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    WLCSP 5 Search Results

    WLCSP 5 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    ISL91302B22-EVZ Renesas Electronics Corporation ISL91302B Evaluation Board 1, 2+2 PMIC, WLCSP RoHS Compliant Visit Renesas Electronics Corporation
    ISL91302B40-EVZ Renesas Electronics Corporation ISL91302B Evaluation Board 1, 4+0 PMIC, WLCSP RoHS Compliant Visit Renesas Electronics Corporation
    ISL91302B31-EVZ Renesas Electronics Corporation ISL91302B Evaluation board 1, 3+1 PMIC, WLCSP RoHS compliant Visit Renesas Electronics Corporation
    ISL9123II4Z-T Renesas Electronics Corporation Ultra-Low IQ Buck Regulator with Bypass, WLCSP-BP, /Reel Visit Renesas Electronics Corporation
    ISL9123IINZ-T Renesas Electronics Corporation Ultra-Low IQ Buck Regulator with Bypass, WLCSP-BP, /Reel Visit Renesas Electronics Corporation
    SF Impression Pixel

    WLCSP 5 Price and Stock

    Nexperia PCMF1USB3SZ

    EMI Filter Circuits PCMF1USB3S/NAX000/NONE
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI PCMF1USB3SZ Reel 22,500 4,500
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    • 10000 $0.111
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    Nexperia PESD1USB3S/CZ

    ESD Protection Diodes / TVS Diodes PESD1USB3S/C/NAX000/NONE
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI PESD1USB3S/CZ Reel 9,000
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    • 10000 $0.097
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    Nexperia PESD1USB3B/CZ

    ESD Protection Diodes / TVS Diodes PESD1USB3B/C/NAX000/NONE
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI PESD1USB3B/CZ Reel 9,000
    • 1 -
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    • 10000 $0.097
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    Nexperia PESD1USB3SZ

    ESD Protection Diodes / TVS Diodes PESD1USB3S/NAX000/NONE
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI PESD1USB3SZ Reel 9,000
    • 1 -
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    • 10000 $0.101
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    Nexperia PCMF1HDMI14SZ

    ESD Protection Diodes / TVS Diodes PCMF1HDMI14S/NAX000/NONE
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI PCMF1HDMI14SZ Reel 9,000
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    Find more WLCSP 5 price and stock on Findchips.com

    WLCSP 5 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    WLCSP5 NXP Semiconductors Wafer level chip-size package; 5 bumps (2-1-2) Original PDF

    WLCSP 5 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    WR06X000

    Abstract: No abstract text available
    Text: iCE40 16-WLCSP Evaluation Kit User’s Guide February 2014 EB84_01.0 iCE40 16-WLCSP Evaluation Kit Introduction Thank you for choosing the Lattice iCE40TM 16-WLCSP Evaluation Kit. This guide describes how to begin using the iCE40 16-WLCSP Evaluation Kit, an easy-to-use platform for rapidly


    Original     		iCE40 16-WLCSP iCE40TM FT2232HL WR06X000 PDF

    WLCSP66

    Abstract: PI0297 EIA-481-C EIA 481-C WLCSP64 WLCSP underfill WLCSP stencil design comintec onyx32 smd code marking wlcsp 9
    Text: PI0297 Package Information Description of WLCSP for microcontrollers and recommendations for use Introduction This document describes the WLCSP wafer level chip size package , and provides recommendation on how to use it. Only WLCSP for microcontrollers are described herein.


    Original     		PI0297 WLCSP66 PI0297 EIA-481-C EIA 481-C WLCSP64 WLCSP underfill WLCSP stencil design comintec onyx32 smd code marking wlcsp 9 PDF

    WLCSP stencil design

    Abstract: PI0297 JESD22-B101 wlcsp inspection WLCSP66 onyx EIA 763 st micro trace date code
    Text: PI0297 Package Information Description of WLCSP for microcontrollers and recommendations for use Introduction This document describes the WLCSP wafer level chip size package , and provides recommendation on how to use it. Only WLCSP for microcontrollers are described herein.


    Original     		PI0297 WLCSP stencil design JESD22-B101 wlcsp inspection WLCSP66 onyx EIA 763 st micro trace date code PDF

    nxp Standard Marking

    Abstract: No abstract text available
    Text: R_10001 Guideline for the laser marking layout of WLCSP devices Rev. 01 — 10 February 2010 Report Document information Info Content Title R_10001 Short title 1 line R_10001 Subtitle Guideline for the laser marking layout of WLCSP devices Short subtitle (1 line) WLCSP marking guideline


    Original     		PDF

    567AS-01

    Abstract: No abstract text available
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP 48 CASE 567AS−01 ISSUE O DOCUMENT NUMBER: STATUS: 98AON35135E ON SEMICONDUCTOR STANDARD REFERENCE: Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 WLCSP 48, 3.8X2.6


    Original     		567AS-01 98AON35135E 567AS 567AS-01 PDF

    567AA

    Abstract: No abstract text available
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP 40, 3.8x2.3 CASE 567AA−01 ISSUE A DOCUMENT NUMBER: STATUS: 98AON31152E ON SEMICONDUCTOR STANDARD REFERENCE: Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 WLCSP 40, 3.8X2.3


