WEIGHT OF SOP PACKAGE Search Results

WEIGHT OF SOP PACKAGE Result Highlights (5)

Part	Manufacturer	Description
TPH9R00CQH	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N)
TPH2R408QM	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance
XPH2R106NC	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF)
XPH3R206NC	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF)
TPH4R008QM	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N)

WEIGHT OF SOP PACKAGE Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
185 optocoupler 4-Pin Abstract: smd 4-pin DUAL DIODE smd diode code kc smd 4-pin package DUAL DIODE Diode smd code cm OPIA817ATRE OPIA814A OPIA817 OPIA1210 OPIA815 Text: OPIA814, OPIA815, OPIA817 OPIA1210, OPIA4010 SMD, SOP and SSOP Packages Features: • • • • 5,000 Vrms electrical isolation Choice of a Single and Dual LED Phototransistor or Photo Darlington Sensor Low-cost plastic Dual-In-Line DIP package Agency Approvals:	Original	OPIA814, OPIA815, OPIA817 OPIA1210, OPIA4010 E58730 2000pcs/Reel 185 optocoupler 4-Pin smd 4-pin DUAL DIODE smd diode code kc smd 4-pin package DUAL DIODE Diode smd code cm OPIA817ATRE OPIA814A OPIA817 OPIA1210 OPIA815	PDF
OPIA602 Abstract: optocoupler smd 16 pin OPIA500 OPIA500B OPIA600 OPIA601 OPIA603 OPIA604 OPIA605 ic 6 pin smd for power supply Text: Optocoupler—SMD and SOP Packages OPIA500, OPIA600 through OPIA605 5 Pin Features: • • • • 2,500 to 5,000 Vrms electrical isolation Choice of a Single and Dual LED Phototransistor or Photo Darlington Sensor Low-cost plastic Dual-In-Line DIP package	Original	OPIA500, OPIA600 OPIA605 E58730 1000pcs/Reel OPIA602 optocoupler smd 16 pin OPIA500 OPIA500B OPIA601 OPIA603 OPIA604 OPIA605 ic 6 pin smd for power supply	PDF
opia404b Abstract: OPIA405-409 opia404 OPIA401 smd optocoupler 4pin OPIA401-404 photo darlington sensor OPIA402B OPIA403B OPIA409 Text: OPIA401 through OPIA409, OPIA414 SMD, SOP and SSOP Packages Features: • • • • 2,500 or 3,750 Vrms electrical isolation Choice of a Single and Dual LED Phototransistor or Photo Darlington Sensor Low-cost plastic Dual-In-Line DIP package Agency Approvals:	Original	OPIA401 OPIA409, OPIA414 E58730 OPIA401-404) OPIA405-409) transmitter08 2000pcs/Reel opia404b OPIA405-409 opia404 smd optocoupler 4pin OPIA401-404 photo darlington sensor OPIA402B OPIA403B OPIA409	PDF
smd diode a6 Abstract: ic smd 6pin for power supply ic 6 pin smd for power supply smd diode code a6 smd code a6 OPIA405C photo darlington sensor DIODE SMD A6 OPIA5010A smd diode code a.6 1 Text: OPIA500B, OPIA4N35, OPIA4N33 OPIA2110, OPIA2210, OPIA5010, OPIA6010 SMD and SOP Packages 5 Pin Features: • • • • 3,750 or 5,000 Vrms electrical isolation Choice of a Single and Dual LED Phototransistor or Photo Darlington Sensor Low-cost plastic Dual-In-Line DIP package	Original	OPIA500B, OPIA4N35, OPIA4N33 OPIA2110, OPIA2210, OPIA5010, OPIA6010 E58730 1000pcs/Reel smd diode a6 ic smd 6pin for power supply ic 6 pin smd for power supply smd diode code a6 smd code a6 OPIA405C photo darlington sensor DIODE SMD A6 OPIA5010A smd diode code a.6 1	PDF
smd diode a5 Abstract: OPIA2110A OPIA2110 OPIA2210 OPIA500 OPIA500B OPIA5010 OPIA6010 OPIA5010A ic 6 pin smd for power supply Text: OPIA500B, OPIA4N35, OPIA4N33 OPIA2110, OPIA2210, OPIA5010, OPIA6010 SMD and SOP Packages 5 Pin Features: • • • • 3,750 or 5,000 Vrms electrical isolation Choice of a Single and Dual LED Phototransistor or Photo Darlington Sensor Low-cost plastic Dual-In-Line DIP package	Original	OPIA500B, OPIA4N35, OPIA4N33 OPIA2110, OPIA2210, OPIA5010, OPIA6010 E58730 1000pcs/Reel smd diode a5 OPIA2110A OPIA2110 OPIA2210 OPIA500 OPIA500B OPIA5010 OPIA6010 OPIA5010A ic 6 pin smd for power supply	PDF
