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    WAFER INCOMING Search Results

    WAFER INCOMING Result Highlights (3)

    Part ECAD Model Manufacturer Description Download Buy
    RJP1CS07DWA-00#W0 Renesas Electronics Corporation IGBT 1250V 150A Wafer Visit Renesas Electronics Corporation
    RJP65S08DWA-00#W0 Renesas Electronics Corporation IGBT 650V 200A Wafer Visit Renesas Electronics Corporation
    RJP1CS05DWA-80#W0 Renesas Electronics Corporation IGBT 1250V 75A Wafer Visit Renesas Electronics Corporation

    WAFER INCOMING Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: QUALITY ASSURANCE MILITARY & SPACE PRODUCTS Wafer Acceptance Flow for Space Qualified MMIC Receive Wafers Traceability PCM Review 1. Per P10N02, Receiving Inspection 2. Wafer Traceability, per 101099 Wafer Incoming Inspection Procedure 3. Per 101099, Wafer Incoming Inspection Procedure


    Original     		PDF P10N02, W10N03, MIL-STD-883, P15N01,

    Untitled

    Abstract: No abstract text available
    Text: v02.0106 Standard Process for Commercial MMIC Chips Die Receive Wafers 1. Per P10N02, Receiving Inspection Traceability 2. Per 101099, Wafer Incoming Inspection Procedure PCM Review 3. Per 101099, Wafer Incoming Inspection Procedure 4. Per W10N03, Wafer Inspection Procedure


    Original     		PDF P10N02, W10N03, MIL-STD-883 2011D P03N01, P09N02, W15N02, W10N02,

    asl1000

    Abstract: INCOMING MATERIAL INSPECTION wafer incoming outgoing inspection INSPECTION
    Text: QC WAFER FAB Supplier: Location: Quality System: BCD Semiconductor Manufacturing Limited Shanghai, China ISO9001:2000 Starting Material/Process Materials Incoming Material Inspection Fail Return to Vendor/ Corrective Action Wafer Inspection/ Test Fail Disposition per


    Original     		PDF ISO9001 asl1000 INCOMING MATERIAL INSPECTION wafer incoming outgoing inspection INSPECTION

    IPC-6012

    Abstract: IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525
    Text: Maxim > App Notes > General Engineering Topics Prototyping and PC- Board Layout Wireless and RF Keywords: chip scale package, flip chip, CSP, UCSP, U- CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-level packaging WLP and its applications Abstract: This application note discusses Maxim's wafer-level package (WLP). Topics include: wafer construction, tape-and-reel


    Original     		PDF 1000x com/an1891 AN1891, APP1891, Appnote1891, IPC-6012 IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525

    Nihon handa rx303-92skho

    Abstract: RX303-92SKHO VMMK-125 0402 land pattern INCOMING INSPECTION solder paste recommended land pattern for 0402 cap WLCSP stencil design VMMK-1225 AV02-1078EN land pattern for WLCSP
    Text: VMMK-1225 production assembly process Application Note 5378 Description Package Features Avago Technologies has combined our industry leading EpHEMT technology with a revolutionary wafer level chip scale package design WLCSP . This wafer level chip scale


    Original     		PDF VMMK-1225 VMMK-125 AV02-1078EN Nihon handa rx303-92skho RX303-92SKHO 0402 land pattern INCOMING INSPECTION solder paste recommended land pattern for 0402 cap WLCSP stencil design land pattern for WLCSP

    MIL-STD-883 Method 2010

    Abstract: MIL-STD-883 method 2003
    Text: HOLT PLASTIC PACKAGE PROCESS OPTIONS I = Industrial Grade -40°C to +85°C T = High Temp Grade (-55 °C to +125°C) M = Military Grade (-55°C to +125°C) PROCESS FLOW PROCESS STEP I T M INCOMING WAFER INSPECTION X X X WAFER PROBE 100% 100% 100% SAW X X


    Original     		PDF MIL-STD-883, MIL-STD-883 Method 2010 MIL-STD-883 method 2003

    RFMD

    Abstract: pcms WAFER
    Text:           Incoming Inspection Product Definition Specification Development Production Wafer? Technology Selection: "Optimum Technology Matching" No Yes Engineering Electrical Evaluation Wafer Inventory GaAs MESFET GaAs HBT Prototype


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: AN-617 Application Note One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Wafer Level Chip Scale Package by the Wafer Level Package Development Team GENERAL DESCRIPTION PURPOSE


    Original     		PDF AN-617 AN03272-0-5/12

    Untitled

    Abstract: No abstract text available
    Text: Am29LV200B Known Good Wafer Data Sheet Retired Product Am29LV200B Known Good Wafer Cover Sheet This product has been retired and is not recommended for designs. Please contact your Spansion representative for alternates. Availability of this document is retained for reference and historical purposes only.


