SD3502
Abstract: ZM5101
Text: ZM5101 General Purpose Z-Wave SiP Module The ZM5101 combines a Z-Wave SD3502 SoC with a built-in microcontroller and Z-Wave RF transceiver , crystal, and passive RF components within a single 8mm x 8mm module. This makes the ZM5101 ideal for small-footprint, single microcontroller products, such
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ZM5101
ZM5101
SD3502
128kB
PMB12438
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Z-Wave Application Programming Guide
Abstract: ZW0301 Application Programming Guide APL10045 ins10247 APL10312 Z-Wave Guide INS10247 Z-Wave Programming Guide Zensys, INS10247 ZW0301 Zensys, APL10312, Application Note, Programming the 200 and 300 Series Z-Wave Single Chip Flash
Text: Datasheet ZM3102N Z-Wave Module Datasheet Document No: DSH10756 Version: 6 Description: Datasheet for the ZM3102N Z-Wave Module based on the ZW0301 Z-Wave Single Chip. Written By: SDH;TCA Date: 2007-10-01 Reviewed By: DCL Restrictions: None Approved by: Date
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ZM3102N
DSH10756
ZW0301
DSH10756-6
DSH10717,
APL10312,
INS10247,
Z-Wave Application Programming Guide
ZW0301 Application Programming Guide
APL10045
ins10247
APL10312
Z-Wave Guide INS10247
Z-Wave Programming Guide
Zensys, INS10247
Zensys, APL10312, Application Note, Programming the 200 and 300 Series Z-Wave Single Chip Flash
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ZW0301
Abstract: ZM3102 ZW0401 ZW0402 ZW0102 z-wave ZENSYS wireless door BELL automatic door bell ZW0201
Text: Z-Wave 300-Series Single Chip – Overview – November 2006 Zensys Inc., 2006 – Confidential Z-Wave P300 Overview - 17 November 2006 - 1 Z-Wave evolution ZW0102 ZW0201 0.35um 0.18um ZW0301 … ZW0301XXXX XXXX … Static Controllers SUC / SIS 40 kbit/s
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300-Series
ZW0102
ZW0201
ZW0301
ZW0301XXXX
ZW0401
ZW0402
Q1-2008
ZW0301
ZM3102
ZW0401
ZW0402
ZW0102
z-wave
ZENSYS
wireless door BELL
automatic door bell
ZW0201
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Untitled
Abstract: No abstract text available
Text: Wave soldering footprint Footprint information for wave soldering of hermetically sealed glass surface-mounted package; 2 connectors SOD80C 6.30 4.90 2.70 1.90 2.90 1.70 solder land solder resist occupied area Dimensions in mm www.nxp.com 2010 NXP B.V.
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OD80C
sod080c
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sot363 wave soldering
Abstract: No abstract text available
Text: Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted package; 6 leads SOT363 1.5 0.3 2.5 4.5 1.5 1.3 1.3 2.45 5.3 preferred transport direction during soldering solder land solder resist occupied area Dimensions in mm
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OT363
sot363
sot363 wave soldering
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3h32
Abstract: H32 Package 25H32 5h32 208E 213B 3H32-AT-16 22496
Text: CLOCK OSCILLATORS Logic: HCMOS “H32” series 3.2x2.5x1.1 mm; Wave Form: Square wave MERCURY Since 1973 ● Suitable for light weight and compact consumer electronic devices ● Ideal for high density boards ● Mercury’s smallest footprint clock oscillators.
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25H32
3h32
H32 Package
25H32
5h32
208E
213B
3H32-AT-16
22496
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PDF
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Untitled
Abstract: No abstract text available
Text: Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted package; 4 leads SOT143B 4.45 2.2 1.2 3x 1.425 (3×) 4.6 2.575 preferred transport direction during soldering 1.425 solder land 1 solder resist 1.2 occupied area
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OT143B
sot143b
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PDF
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Untitled
Abstract: No abstract text available
Text: Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted package with increased heatsink; 4 leads SOT223 8.9 6.7 1.9 4 6.2 8.7 preferred transport direction during soldering 1 2 3 1.9 3x solder land 2.7 solder resist
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OT223
sot223
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sot89 footprint
Abstract: No abstract text available
Text: Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted package; 3 leads SOT89 6.6 2.4 3.5 7.6 0.5 preferred transport direction during soldering 1.8 2x solder land 1.9 1.5 (2×) solder resist occupied area www.nxp.com
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sot089
sot89 footprint
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Untitled
Abstract: No abstract text available
Text: Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted package; 3 leads SOT23 2.2 1.2 2x 1.4 (2×) 4.6 2.6 preferred transport direction during soldering 1.4 solder land 2.8 solder resist 4.5 occupied area www.nxp.com
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sot023
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sod323 wave soldering
Abstract: No abstract text available
Text: Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted, 2 leads package SOD323 5 2.9 1.5 2x 2.75 1.2 (2×) preferred transport direction during soldering solder land solder resist occupied area Dimensions in mm www.nxp.com
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OD323
sod323
sod323 wave soldering
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wave footprint
Abstract: No abstract text available
Text: Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted package; 3 leads SOT323 4.6 2.575 1.425 3x 1.8 3.65 2.1 09 (2×) preferred transport direction during soldering solder land solder resist occupied area Dimensions in mm
