scan     		PDF IBM0325404 IBM0325804 IBM0325164 IBM03254B4 256Mb 29L0000 E36980 IBM0325404CT3A-260 29L6113

    CM508

    Abstract: Z0904
    Text: X Kontaktanordnung contact I 32 E i n l ö t - K o n t a k t e 32 s o l d e r - c o n t a c t s arrangement 32 28 30 24 26 20 22 16 18 12 U 8 10 6 2 13 13 13 13 13 13 13 13 13 13 13 13 13 13 H o o B 1 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 ? Bl solder-contac t


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: X Kontaktanordnung contact Z 2: 1 32 E in l ö t - K o n t a k t e 32 s o l d e r - c o n t a c t s arrangement 32 28 30 24 26 20 22 16 18 12 U 8 10 4 6 2 Bl solder-contac t _ a 13 13 13 13 13 13 13 13 13 13 13 13 13 13 H o o B 1 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 ?


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: 5 X K o n t a k t a n o r d n u n g / contact arrangement 15 Kontakte 15 contacts 32 28 24 20 16 12 8 4 I 30 | 26 | 22 | 18 | U | 10 | 6 | IX I IX I X I X X I X X IX I ^1IX 13^ X 13^1 X I 13 X L ochbi I d / board drillings 32 I 7x 10,16 4 4 — d I (=71,12)


    OCR Scan     		PDF D-32339