optocoupler smd 16 pin Abstract: smd optocoupler OPIA605 OPIA500 OPIA500B OPIA600 OPIA601 OPIA602 OPIA603 OPIA604 Text: Optocoupler—SMD and SOP Packages OPIA500, OPIA600 through OPIA605 5 Pin Features: • • • • 2,500 to 5,000 Vrms electrical isolation Choice of a Single and Dual LED Phototransistor or Photo Darlington Sensor Low-cost plastic Dual-In-Line DIP package	Original	OPIA500, OPIA600 OPIA605 E58730 1000pcs/Reel optocoupler smd 16 pin smd optocoupler OPIA605 OPIA500 OPIA500B OPIA601 OPIA602 OPIA603 OPIA604	PDF
smd optocoupler 4pin Abstract: OPIA409 OPI401ATRE OPIA401 OPIA401-404 OPIA401B OPIA402B OPIA403B OPIA405-409 OPIA414 Text: OPIA401 through OPIA409, OPIA414 SMD, SOP and SSOP Packages Features: • • • • 2,500 or 3,750 Vrms electrical isolation Choice of a Single and Dual LED Phototransistor or Photo Darlington Sensor Low-cost plastic Dual-In-Line DIP package Agency Approvals:	Original	OPIA401 OPIA409, OPIA414 E58730 OPIA401-404) OPIA405-409) 2000pcs/Reel smd optocoupler 4pin OPIA409 OPI401ATRE OPIA401-404 OPIA401B OPIA402B OPIA403B OPIA405-409 OPIA414	PDF
OPIA400 Abstract: optocoupler smd smd optocoupler 185 optocoupler 4-Pin 4 PIN IC Optocoupler with Phototransistor Output OPI400ATR OPIA400A OPIA401B OPIA402B OPIA403B Text: Optocoupler—SMD, SOP and SSOP Packages OPIA400 through OPIA414 Features: • • • • 2,500 to 5,000 Vrms electrical isolation Choice of a Single and Dual LED Phototransistor or Photo Darlington Sensor Low-cost plastic Dual-In-Line DIP package Agency Approvals:	Original	OPIA400 OPIA414 E58730 2000pcs/Reel optocoupler smd smd optocoupler 185 optocoupler 4-Pin 4 PIN IC Optocoupler with Phototransistor Output OPI400ATR OPIA400A OPIA401B OPIA402B OPIA403B	PDF
BGA and QFP Package mounting Abstract: MCP Technology Trend EE13 jwg2 EE13 JWG SC47D tfBGA PACKAGE thermal resistance EIA and EIAJ standards Combo (Spindle VCM) Driver BGA and QFP Package EE-13 Text: PACKAGE TRENDS 1-1 Packaging Trends Needs of electronic equipment Optimized System Integration Performance • Multiple functions • High speed • High output Outline • Small • Thin • Light Assembly • Automation • Systematization • High density	Original		PDF
sop package tray Abstract: 29754* intel weight of SOP package SOP JEDEC tray Text: SMALL OUTLINE PACKAGE GUIDE OVERVIEW Intent This overview provides a quick reference for the Small Outline Package Guide, Intel literature order number 296514. Contents The table below details, in outline form, the type of information that can be found in the guide.	Original		PDF
land pattern for TSOP 2-44 Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions	Original		PDF
TSOP-48 pcb LAYOUT Abstract: str 6654 pin details of str f 6654 pin details of str W 6654 amd socket 940 pinout str W 6654 land pattern tsop 66 56-Lead TSOP Package 28F002BC 28F010 Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions	Original		PDF
LGA 1156 PIN OUT diagram Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)	Original	DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram	PDF
pioneer PAL 007 A Abstract: PAL 007 pioneer str 6654 PAL 008 pioneer pin details of str W 6654 sem 2106 Yamaichi Electronics ic197 648-0482211 TSOP56 jackson Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions	Original		PDF

