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    WAKEFIELD THERMAL SOLUTIONS Search Results

    WAKEFIELD THERMAL SOLUTIONS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TCTH011AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH022AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH021AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012BE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Open-drain type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation

    WAKEFIELD THERMAL SOLUTIONS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Micrel Semiconductor Designing With LDO Regulators Section 9. References Thermal Information Micrel Databook, Micrel Inc., San Jose, CA. Tel: + 1 408 944-0800 MIL-STD-275E: Printed Wiring for Electronic Equipment. (31 December 1984) Innovative Thermal Management Solutions, Wakefield Engineering, 60 Audubon Road, Wakefield,


    Original     		PDF MIL-STD-275E: ManufactuL-STD-275E:

    95012N2

    Abstract: connector "N" 60X60 40x40x10mm mmH2O
    Text: DC Brushless Fans From Wakefield Engineering, Inc. Applying over 40 years experience in thermal management solutions, Wakefield Engineering, Inc. is offering a complete line of DC brushless fans. F E AT U R E S A N D B E N E F I T S • Compact hub enables exceptional air-flow


    Original     		PDF MM-H20) 912012N3 912012D3 95012N2 connector "N" 60X60 40x40x10mm mmH2O

    Wakefield Engineering

    Abstract: Muffin
    Text: CORPORATE HEADQUARTERS Wakefield Thermal Solutions 33 Bridge Street • Pelham NH 03076 T: 603-635-2800 • F: 603-635-1900 www.wakefield.com ISO 9001:2000 and QS 9000 REGISTERED Bonded Fin Heat Sinks CUSTOM BONDED FIN HEAT SINKS AND ASSEMBLIES Wakefield Engineering offers an extensive line of natural convection and forced convection custom bonded fin heat sinks


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Catalog 2 THERMAL MANAGEMENT | TECHNICAL PRODUCTS | INDUSTRIAL APPS | MACHINING SERVICES | NEWS | CONTACT US | ABOUT US Part # or Keyword New 500 Ton Extrusion Press Heat Sinks | Heat Frames | Thermal Accessories | Thermal Modeling | Inventory | MSDS Wakefield Thermovations TM


    Original     		PDF 882-100AB 882-200AB 882-300AB 882-50AB d/92/CategoryID/182/ProductID/515/Default

    Wakefield Thermal Solutions

    Abstract: Chomerics* T405 Bergquist BP-108 D10650-40 658-35AB 77AB datasheet of BGAS T405 bga package weight T411
    Text: Cover.qxd 11/3/05 1:00 PM Page 1 THERMAL MANAGEMENT SOLUTIONS FOR BGAs DESIGN • ANALYSIS • FABRICATION CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES:


    Original     		PDF

    amd Power and Thermal

    Abstract: k5 amd Chomerics T710 amd catalog "electrical connector"
    Text: THERMAL MANAGEMENT SOLUTIONS FOR AMD K5 and K6 Active heat sinks for high performance microprocessors PASSIVE Wakefield Engineering heat sinks are available for AMD’s K5 and K6 microprocessors. These processors are used in personal and networked computers


    Original     		PDF

    Intel Celeron Covington

    Abstract: Chomerics T710 mxt212
    Text: THERMAL MANAGEMENT SOLUTIONS FOR THE INTEL CELERON PROCESSORS Passive 866 Passive Crosscut 866X Active 866F COVINGTON/MENDOCINO Passive and active heat sinks for the Intel Celeron Microprocessors Wakefield Engineering’s Attachment Clip 866SC Celeron


    Original     		PDF 866SC 866SC. Intel Celeron Covington Chomerics T710 mxt212

    Wakefield Thermal Solutions TYPE 120

    Abstract: ebonol 217-36CT6 218-40CT3 218-40CT5 MO-169 635-10B2 TO38 Laser TO-44 204sb
    Text: STAMPED HEAT SINKS for Low Power Devices CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES: LOCKHART INDUSTRIES Paramount, CA 90723-1430 SPECIALTY EXTRUSION


