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    WAFER LEVEL PACKAGE Search Results

    WAFER LEVEL PACKAGE Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    XPH13016MC Toshiba Electronic Devices & Storage Corporation P-ch MOSFET, -60 V, -60 A, 0.0099 Ω@-10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation

    WAFER LEVEL PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    UN-D1400

    Abstract: WLCSP stencil design AN10439 EIA541 IEC60286 WLCSP chip mount Service Manual smd rework station Wafer Level Chip Size Package und14
    Text: AN10439 Wafer Level Chip Size Package Rev. 03 — 17 October 2007 Application note Document information Info Content Keywords wafer, level, chip-scale, chip-size, package, WLCSP Abstract This application note provides guidelines for the use of Wafer Level Chip


    Original     		PDF AN10439 AN10365 AN10439 UN-D1400 WLCSP stencil design EIA541 IEC60286 WLCSP chip mount Service Manual smd rework station Wafer Level Chip Size Package und14

    amkor RDL

    Abstract: amkor flip FCCSP JEDEC tray standard amkor Sip
    Text: data sheet wafer level packaging CSPnl Features: CSPnl DSBGA / WLCSP / WSCSP / WLP Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the


    Original     		PDF

    amkor flip

    Abstract: wlcsp inspection amkor RDL amkor Sip dS721
    Text: data sheet wafer level packaging CSPnl BOR CSPnl Bump on Repassivation BOR (DSBGA / WLCSP / WSCSP / WLP) Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the


    Original     		PDF

    CSPNL

    Abstract: amkor RDL wafer map format amkor amkor flip amkor Sip amkor polyimide FCCSP wafer map
    Text: data sheet wafer level packaging CSPnl RDL Features: Packaging CSPnl Bump on Redistribution RDL (DSBGA / WLCSP / WSCSP / WLP) Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the


    Original     		PDF

    MEMS pressure sensor

    Abstract: mems sensor wafer sensors mems integrated sensor pressure mems sensor cost MEMS and IC advantage MEMS
    Text: 14 Nov 2006 1 3 WHAT IS AHEAD IN THE PACKAGING ROADMAP OF MEMS? Packaging of ICs goes wafer level and 3D Wafer level packaging, WLP, and 3D-packaging are the major trends in packaging of semiconductor devices. WLP converts the whole packaging process to a wafer-level


    Original     		PDF

    Nihon handa rx303-92skho

    Abstract: RX303-92SKHO VMMK-125 0402 land pattern INCOMING INSPECTION solder paste recommended land pattern for 0402 cap WLCSP stencil design VMMK-1225 AV02-1078EN land pattern for WLCSP
    Text: VMMK-1225 production assembly process Application Note 5378 Description Package Features Avago Technologies has combined our industry leading EpHEMT technology with a revolutionary wafer level chip scale package design WLCSP . This wafer level chip scale


    Original     		PDF VMMK-1225 VMMK-125 AV02-1078EN Nihon handa rx303-92skho RX303-92SKHO 0402 land pattern INCOMING INSPECTION solder paste recommended land pattern for 0402 cap WLCSP stencil design land pattern for WLCSP

    Untitled

    Abstract: No abstract text available
    Text: Wafer and Die Information Sheet Memory and Wireless / RF Products Features Level 1 • Async SRAMs, dual ports, FIFOs, micropower SRAMs, PROMs, sync SRAMs wafer and die, WirelessUSB LP wafer ■ Wafer ❐ Standard wafer 25 to 30 mil thick ❐ Background wafer to 14 mil thick


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Wafer and Die Information Sheet Memory and Wireless / RF Products Features Level 2 • Async SRAMs, dual ports, FIFOs, micropower SRAMs, PROMs, sync SRAMs wafer and die, WirelessUSB LP wafer ■ Wafer ❐ Standard wafer 25 to 30 mil thick ❐ Background wafer to 14 mil thick