    Original     		PDF Am29LV200B

    SAC1205

    Abstract: IPC-A-600G IPC-6012 WLCSP stencil design JESD-B111 AN3846 sac105 IPC 6012 WLCSP smt IPC-6016
    Text: Freescale Semiconductor Application Note AN3846 Rev. 2.0, 8/2009 Wafer Level Chip Scale Package WLCSP 1 Purpose The purpose of this Application Note is to outline the basic guidelines to use the Wafer Level Chip Scale Package (WLCSP) to ensure consistent Printed Circuit Board (PCB)


    Original     		PDF AN3846 SAC1205 IPC-A-600G IPC-6012 WLCSP stencil design JESD-B111 AN3846 sac105 IPC 6012 WLCSP smt IPC-6016

    AM29F200BB support

    Abstract: No abstract text available
    Text: SUPPLEMENT Am29F200B Known Good Wafer 2 Megabit 256 K x 8-Bit/128 K x 16-Bit CMOS 5.0 Volt-only, Boot Sector Flash Memory, Die Revision 1 Note: This supplement contains information on the Am29F200B in Known Good Wafer form. Refer to the Am29F200B standard datasheet (publication 21526) for full electrical specifications.


    Original     		PDF Am29F200B 8-Bit/128 16-Bit) 20-year AM29F200BB support

    8050 equivalent

    Abstract: No abstract text available
    Text: SUPPLEMENT Am29LV400B Known Good Wafer 4 Megabit 512 K x 8-Bit/256 K x 16-Bit CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revision 1 Note: This supplement contains information on the Am29LV400B in Known Good Wafer form. Refer to the Am29LV400B standard datasheet (publication 21523) for full electrical specifications.


    Original     		PDF Am29LV400B 8-Bit/256 16-Bit) 20-year 8050 equivalent

    Untitled

    Abstract: No abstract text available
    Text: SUPPLEMENT Am29LV800B Known Good Wafer 8 Megabit 1 M x 8-Bit/512 K x 16-Bit CMOS 3.0 Volt-only, Boot Sector Flash Memory—Die Revision 2 Note: This supplement contains information on the Am29LV800B in Known Good Wafer form. Refer to the Am29LV800B standard datasheet (publication 21490) for full electrical specifications.


    Original     		PDF Am29LV800B 8-Bit/512 16-Bit) 20-year

    Sample form for INCOMING Inspection of RAW MATERIAL

    Abstract: INCOMING RAW MATERIAL INSPECTION method INCOMING RAW MATERIAL INSPECTION form visual inspection of raw materials INCOMING MATERIAL FLOW PROCESS INCOMING RAW MATERIAL process flow INCOMING RAW MATERIAL INSPECTION INCOMING RAW MATERIAL Quality INCOMING PACKAGING MATERIAL INSPECTION form MIL-STD-105D
    Text: QUALITY ASSURANCE & MANUFACTURING FLOW STANDARD MOLDED PROCESS PRODUCTION CONTROL MATERIAL RECEIPT Critical raw materials received. QUALITY CONTROL GATE – INCOMING INSPECTION Raw materials inspected against DS-IMP procurement specifications. WAFER FABRICATION


    Original     		PDF

    INCOMING RAW MATERIAL INSPECTION

    Abstract: INCOMING RAW MATERIAL INSPECTION method INCOMING Plate INSPECTION INCOMING RAW MATERIAL INSPECTION form INCOMING RAW MATERIAL flowchart INCOMING RAW MATERIAL LINEAR TECHNOLOGY mark code inspection sampling plan INCOMING RAW MATERIAL INSPECTION chart mil-std-883 2015 Gold Ball Bond Shear
    Text: Pg. 1 of 3 ATTACHMENT 2. ASSEMBLY FLOWCHART INCOMING Vendor: Product: Package: Location of Wafer Fab: Assembly: Final Test: Q.C. Test Source Accept Test: Quality Contact: Linear Technology Corporation Bipolar Process 3 Lead SOT-223 Linear Technology Corp., Milpitas,


    Original     		PDF OT-223 MIL-STD-883 INCOMING RAW MATERIAL INSPECTION INCOMING RAW MATERIAL INSPECTION method INCOMING Plate INSPECTION INCOMING RAW MATERIAL INSPECTION form INCOMING RAW MATERIAL flowchart INCOMING RAW MATERIAL LINEAR TECHNOLOGY mark code inspection sampling plan INCOMING RAW MATERIAL INSPECTION chart mil-std-883 2015 Gold Ball Bond Shear

    LINEAR TECHNOLOGY mark code

    Abstract: INCOMING RAW MATERIAL INSPECTION INCOMING RAW MATERIAL INSPECTION chart INCOMING Plate INSPECTION INCOMING RAW MATERIAL INSPECTION form INCOMING RAW MATERIAL INSPECTION method wafer prober INCOMING RAW MATERIAL flowchart aql incoming inspection INCOMING MATERIAL FLOW PROCESS
    Text: ATTACHMENT 2. ASSEMBLY FLOWCHART Pg. 1 of 3 INCOMING Vendor: Product: Package: Location of Wafer Fab: Assembly: Final Test: Q.C. Test Source Accept Test: Quality Contact: Linear Technology BIPOLAR PROCESS TO-3P Linear Technology Chinteik Thailand, Linear Technology