    Original     		PDF

    ebonol

    Abstract: Wakefield Thermal Solutions Wakefield Thermal Solutions TYPE 120 217-36CT6 218-40CT3 218-40CT5 MO-169 635-10B2 207AB TO38 Laser
    Text: STAMPED HEAT SINKS for Low Power Devices CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES: LOCKHART INDUSTRIES Paramount, CA 90723-1430 SPECIALTY EXTRUSION


    Original     		PDF

    pentium II xeon

    Abstract: pentium II Xeon 400 2118 intel Chomerics T710
    Text: THERMAL MANAGEMENT SOLUTIONS FOR INTEL PENTIUM II Active 862F Xeon Slot II Passive Crosscut 862X Passive and active heat sinks for Pentium II Xeon (Slot II) Microprocessors Wakefield Engineering Passive 862 FEATURES AND BENEFITS heat sinks are • Both Passive and Active solutions are available


    Original     		PDF

    extrusion Heatsinks

    Abstract: Muffin 0024C
    Text: Bonded Fin Heat Sinks CUSTOM BONDED FIN HEAT SINKS AND ASSEMBLIES Wakefield Engineering offers an extensive line of natural convection and forced convection custom bonded fin heat sinks assemblies. Configurable in a variety of ways, they are reliable, cost effective, and highly efficient thermal management


    Original     		PDF 8715Thermal extrusion Heatsinks Muffin 0024C

    T405R

    Abstract: Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412 i960CF
    Text: WTS001_p1-25 6/14/07 10:53 AM Page 2 Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX The following table represents Wakefield’s recommendations for a variety of standard BGA sizes. However, this is by no means a complete list of components that can be used with these heat sinks. To determine suitability for your particular component, request a BGA heat sink


    Original     		PDF WTS001 p1-25 220486SX I860XR I960CA, I960CF AM486DX2, AM486DX4 669-32AG 669-32AG T405R Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412

    Cyrix 6x86

    Abstract: DC Centaur BERGQUIST softface media gx cyrix
    Text: Thermal Solutions for Intel: Pentium, Pentium MM X AMD: K6, K6-2 Cyrix: 6x86, Media GX Features and Benefits : Centaur: W inChip C6 ♦ Compact design heat sinks can comfortably fit a variety of Robust Socket 7 – based PC boxes. ♦ Works with Sockets 5 & 7 processors


    Original     		PDF 709rev2 709-80AB12 709-100AB12 Cyrix 6x86 DC Centaur BERGQUIST softface media gx cyrix

    deltabond 152

    Abstract: ABLESTIK 84-1LMIT deltabond Wakefield Thermal Solutions TYPE 120 84-1LMIT heatsink catalogue intel 8052 laptop mother board Pentium "Voltage Regulator Module" POWERSOP2
    Text: Thermal Design Considerations—EL75XX Application Note March 20, 1998 AN1096 Author: Vijay Soman Typical Applications Power Requirement Elantec's EL7560/EL7561/EL7556 series of voltage regulators are highly integrated, simple to use and the most effective switching mode designs to power microprocessors


    Original     		PDF Considerations--EL75XX AN1096 EL7560/EL7561/EL7556 EL7560/EL7561 EL7556 Solutions--1994 deltabond 152 ABLESTIK 84-1LMIT deltabond Wakefield Thermal Solutions TYPE 120 84-1LMIT heatsink catalogue intel 8052 laptop mother board Pentium "Voltage Regulator Module" POWERSOP2

    elina fan

    Abstract: 3dfx heat sink for 304 point BGA 2319B 658-35AB VSC870 VSC880 100C G53034-0 192 BGA PACKAGE thermal resistance
    Text: VITESSE SEMICONDUCTOR CORPORATION Application Note Thermal Management for the VSC870, VSC880 AN-36 Thermal Management The VSC870 and VSC880 backplane devices can use standard heat sinks to keep their junction temperatures within the specified limits. Both devices come in a thermally enhanced BGA package. Several types of