LED Clock Display dual Abstract: No abstract text available Text: Macroblock MBI5168 Datasheet 8-bit Constant Current LED Sink Driver Features Dual In-Line Package MBI5001CN MBI5168CN z 8 constant-current output channels z Constant output current invariant to load voltage change z Excellent output current accuracy: between channels: < ±3% max. , and	Original	MBI5168 MBI5168CN MBI5001CN P-DIP16-300-2 MBI5168CD BI5001CD OP16-150-1 100mA 25MHz MBI5168 LED Clock Display dual	PDF
koki solder paste Abstract: BGA256 koki ju-11t QFP128-P-1420-0 JU-11T "the package information document consisting of 8 chapters in total" QFP128-P-2828-0 SSOP20-P-250-0 SSOP30-P-56-0 SSOP32-P-430-1 Text: This version: Apr. 2001 Previous version:Jun. 1997 PACKAGE INFORMATION 4. OUTLINE OF SURFACE MOUNTING TECHNOLOGY This document is Chapter 4 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 4. OUTLINE OF SURFACE MOUNTING TECHNOLOGY	Original	JU-11T koki solder paste BGA256 koki ju-11t QFP128-P-1420-0 JU-11T "the package information document consisting of 8 chapters in total" QFP128-P-2828-0 SSOP20-P-250-0 SSOP30-P-56-0 SSOP32-P-430-1	PDF
Fujitsu Abstract: mb29LV160 fujitsu reflow profile SnAgCu QFP208 QFP208 SnPb 336H QFP lead pitch 0.3mm PBGA 256 reflow profile QFP-208 Text: 1 Fujitsu Lead-free Package Semiconductor Group LSI Packaging Division Fujitsu LSI PACKAGING DIVISION All Rights Reserved, Copyright Fujitsu Limited 2 History of Fujitsu Lead-free Package Development Activities Lead-free Package Development to Commence	Original		PDF
NEC stacked MCP 1999 Abstract: Stacked CSP 1999 MCP Technology Trend 13B1 NEC stacked CSP memory NEC stacked CSP 2000 Hitachi Stacked CSP sharp calculator Text: Packaging Trends for Mobile Application Morihiro Kada Abstract The advent of the CSP has heralded a new paradigm in semiconductor packaging technology. Previously overshadowed by IC chips, packaging technology has begun to take center stage as a key factor in product competitiveness. Packaging technology will develop into 3D packages, and will create a	Original		PDF
MB5168 Abstract: A 102G resistor Text: Macroblock Datasheet MBI5169 8-Bit Constant Current LED Sink Driver with Open/Short Circuit Detection Features l Compatible with MBI5168 in package and electrical characteristics l Exploit Share-I-O technique to provide two operation modes: M BDual I 5 0In-Line	Original	MBI5169 MBI5168 MB5168, MBI5168CN MBI5001CN P-DIP16-300-2 MBI5001CD MBI5168CD MBI5169 MB5168 A 102G resistor	PDF
Untitled Abstract: No abstract text available Text: APPLICATION NOTE SOLDERING RECOMMENDATIONS and PACKAGING INFORMATION by the Micro Divisions INTRODUCTION SGS-THOMSON supports various package types to adapt MCUs to customer requirements. Beside the available mounting technology SMD or Throughhole , the choice is often driven by technical and economical concerns. This application note	Original		PDF
MB5168 Abstract: No abstract text available Text: Macroblock Advance Information MBI5170 8-bit Constant Current LED Sink Driver with Gain Control Features M BDual I 5 0In-Line 0 1 CPackage N MBI5168CN MBI5001CN l Compatible with MBI5168 in package and electrical characteristics l Exploit Share-I-O technique to provide two operation modes:	Original	MBI5170 MBI5168 MB5168, 100mA MBI5170 MB5168	PDF
AN899 Abstract: No abstract text available Text: APPLICATION NOTE SOLDERING RECOMMENDATIONS and PACKAGING INFORMATION by the Micro Divisions INTRODUCTION SGS-THOMSON supports various package types to adapt MCUs to customer requirements. Beside the available mounting technology SMD or Throughhole , the choice is often driven by technical and economical concerns. This application note	Original		PDF
MARK W1 TSOP Abstract: weight of SOP 16 package MSM548332 weight of SOP package Text: O K I Semiconductor Packaging Multiport DRAM Products Packaging OKU Semiconductor Packaging Field Memory Products Package Name MSM514212 No. of Pins zs GS TS TS JS DIP ZIP SOP TSOP Typen TQFP SOJ O 28 r '\ 16 MSM514221B RS r o 20 O 26/20 o 16 MSM514222B o	OCR Scan	MSM514212 MSM514221B MSM514222B MSM514223B MSM518221 MSM518222 MSM5412222 MSM548333 MSM548332 MSM548331 MARK W1 TSOP weight of SOP 16 package weight of SOP package	PDF
Untitled Abstract: No abstract text available Text: O K I Semiconductor Packaging Packaging Low Power SRAM Products Package Name M SM 51257C LL M SM 51257C L M SM 51257C LP No. of Pins 28 RS JS GS TS DIP SO J SO P TSOPfTypel/ll O o o o o o o 32 28 o 32 28 o 32 M SM 51V257C LL 28 o M SM 51V257C L 28 o o o M SM 51V257C LP	OCR Scan	51257C 51V257C 52V1001LL 52V1001L 001LP 016LL	PDF

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WEIGHT OF SOP PACKAGE Search Results

WEIGHT OF SOP PACKAGE Result Highlights (5)

WEIGHT OF SOP PACKAGE Datasheets Context Search

185 optocoupler 4-Pin

OPIA602

opia404b

smd diode a6

smd diode a5

optocoupler smd 16 pin

smd optocoupler 4pin

OPIA400

BGA and QFP Package mounting

sop package tray

land pattern for TSOP 2-44

TSOP-48 pcb LAYOUT

LGA 1156 PIN OUT diagram

pioneer PAL 007 A

LED Clock Display dual

koki solder paste

Fujitsu

NEC stacked MCP 1999

MB5168

Untitled

MB5168

AN899

MARK W1 TSOP

Untitled