    Original     		PDF

    wafer level package

    Abstract: SN63 PB37 PROFILES with or without underfill IRF6100 desoldering
    Text: AN-1011 Wafer Level Package Technology Board Mounting Application Note for 0.800mm pitch devices page Device construction 2 Design considerations 3 Assembly considerations 4 International Rectifier AN-1011 Wafer Level Package Technology Board Mounting Application Note


    Original     		PDF AN-1011 800mm wafer level package SN63 PB37 PROFILES with or without underfill IRF6100 desoldering

    Untitled

    Abstract: No abstract text available
    Text: AN-617 Application Note One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Wafer Level Chip Scale Package by the Wafer Level Package Development Team GENERAL DESCRIPTION PURPOSE


    Original     		PDF AN-617 AN03272-0-5/12

    IPC-6012

    Abstract: IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525
    Text: Maxim > App Notes > General Engineering Topics Prototyping and PC- Board Layout Wireless and RF Keywords: chip scale package, flip chip, CSP, UCSP, U- CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-level packaging WLP and its applications Abstract: This application note discusses Maxim's wafer-level package (WLP). Topics include: wafer construction, tape-and-reel


    Original     		PDF 1000x com/an1891 AN1891, APP1891, Appnote1891, IPC-6012 IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525

    Untitled

    Abstract: No abstract text available
    Text: VMMK-2203 0.9-11 GHz E-pHEMT Wideband Amplifier in Wafer Level Package Data Sheet Description Features Avago Technologies has combined its industry leading E-pHEMT technology with a revolutionary wafer level package WLP . • 1 x 0.5 mm Surface Mount Package


    Original     		PDF VMMK-2203 VMMK-2203 100mm 250mm. AV02-2001EN

    Untitled

    Abstract: No abstract text available
    Text: VMMK-2203 0.9-11 GHz E-pHEMT Wideband Amplifier in Wafer Level Package Data Sheet Description Features Avago Technologies has combined its industry leading E-pHEMT technology with a revolutionary wafer level package WLP . • 1 x 0.5 mm Surface Mount Package


    Original     		PDF VMMK-2203 VMMK-2203 100mm 250mm. AV02-2001EN

    54521

    Abstract: 3V02 AN-5378 PCB Rogers RO4003 substrate
    Text: VMMK-2203 0.9-11 GHz E-pHEMT Wideband Amplifier in Wafer Level Package Data Sheet Description Features Avago Technologies has combined its industry leading E-pHEMT technology with a revolutionary wafer level package WLP . • 1 x 0.5 mm Surface Mount Package


    Original     		PDF VMMK-2203 VMMK-2203 100mm 250mm. AV02-2001EN 54521 3V02 AN-5378 PCB Rogers RO4003 substrate

    ASME-14

    Abstract: MO-211 ISL59116 ISL59117
    Text: Plastic Packages for Integrated Circuits Wafer Level Chip Scale Package WLCSP W3x3.9A 3x3 ARRAY 9 BALL WAFER LEVEL CHIP SCALE PACKAGE (For ISL59116, ISL59117 Only) E SYMBOL MILLIMETERS NOTES A 0.62 +0.05 -0.08 - A1 0.24 ±0.025 - A2 0.38 REF. - b 0.32 ±0.03


    Original     		PDF ISL59116, ISL59117 5M-1994. MO-211-C, ASME-14 MO-211 ISL59116

    201676B

    Abstract: No abstract text available
    Text: APPLICATION NOTE Wafer Level Chip Scale Packages: SMT Process Guidelines and Handling Considerations Introduction The Skyworks Wafer Level Chip Scale Package WLCSP is a bumped die solution that can be used for in-module and/or standalone applications. WLCSP packaging technology is applied


    Original     		PDF 201676B 201676B

    VMMK-2203

    Abstract: VMMK-2203-TR1G VMMK2203 dy 398 diode A004R RO4350 34992 7447 spec sheet VMMK
    Text: VMMK-2203 0.9-11 GHz E-pHEMT Wideband Amplifier in Wafer Level Package Data Sheet Description Features Avago Technologies has combined its industry leading E-pHEMT technology with a revolutionary wafer level package WLP . x 1 x 0.5 mm Surface Mount Package


