WLCSP66
Abstract: PI0297 EIA-481-C EIA 481-C WLCSP64 WLCSP underfill WLCSP stencil design comintec onyx32 smd code marking wlcsp 9
Text: PI0297 Package Information Description of WLCSP for microcontrollers and recommendations for use Introduction This document describes the WLCSP wafer level chip size package , and provides recommendation on how to use it. Only WLCSP for microcontrollers are described herein.
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PI0297
WLCSP66
PI0297
EIA-481-C
EIA 481-C
WLCSP64
WLCSP
underfill
WLCSP stencil design
comintec onyx32
smd code marking wlcsp 9
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WLCSP stencil design
Abstract: PI0297 JESD22-B101 wlcsp inspection WLCSP66 onyx EIA 763 st micro trace date code
Text: PI0297 Package Information Description of WLCSP for microcontrollers and recommendations for use Introduction This document describes the WLCSP wafer level chip size package , and provides recommendation on how to use it. Only WLCSP for microcontrollers are described herein.
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PI0297
WLCSP stencil design
JESD22-B101
wlcsp inspection
WLCSP66
onyx
EIA 763
st micro trace date code
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WLCSP smt
Abstract: EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition
Text: AN69061 Design, Manufacturing, and Handling Guidelines for Cypress Wafer-Level Chip Scale Packages WLCSP Author: Wynces Silvoza, Bo Chang Associated Project: No Associated Part Family: All Cypress WLCSP products Software Version: None Associated Application Notes: None
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AN69061
AN69061
WLCSP smt
EIA-481-D-2008
Cu OSP and Cu SOP
qfn tray pocket size 5 x 6
SUF1577-15
WLCSP stencil design
without underfill
SAC396
cte table flip chip substrate
SAC 2.3 Ag bump composition
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201676B
Abstract: No abstract text available
Text: APPLICATION NOTE Wafer Level Chip Scale Packages: SMT Process Guidelines and Handling Considerations Introduction The Skyworks Wafer Level Chip Scale Package WLCSP is a bumped die solution that can be used for in-module and/or standalone applications. WLCSP packaging technology is applied
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201676B
201676B
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amkor RDL
Abstract: amkor flip FCCSP JEDEC tray standard amkor Sip
Text: data sheet wafer level packaging CSPnl Features: CSPnl DSBGA / WLCSP / WSCSP / WLP Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the
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IPC-6011
Abstract: IPC-D-279 IPC-6013 ipc 7094 IPC-6012 IPC-2223 IPC 6012 IPC-6016 IPC-2221 IPC-2222
Text: Maxim > App Notes > General Engineering Topics Prototyping and PC-Board Layout Wireless, RF, and Cable Keywords: chip scale package, flip chip, CSP, UCSP, U-CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-Level Packaging WLP and Its Applications
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1000x
com/an1891
AN1891,
APP1891,
Appnote1891,
IPC-6011
IPC-D-279
IPC-6013
ipc 7094
IPC-6012
IPC-2223
IPC 6012
IPC-6016
IPC-2221
IPC-2222
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amkor flip
Abstract: wlcsp inspection amkor RDL amkor Sip dS721
Text: data sheet wafer level packaging CSPnl BOR CSPnl Bump on Repassivation BOR (DSBGA / WLCSP / WSCSP / WLP) Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the
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SAC266
Abstract: SAC405 J-STD-012 IPC-6012 BGA Solder Ball compressive force WLCSP stencil design IPC-6012A LATTICE SEMICONDUCTOR Tape and Reel Specification IPC-4101 IPC-7525
Text: Application Note 71 Design and Manufacturing with Summit Microelectronic’s WLCSP Products Introduction Per the IPC/JEDEC J-STD-012 definition, a CSP is a single-die, direct surface mountable package with an area of no more than 1.2 times the original die area.