    Original     		567AA-01 98AON31152E 567AA 567AA PDF

    WLCSP smt

    Abstract: EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition
    Text: AN69061 Design, Manufacturing, and Handling Guidelines for Cypress Wafer-Level Chip Scale Packages WLCSP Author: Wynces Silvoza, Bo Chang Associated Project: No Associated Part Family: All Cypress WLCSP products Software Version: None Associated Application Notes: None


    Original     		AN69061 AN69061 WLCSP smt EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition PDF

    Untitled

    Abstract: No abstract text available
    Text: R DiePlus Advantage iCE65L08F-TCS110I SiliconBlue November 24, 2010 1.0 Preliminary Data Sheet Supplement New package Supplement for CS110 4.35mm x 4.77 mm WLCSP (see iCE65 L-Series Data Sheet for Electrical and Architecture Characteristics) Figure 1: iCE65L08 WLCSP


    Original     		iCE65L08F-TCS110I CS110 iCE65 iCE65L08 CS110 24-NOV-2010) PDF

    Untitled

    Abstract: No abstract text available
    Text: Dual 3 MHz, 800 mA Buck Regulators in WLCSP ADP5133 Data Sheet FEATURES The two bucks operate out of phase to reduce the input capacitor requirement and noise. Input voltage range: 2.3 V to 5.5 V Two 800 mA buck regulators Tiny, 16-ball, 2 mm x 2 mm WLCSP package


    Original     		ADP5133 16-ball, ADP5133 ADP5023 ADP50ocal CB-16-8 D11991-0-4/14 PDF

    201676B

    Abstract: No abstract text available
    Text: APPLICATION NOTE Wafer Level Chip Scale Packages: SMT Process Guidelines and Handling Considerations Introduction The Skyworks Wafer Level Chip Scale Package WLCSP is a bumped die solution that can be used for in-module and/or standalone applications. WLCSP packaging technology is applied


    Original     		201676B 201676B PDF

    SAC1205

    Abstract: IPC-A-600G IPC-6012 WLCSP stencil design JESD-B111 AN3846 sac105 IPC 6012 WLCSP smt IPC-6016
    Text: Freescale Semiconductor Application Note AN3846 Rev. 2.0, 8/2009 Wafer Level Chip Scale Package WLCSP 1 Purpose The purpose of this Application Note is to outline the basic guidelines to use the Wafer Level Chip Scale Package (WLCSP) to ensure consistent Printed Circuit Board (PCB)


    Original     		AN3846 SAC1205 IPC-A-600G IPC-6012 WLCSP stencil design JESD-B111 AN3846 sac105 IPC 6012 WLCSP smt IPC-6016 PDF

    SAC387

    Abstract: IPC-7525 pcb warpage in ipc standard land pattern for WLCSP "x-ray machine" ROSIN FLUX TYPE ROL0 WLCSP stencil design FDZ191P sac105 IPC-9075
    Text: www.fairchildsemi.com AN-6084 Surface Mount Assembly Guideline for WLCSP 1.0x1.5 Introduction The Wafer-Level Chip-Scale Package WLCSP is one of the smallest discrete MOSFET devices available in the market. Fairchild’s offering comes in two ultra-low profile


    Original     		AN-6084 SAC387 IPC-7525 pcb warpage in ipc standard land pattern for WLCSP "x-ray machine" ROSIN FLUX TYPE ROL0 WLCSP stencil design FDZ191P sac105 IPC-9075 PDF

    AD526

    Abstract: No abstract text available
    Text: Preliminary Technical Data 40 A Micropower Instrumentation Amplifier in WLCSP Package AD8235 FEATURES BALL CONFIGURATION Low power 40 μA supply current max 6 nA shutdown current Space-saving 1.6mm X2mm WLCSP package Low input currents 1 pA input bias current


    Original     		AD8235 AD8235 PR08211-0-4/09 AD526 PDF

    G5192

    Abstract: No abstract text available
    Text: G5192X Global Mixed-mode Technology 25mΩ RON 3A High Side One Channel Load Switch in 1mm X1mm WLCSP package Features General Description The G5192C/D is a family of high-side load switches designed to operation from 1.5V to 5V input voltage. The 0.5mm WLCSP load switch pass element is an internal 25 ohm RON


    Original     		G5192X G5192C/D G5192CB11U G5192DB11U G5192 PDF

    WLCSP stencil design

    Abstract: 7531A IPC-7531A FDZ191P FPF1003 AN-9045 WLCSP SMT IPC-SM-7525A FPF1004 JESD22-B102D
    Text: Application Note AN-9045 WLCSP Assembly Guidelines By Dennis Lang INTRODUCTION PAD FINISH Wafer level chip scale packaging WLCSP is actually an old packaging technology, likely the oldest finding significant growth today. The technology is valued today for the same reasons it


    Original     		AN-9045 IPC-7531A JESD22-B102D, FPF1003, FPF1004, FDZ191P, FDZ193P WLCSP stencil design 7531A IPC-7531A FDZ191P FPF1003 AN-9045 WLCSP SMT IPC-SM-7525A FPF1004 JESD22-B102D PDF