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OT323
sot323
wave footprint
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ZM5202
Abstract: SD3502
Text: ZM5202 General Purpose Z-Wave Module The ZM5202 module combines a Z-Wave® SD3502 SoC with a built-in microcontroller and Z-Wave RF transceiver , crystal, and passive RF components. This makes the ZM5202 ideal for single microcontroller products, such as lighting control and sensors. The
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ZM5202
ZM5202
SD3502
ZM5202â
128kB
PMB12374
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PDF
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Untitled
Abstract: No abstract text available
Text: Wave soldering footprint Footprint information for wave soldering of SO20 package SOT163-1 1.20 2x enlarged solder land 0.3 (2×) 1.50 8.00 11.00 11.40 0.60 (18×) 1.27 (18×) 13.40 preferred transport direction during soldering solder land solder resist
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OT163-1
sot163-1
con18Ã
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Untitled
Abstract: No abstract text available
Text: Wave soldering footprint Footprint information for wave soldering of SO8 package SOT96-1 1.20 2x enlarged solder land 0.3 (2×) 0.60 (6×) 1.30 4.00 6.60 7.00 1.27 (6×) 5.50 preferred transport direction during soldering solder land solder resist occupied area
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OT96-1
sot096-1
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Untitled
Abstract: No abstract text available
Text: Wave soldering footprint Footprint information for wave soldering of TSOP6 package SOT457 5.3 1.5 4x 1.475 0.45 (2×) 5.05 1.475 1.45 (6×) 2.85 solder land solder resist occupied area Dimensions in mm www.nxp.com 2010 NXP B.V. preferred transport direction during soldering
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OT457
sot457
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3H53
Abstract: 3H53-AT-13 H53 mercury 208E 213B 5X3.2
Text: CLOCK OSCILLATORS “H53” series 5x3.2 mm Logic: HCMOS Wave Form: Square wave MERCURY Since 1973 H53 5x3.2x1.2 mm is Mercury smallest footprint and lowest profile SMD clock oscillators. Its applications include PDAs, ATM, PCMCOA, networking, laptops, digital camera, wireless LAN and disk and tape drives. Output is
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Untitled
Abstract: No abstract text available
Text: BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 288 SERIES Compact Wave-Solderable Low-Cost Heat Sinks Standard P/N Height Above PC Board in. mm Maximum Footprint in. (mm) 288-1ABE 1.250 (31.8) 0.875 (22.2) x 0.215 (5.5) Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good
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288-1ABE
O-220
O-202
288-1AB
O-220,
O-202
1-866-9-OHMITE
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Untitled
Abstract: No abstract text available
Text: Temperature Compensated Crystal Oscillators TRUE SINEWAVE SMD 11.4x9.6 mm TCXO/VCTCXO IN LEADLESS PACKAGE - TCLS Series FEATURES RoHS Compliant (Pb-Free), True Sine Wave or Clipped Sine Wave Output Voltage Control Option for Electric Frequency Adjustments
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10KHz
TCLS-12M800-A:
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Untitled
Abstract: No abstract text available
Text: FREQUENCY CONTROL PRODUCTS HIGH FREQUENCY SMD SINE WAVE VCXO TYPES DFV S7-S / MS SURFACE MOUNT PACKAGE 19.9± 0.1 HIGH FREQUENCIES 1.27 WIDE PULLING RANGE 7.62 12.9± 0.2 SINE WAVE OUTPUT 1.6 1 2 3 4 19.0 PC board footprint 4 3 1 2 1.3 DFV S7-S/MS V control
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100B15
100B25
100E25
100E50
100B15
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Untitled
Abstract: No abstract text available
Text: VCXO “G534” series 5x3.2 mm Logic: HCMOS Wave Form: Square wave MERCURY Since 1973 G534 5x3.2x1.2 mm is Mercury smallest footprint and lowest profile SMD VCXO. Its applications include phase lock loop, SONET/ATM, set-top boxes, MPEG, audio video modulations, video game consoles and HDTV sets. Output is TTL/CMOS
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3G534
5G534
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Untitled
Abstract: No abstract text available
Text: Crystal oscillator Product Number please contact us VOLTAGE -CONTROLLED SAW OSCILLATOR (VCSO) LV-PECL: X1M000242xxxxxx Sine wave: X1M000262xxxxxx OUTPUT : LV-PECL, Sine wave LOW-JITTER, LOW PHASE NOISE EV - 9100JG •Frequency range : 800 MHz to 2500 MHz
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X1M000242xxxxxx
X1M000262xxxxxx
9100JG
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BWT190
Abstract: Duplexer 15 ghz GSM duplexer BWR240 Philips WLAN WLAN2400 BWD210 umts duplexer BWD190A
Text: High performance miniature BAW filters and duplexers Bulk Acoustic Wave BAW filters and duplexers for Front-End Modules and Cellular Phones Bulk Acoustic Wave filters provide high performance, ultra small size solutions for next generation integrated cellular
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TO-220 footprint
Abstract: Heat Sinks 288-1AB 750 271
Text: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 288 SERIES Compact Wave-Solderable Low-Cost Heat Sinks Standard P/N Height Above PC Board in. mm Maximum Footprint in. (mm) 288-1AB ̆ 1.250 (31.8) 0.875 (22.2) x 0.215 (5.5) Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good
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288-1AB
O-220
O-202
O-220,
O-202
288-1AB
O-220
271-AB.
271-AB
272-AB
TO-220 footprint
Heat Sinks
750 271
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