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J-STD-012
SAC266
SAC405
IPC-6012
BGA Solder Ball compressive force
WLCSP stencil design
IPC-6012A
LATTICE SEMICONDUCTOR Tape and Reel Specification
IPC-4101
IPC-7525
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CSPNL
Abstract: amkor RDL wafer map format amkor amkor flip amkor Sip amkor polyimide FCCSP wafer map
Text: data sheet wafer level packaging CSPnl RDL Features: Packaging CSPnl Bump on Redistribution RDL (DSBGA / WLCSP / WSCSP / WLP) Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the
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SA58672TK
Abstract: SA58672UK SA58672 portable dvd player schematic diagram of video AUX0025 BLM21PG221SN1 HVSON10 MO-229 MPZ1608S221A ipod repair
Text: SA58672 3.0 W mono class-D audio amplifier Rev. 04 — 8 June 2009 Product data sheet 1. General description The SA58672 is a mono, filter-free class-D audio amplifier which is available in a 9 bump WLCSP Wafer Level Chip-Size Package and 10-terminal HVSON packages.
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SA58672
SA58672
10-terminal
SA58ns
SA58672TK
SA58672UK
portable dvd player schematic diagram of video
AUX0025
BLM21PG221SN1
HVSON10
MO-229
MPZ1608S221A
ipod repair
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WLCSP flip chip
Abstract: WLCSP smt 0.3mm pitch csp package wlcsp inspection WLCSP chip mount WLCSP PBO design amkor flip amkor RDL amkor polyimide system in package WLCSP underfill
Text: data sheet wafer level packaging WLCSP Features • 4 - 196 ball count • 0.8 mm – 6.5 mm body size • Repassivation, Redistribution and Bumping options available • Electroplated and Ball-loaded bumping options • Eutectic and Lead-free solder • Standard JEDEC / EIAJ pitches and CSP solder ball diameters
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Untitled
Abstract: No abstract text available
Text: TFA9882 3.4 W I2S input mono class-D audio amplifier Rev. 1 — 31 March 2011 Preliminary data sheet 1. General description The TFA9882 is a mono, filter-free class-D audio amplifier in a 9-bump WLCSP Wafer Level Chip-Size Package with a 400 m pitch.
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TFA9882
TFA9882
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Untitled
Abstract: No abstract text available
Text: SA58672 3.0 W mono class-D audio amplifier Rev. 03 — 21 April 2009 Product data sheet 1. General description The SA58672 is a mono, filter-free class-D audio amplifier which is available in a 9 bump WLCSP Wafer Level Chip-Size Package and 10-terminal HVSON packages.
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SA58672
SA58672
10-terminal
prov26
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portable dvd player schematic diagram of video
Abstract: class d power amplifier SA58672TK AUX0025 BLM21PG221SN1 HVSON10 MO-229 MPZ1608S221A SA58672UK ipod repair
Text: SA58672 3.0 W mono class-D audio amplifier Rev. 02 — 23 February 2009 Product data sheet 1. General description The SA58672 is a mono, filter-free class-D audio amplifier which is available in a 9 bump WLCSP Wafer Level Chip-Size Package and 10-terminal HVSON packages.
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SA58672
SA58672
10-terminal
portable dvd player schematic diagram of video
class d power amplifier
SA58672TK
AUX0025
BLM21PG221SN1
HVSON10
MO-229
MPZ1608S221A
SA58672UK
ipod repair
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portable dvd player schematic diagram of video
Abstract: 5.1 Channel audio amplifier datasheet class d power amplifier pwm control of tec AUX0025 SA58671UK
Text: SA58671 1.2 W/channel stereo class-D audio amplifier Rev. 02 — 24 October 2008 Product data sheet 1. General description The SA58671 is a stereo, filter-free class-D audio amplifier which is available in a 16 bump WLCSP Wafer Level Chip-Size Package . The SA58671 features independent shutdown controls for each channel. The gain can be
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SA58671
SA58671
portable dvd player schematic diagram of video
5.1 Channel audio amplifier datasheet
class d power amplifier
pwm control of tec
AUX0025
SA58671UK
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IPC-6012
Abstract: IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525
Text: Maxim > App Notes > General Engineering Topics Prototyping and PC- Board Layout Wireless and RF Keywords: chip scale package, flip chip, CSP, UCSP, U- CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-level packaging WLP and its applications Abstract: This application note discusses Maxim's wafer-level package (WLP). Topics include: wafer construction, tape-and-reel
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1000x
com/an1891
AN1891,
APP1891,
Appnote1891,
IPC-6012
IPC-D-279
IPC-6013
IPC-6016
IPC-2223
ipc 7094
IPC-7094
IPC-2226
IPC-6011
IPC-7525
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HVSON10
Abstract: tfa9881 NXP pdm 1.1
Text: TFA9881 3.4 W PDM input class-D audio amplifier Rev. 2 — 1 April 2011 Product data sheet 1. General description The TFA9881 is a mono, filter-free class-D audio amplifier in a 9-bump WLCSP Wafer Level Chip-Size Package with a 400 m pitch. The digital input interface is an over-sampled Pulse Density Modulated (PDM) bit stream.