    Untitled

    Abstract: No abstract text available
    Text: DATA SHEET • Receive and Transmit WCDMA FDD and TDD Band 7 systems  Mode switching for cellular, tablet, and embedded modules RF7 RF6 Applications RF5 RF4 SKY13477-001A: 3P4T Transmit/Receive LTE Switch in a WLCSP Package RF1 Features  400 micron WLCSP suitable for direct board attachment


    Original     		SKY13477-001A: 15-bump J-STD-020) 03104A PDF

    RICOH MARK

    Abstract: No abstract text available
    Text: R1115Z Series WLCSP 150mA LDO The R1115Z Series are CMOS-based LDO regulators featuring 150mA output. The R1115Z, the WLCSP version of R1114x and R1124N, features a high ripple rejection and an excellent load transient response. These features make the product ideally suited for use in


    Original     		R1115Z 150mA R1115Z, R1114x R1124N, 150mA, Room403, Room109, RICOH MARK PDF

    Untitled

    Abstract: No abstract text available
    Text: R1183Z Series Low Supply Current WLCSP 150mA LDO The R1183Z Series are CMOS-based LDO regulator featuring 150mA output. The R1183Z is the WLCSP Version of R1180x. The R1183Z’s typical low supply current of 1 A makes it ideal for use in power supplies systems with the sleep mode on. The version that


    Original     		R1183Z 150mA R1180x. R1180x, Room403, Room109, PDF

    Untitled

    Abstract: No abstract text available
    Text: R1183Z Series Low Supply Current WLCSP 150mA LDO The R1183Z Series are CMOS-based LDO regulator featuring 150mA output. The R1183Z is the WLCSP Version of R1180x. The R1183Z’s typical ultra low supply current of 1 A makes it ideal for use in power supplies systems with the sleep mode on. The


    Original     		R1183Z 150mA R1180x. R1180x, Room403, Room109, PDF

    Untitled

    Abstract: No abstract text available
    Text: R1183Z Series Low Supply Current WLCSP 150mA LDO The R1183Z Series are CMOS-based LDO regulator featuring 150mA output. The R1183Z is the WLCSP Version of R1180x. The R1183Z’s typical low supply current of 1 A makes it ideal for use in power supplies systems with the sleep mode on. The version that


    Original     		R1183Z 150mA R1180x. R1180x, Room403, Room109, PDF

    Nihon handa rx303-92skho

    Abstract: RX303-92SKHO VMMK-125 0402 land pattern INCOMING INSPECTION solder paste recommended land pattern for 0402 cap WLCSP stencil design VMMK-1225 AV02-1078EN land pattern for WLCSP
    Text: VMMK-1225 production assembly process Application Note 5378 Description Package Features Avago Technologies has combined our industry leading EpHEMT technology with a revolutionary wafer level chip scale package design WLCSP . This wafer level chip scale


    Original     		VMMK-1225 VMMK-125 AV02-1078EN Nihon handa rx303-92skho RX303-92SKHO 0402 land pattern INCOMING INSPECTION solder paste recommended land pattern for 0402 cap WLCSP stencil design land pattern for WLCSP PDF

    2.1 channel amplifier ckt

    Abstract: marking code 46W APA0712 STD-020C MOBIL CAMERA
    Text: APA0712 1.4W Mono Audio Low-Voltage Audio Power Amplifier Features • Operating Voltage: 2.5V-5.5V • High supply voltage ripple rejection • Supply Current • Surface-Mount Packaging – IDD=2.2mA at VDD=5V - 9 bump WLCSP – IDD=1.3mA at VDD=3.6V •


    Original     		APA0712 APA0712 APA07evel. MIL-STD-883D-2003 MIL-STD-883D-1005 JESD-22-B MIL-STD-883D-1011 MIL-STD-883D-3015 100mA 2.1 channel amplifier ckt marking code 46W STD-020C MOBIL CAMERA PDF

    wlcsp-9

    Abstract: APA0712 A102 STD-020C
    Text: APA0712 1.4W Mono Audio Low-Voltage Audio Power Amplifier Features • Operating Voltage: 2.5V-5.5V • High supply voltage ripple rejection • Supply Current • Surface-Mount Packaging – IDD=1.5mA at VDD=5V - 9 bump WLCSP – IDD=1.2mA at VDD=3.6V •


    Original     		APA0712 APA0712 wlcsp-9 A102 STD-020C PDF

    ADG888

    Abstract: ADG888YRUZ MO-220-VGGC ADG888YCBZ-REEL7
    Text: 0.4 Ω CMOS, Dual DPDT Switch in WLCSP/LFCSP/TSSOP Packages ADG888 FEATURES 1.8 V to 5.5 V operation Ultralow on resistance 0.4 Ω typical 0.6 Ω maximum at 5 V supply Excellent audio performance, ultralow distortion 0.07 Ω typical 0.14 Ω maximum RON flatness


    Original     		ADG888 16-Lead 16-Ball RU-16 CP-16-4 ADG888 ADG888YRUZ MO-220-VGGC ADG888YCBZ-REEL7 PDF