    Original     		PDF VSC870, VSC880 AN-36 VSC870 VSC880 G53034-0, elina fan 3dfx heat sink for 304 point BGA 2319B 658-35AB 100C G53034-0 192 BGA PACKAGE thermal resistance

    Heat Sinks

    Abstract: No abstract text available
    Text: HEAT SINKS FOR LEDs Preliminary JTI – HEAT SINKS FOR POWER LEDs 882 SERIES – RADIAL FIN HEAT SINK FOR “STAR” LED PACKAGES Wakefield's new 882 series heat sinks can be used with LEDs in the star package from Lumileds, Osram, and others. The radial design and


    Original     		PDF

    DAP 07

    Abstract: Power Supply Control IC dap 07 smd Power Supply Control IC dap 07 DAP 07 8 Pin SMD IC VIA 1394 TAS3001 TAS5110 TAS5110DAD TAS5110DAP Power Supply Control IC dap 08
    Text: TAS5110 SLES028A – MAY 2002 – REVISED SEPTEMBER 2002 TRUE DIGITAL AUDIO AMPLIFIER TAS5110 PWM POWER OUTPUT STAGE FEATURES D 50-W RMS Power Into 6 Ω at 10% THD D 40-W RMS Power Into 6 Ω at 0.1% THD D THD+N < 0.09% Typical 1-kHz Input Signal D 93-dB Dynamic Range (TDAA System)


    Original     		PDF TAS5110 SLES028A TAS5110 93-dB 32-Pin TAS50xx) DAP 07 Power Supply Control IC dap 07 smd Power Supply Control IC dap 07 DAP 07 8 Pin SMD IC VIA 1394 TAS3001 TAS5110DAD TAS5110DAP Power Supply Control IC dap 08

    Power Supply Control IC dap 08

    Abstract: Power Supply Control IC dap 07 TAS5110IDAPR TAS3001 TAS5110 TAS5110DAD TAS5110DAP TAS5110DAPR TAS5110IDAP DAP 07 power supply
    Text: TAS5110 SLES028A – MAY 2002 – REVISED SEPTEMBER 2002 TRUE DIGITAL AUDIO AMPLIFIER TAS5110 PWM POWER OUTPUT STAGE FEATURES D 50-W RMS Power Into 6 Ω at 10% THD D 40-W RMS Power Into 6 Ω at 0.1% THD D THD+N < 0.09% Typical 1-kHz Input Signal D 93-dB Dynamic Range (TDAA System)


    Original     		PDF TAS5110 SLES028A TAS5110 93-dB 32-Pin TAS50xx) Power Supply Control IC dap 08 Power Supply Control IC dap 07 TAS5110IDAPR TAS3001 TAS5110DAD TAS5110DAP TAS5110DAPR TAS5110IDAP DAP 07 power supply

    Power Supply Control IC dap 08

    Abstract: Power Supply Control IC dap 07 DAP 07 power supply DAP 07
    Text: TAS5110A SLES079 – APRIL 2003 PurePath Digital AMPLIFIER TAS5110A 50-W DIGITAL AMPLIFIER POWER STAGE FEATURES D 50 W RMS Power Into 6 Ω at 10% THD D 40 W RMS Power Into 6 Ω at 0.1% THD D THD+N < 0.09% Typical 1-kHz Input Signal D 93-dB Dynamic Range (TDAA System)


    Original     		PDF TAS5110A SLES079 TAS5110A 93-dB 32-Pin TAS50xx) Power Supply Control IC dap 08 Power Supply Control IC dap 07 DAP 07 power supply DAP 07