    Original     		PDF VMMK-2203 VMMK-2203 100mm 250mm. AV02-2001EN VMMK-2203-TR1G VMMK2203 dy 398 diode A004R RO4350 34992 7447 spec sheet VMMK

    Untitled

    Abstract: No abstract text available
    Text: VMMK-2203 0.9-11 GHz E-pHEMT Wideband Amplifier in Wafer Level Package Data Sheet Description Features Avago Technologies has combined its industry leading E-pHEMT technology with a revolutionary wafer level package WLP . • 1 x 0.5 mm Surface Mount Package


    Original     		PDF VMMK-2203 VMMK-2203 100mm 250mm. AV02-2001EN

    Untitled

    Abstract: No abstract text available
    Text: VMMK-2203 0.9-11 GHz E-pHEMT Wideband Amplifier in Wafer Level Package Data Sheet Description Features Avago Technologies has combined its industry leading E-pHEMT technology with a revolutionary wafer level package WLP . • 1 x 0.5 mm Surface Mount Package


    Original     		PDF VMMK-2203 VMMK-2203 100mm 250mm. AV02-2001EN

    34992

    Abstract: No abstract text available
    Text: VMMK-2203 0.9-11 GHz E-pHEMT Wideband Amplifier in Wafer Level Package Data Sheet Description Features Avago Technologies has combined its industry leading E-pHEMT technology with a revolutionary wafer level package WLP . • 1 x 0.5 mm Surface Mount Package


    Original     		PDF VMMK-2203 VMMK-2203 100mm 250mm. AV02-2001EN 34992

    WLP0402

    Abstract: VMMK-2203 34992 VMMK2203 A004R VMMK-2203-BLKG
    Text: VMMK-2203 0.9-11 GHz E-pHEMT Wideband Amplifier in Wafer Level Package Data Sheet Description Features Avago Technologies has combined its industry leading E-pHEMT technology with a revolutionary wafer level package WLP . • 1 x 0.5 mm Surface Mount Package


    Original     		PDF VMMK-2203 VMMK-2203 100mm 250mm. AV02-2001EN WLP0402 34992 VMMK2203 A004R VMMK-2203-BLKG

    A2 diode

    Abstract: sd 9c 020E10
    Text: Plastic Packages for Integrated Circuits Wafer Level Chip Scale Package WLCSP 0.4mm Ball Pitch W3x3.9C 3x3 ARRAY 9 BALL WAFER LEVEL CHIP SCALE PACKAGE E D PIN 1 INDEX AREA TOP VIEW SYMBOL MILLIMETERS A 0.445 Min, 0.495 Nom, 0.545 Max A1 0.190 ±0.025 A2


    Original     		PDF

    SAC1205

    Abstract: IPC-A-600G IPC-6012 WLCSP stencil design JESD-B111 AN3846 sac105 IPC 6012 WLCSP smt IPC-6016
    Text: Freescale Semiconductor Application Note AN3846 Rev. 2.0, 8/2009 Wafer Level Chip Scale Package WLCSP 1 Purpose The purpose of this Application Note is to outline the basic guidelines to use the Wafer Level Chip Scale Package (WLCSP) to ensure consistent Printed Circuit Board (PCB)


    Original     		PDF AN3846 SAC1205 IPC-A-600G IPC-6012 WLCSP stencil design JESD-B111 AN3846 sac105 IPC 6012 WLCSP smt IPC-6016

    ed12

    Abstract: No abstract text available
    Text: Plastic Packages for Integrated Circuits Wafer Level Chip Scale Package WLCSP 0.4mm Ball Pitch W2x2.4 2x2 ARRAY 4 BALL WAFER LEVEL CHIP SCALE PACKAGE D E PIN 1 TOP VIEW SYMBOL MILLIMETERS A 0.44 Min, 0.495 Nom, 0.55 Max A1 0.190 ±0.030 A2 0.305 ±0.025


    Original     		PDF