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TFA9881
TFA9881
HVSON10
NXP pdm 1.1
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TFA9882
Abstract: TFA9882UK HVSON10
Text: TFA9882 3.4 W I2S input mono class-D audio amplifier Rev. 2 — 20 April 2011 Product data sheet 1. General description The TFA9882 is a mono, filter-free class-D audio amplifier in a 9-bump WLCSP Wafer Level Chip-Size Package with a 400 m pitch. It receives audio and control settings via an I2S digital interface. The Power-down to
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TFA9882
TFA9882
TFA9882UK
HVSON10
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TFA9881UK
Abstract: TFA9881 NXP pdm 1.1 0x662
Text: TFA9881 3.4 W PDM input class-D audio amplifier Rev. 3 — 23 April 2013 Product data sheet 1. General description The TFA9881 is a mono, filter-free class-D audio amplifier in a 9-bump WLCSP Wafer Level Chip-Size Package with a 400 m pitch. The digital input interface is an over-sampled Pulse Density Modulated (PDM) bit stream.
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TFA9881
TFA9881
TFA9881UK
NXP pdm 1.1
0x662
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Untitled
Abstract: No abstract text available
Text: TFA9882 3.4 W I2S input mono class-D audio amplifier Rev. 2 — 20 April 2011 Product data sheet 1. General description The TFA9882 is a mono, filter-free class-D audio amplifier in a 9-bump WLCSP Wafer Level Chip-Size Package with a 400 m pitch. It receives audio and control settings via an I2S digital interface. The Power-down to
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TFA9882
TFA9882
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Untitled
Abstract: No abstract text available
Text: TFA9881 3.4 W PDM input class-D audio amplifier Rev. 2 — 1 April 2011 Product data sheet 1. General description The TFA9881 is a mono, filter-free class-D audio amplifier in a 9-bump WLCSP Wafer Level Chip-Size Package with a 400 m pitch. The digital input interface is an over-sampled Pulse Density Modulated (PDM) bit stream.
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TFA9881
TFA9881
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NXP pdm 1.1
Abstract: HVSON10 5STPD
Text: TFA9881 3.4 W PDM input class-D audio amplifier Rev. 1 — 5 January 2011 Preliminary data sheet 1. General description The TFA9881 is a mono, filter-free class-D audio amplifier in a 9-bump WLCSP Wafer Level Chip-Size Package with a 400 m pitch. The digital input interface is an over-sampled Pulse Density Modulated (PDM) bit stream.
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TFA9881
TFA9881
NXP pdm 1.1
HVSON10
5STPD
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TB451
Abstract: intersil standard part marking wlcsp inspection
Text: Technical Brief 451 PCB Assembly Guidelines for Intersil Wafer Level Chip Scale Package Devices Introduction SOLDER BALL: Sn/Ag/Cu There is an industry-wide trend towards using the smallest package possible for a given pin count. This is driven primarily by the handheld products market where the trend towards
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TB451
intersil standard part marking
wlcsp inspection
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ipc-cm-770
Abstract: WLCSP stencil design WLCSP smt X-RAY INSPECTION wlcsp inspection WLCSP chip mount intersil standard part marking WLCSP WLCSP chip attach key pad 3x4
Text: PCB Assembly Guidelines for Intersil Wafer Level Chip Scale Package Devices Technical Brief Introduction There is an industry-wide trend towards using the smallest package possible for a given pin-count. This is driven primarily by the handheld products market where the trend
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05mmx1
TB451
ipc-cm-770
WLCSP stencil design
WLCSP smt
X-RAY INSPECTION
wlcsp inspection
WLCSP chip mount
intersil standard part marking
WLCSP
WLCSP chip attach
key pad 3x4
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