    DAP 07 power supply

    Abstract: DAP 07 Power Supply Control IC dap 07 50 watt subwoofer circuit diagram 500 watt audio subwoofer tas*5110 100 watt subwoofer circuit diagram PWM Control IC dap 07 car subwoofer power amplifier circuit Power Supply Control IC dap 07 smd
    Text: TAS5110 SLES028 – MAY 2002 TRUE DIGITAL AUDIO AMPLIFIER TAS5110 PWM POWER OUTPUT STAGE FEATURES D 50-W RMS Power Into 4 Ω D THD+N < 0.09% Typical 1-kHz Input Signal D 93-dB Dynamic Range (TDAA System) D Power Efficiency > 90% Into 8-Ω Load D Low Profile, SMD 32-Pin PowerPAD Package


    Original     		PDF TAS5110 SLES028 TAS5110 93-dB 32-Pin TAS50xx) DAP 07 power supply DAP 07 Power Supply Control IC dap 07 50 watt subwoofer circuit diagram 500 watt audio subwoofer tas*5110 100 watt subwoofer circuit diagram PWM Control IC dap 07 car subwoofer power amplifier circuit Power Supply Control IC dap 07 smd

    2.1 channel subwoofer amplifier circuit diagram

    Abstract: No abstract text available
    Text: TAS5110 SLES028A − MAY 2002 − REVISED SEPTEMBER 2002 TRUE DIGITAL AUDIO AMPLIFIER TAS5110 PWM POWER OUTPUT STAGE FEATURES D 50-W RMS Power Into 6 Ω at 10% THD D 40-W RMS Power Into 6 Ω at 0.1% THD D THD+N < 0.09% Typical 1-kHz Input Signal D 93-dB Dynamic Range (TDAA System)


    Original     		PDF TAS5110 SLES028A TAS5110 93-dB 32-Pin TAS50xx) 2.1 channel subwoofer amplifier circuit diagram

    DAP 6A

    Abstract: Power Supply Control IC dap 015 d DAP+6A
    Text: TAS5110 SLES028A − MAY 2002 − REVISED SEPTEMBER 2002 TRUE DIGITAL AUDIO AMPLIFIER TAS5110 PWM POWER OUTPUT STAGE FEATURES D 50-W RMS Power Into 6 Ω at 10% THD D 40-W RMS Power Into 6 Ω at 0.1% THD D THD+N < 0.09% Typical 1-kHz Input Signal D 93-dB Dynamic Range (TDAA System)


    Original     		PDF TAS5110 SLES028A TAS5110 93-dB 32-Pin TAS50xx) DAP 6A Power Supply Control IC dap 015 d DAP+6A

    DAP 018

    Abstract: free home theater circuit diagram Power Supply Control IC dap 08 Power Supply Control IC dap 015 d TAS3001 TAS5110 TAS5110DAD TAS5110DAP TAS5110DAPR TAS5110IDAP
    Text: TAS5110 SLES028A − MAY 2002 − REVISED SEPTEMBER 2002 TRUE DIGITAL AUDIO AMPLIFIER TAS5110 PWM POWER OUTPUT STAGE FEATURES D 50-W RMS Power Into 6 Ω at 10% THD D 40-W RMS Power Into 6 Ω at 0.1% THD D THD+N < 0.09% Typical 1-kHz Input Signal D 93-dB Dynamic Range (TDAA System)


    Original     		PDF TAS5110 SLES028A TAS5110 93-dB 32-Pin TAS50xx) DAP 018 free home theater circuit diagram Power Supply Control IC dap 08 Power Supply Control IC dap 015 d TAS3001 TAS5110DAD TAS5110DAP TAS5110DAPR TAS5110IDAP

    Aham

    Abstract: MIL-STD-275E
    Text: Section 9. References Thermal Information Micrel Databook, Micrel Inc., San Jose, CA.Tel: + 1 408 944-0800 MIL-STD-275E: Printed Wiring for Electronic Equipment. (31 December 1984) Innovative Thermal Management Solutions, Wakefield Engineering, 60 Audubon Road, Wakefield,


    OCR Scan     		PDF MIL-STD-275E: R44-0800 Aham MIL-STD-275E