    Original     		PDF MIL-STD-883 LINEAR TECHNOLOGY mark code INCOMING RAW MATERIAL INSPECTION INCOMING RAW MATERIAL INSPECTION chart INCOMING Plate INSPECTION INCOMING RAW MATERIAL INSPECTION form INCOMING RAW MATERIAL INSPECTION method wafer prober INCOMING RAW MATERIAL flowchart aql incoming inspection INCOMING MATERIAL FLOW PROCESS

    INCOMING RAW MATERIAL INSPECTION

    Abstract: 7224 markem INCOMING RAW MATERIAL INSPECTION chart INCOMING RAW MATERIAL flowchart Markem 7224 Ink INCOMING RAW MATERIAL INSPECTION form INCOMING RAW MATERIAL INSPECTION method LINEAR TECHNOLOGY mark code asm chart INCOMING RAW MATERIAL
    Text: ATTACHMENT 2. ASSEMBLY FLOWCHART Pg. 1 of 3 INCOMING Vendor: Product: Package: Location of Wafer Fab: Assembly: Final Test: Q.C. Test Source Accept Test: Quality Contact: Linear Technology BIPOLAR PROCESS DD PACK Linear Technology Penang & Carsem Linear Technology


    Original     		PDF MIL-STD-883 INCOMING RAW MATERIAL INSPECTION 7224 markem INCOMING RAW MATERIAL INSPECTION chart INCOMING RAW MATERIAL flowchart Markem 7224 Ink INCOMING RAW MATERIAL INSPECTION form INCOMING RAW MATERIAL INSPECTION method LINEAR TECHNOLOGY mark code asm chart INCOMING RAW MATERIAL

    IGBT THEORY AND APPLICATIONS 400V

    Abstract: TEK 370A tesec IGBT THEORY AND APPLICATIONS bj transistor igbt high voltage pnp transistor 700v jfet curve tracer short circuit tracer schematic bipolar transistor tester AN10861
    Text: Application Note AN-1086 BVCES Testing Considerations for Ultra-thin wafer B B Depletion Stop Trench IGBTs By Chiu Ng, Al Diy, Alberto Fernandez, Vijay Bolloju Table of Contents Page


    Original     		PDF AN-1086 1628/D. IGBT THEORY AND APPLICATIONS 400V TEK 370A tesec IGBT THEORY AND APPLICATIONS bj transistor igbt high voltage pnp transistor 700v jfet curve tracer short circuit tracer schematic bipolar transistor tester AN10861

    INCOMING RAW MATERIAL INSPECTION

    Abstract: INCOMING Plate INSPECTION INCOMING RAW MATERIAL INSPECTION method INCOMING RAW MATERIAL INSPECTION form INCOMING RAW MATERIAL flowchart CARSEM LINEAR TECHNOLOGY mark code mil-std-883 2015 Gold Ball Bond Shear INCOMING RAW MATERIAL INSPECTION chart INCOMING MATERIAL FLOW PROCESS
    Text: Pg. 1 of 3 ATTACHMENT 2. ASSEMBLY FLOWCHART INCOMING Vendor: Product: Package: Location of Wafer Fab: Assembly: Final Test: Q.C. Test Source Accept Test: Quality Contact: Linear Technology Corporation BIPOLAR PROCESS 3, 4, 5, 6 Lead SOT-23 Linear Technology Corp., Milpitas,


    Original     		PDF OT-23 MIL-STD-883 INCOMING RAW MATERIAL INSPECTION INCOMING Plate INSPECTION INCOMING RAW MATERIAL INSPECTION method INCOMING RAW MATERIAL INSPECTION form INCOMING RAW MATERIAL flowchart CARSEM LINEAR TECHNOLOGY mark code mil-std-883 2015 Gold Ball Bond Shear INCOMING RAW MATERIAL INSPECTION chart INCOMING MATERIAL FLOW PROCESS

    maxim CODE TOP MARKING

    Abstract: maxim TOP MARKING maxim package marking UCSP maxim assembly of code without underfill Solder paste stencil life INCOMING INSPECTION solder paste MAXIM Assembly Locations
    Text: 1 Maxim Integrated Products Assembly and Packaging Group Application Notes Wafer-Level Ultra-Chip-Scale Package 1.0 Introduction to Ultra-Chip-Scale Package UCSP The packaging technology in the Ultra-Chip-Scale Package (UCSP) enables the integrated circuit


    Original     		PDF enhan/198 maxim CODE TOP MARKING maxim TOP MARKING maxim package marking UCSP maxim assembly of code without underfill Solder paste stencil life INCOMING INSPECTION solder paste MAXIM Assembly Locations

    Mil-Std-883 Wire Bond Pull Method 2011

    Abstract: mil-std-883 mil-std-883 2015 MIL-STD883 MIL-STD-883 Method 2010 MIL-STD-883 method 2011 mil-std-883* 2015 centrifuge
    Text: HOLT CERAMIC PACKAGE PROCESS OPTIONS I = Industrial Grade -40°C to +85°C M = Military Grade (- 55°C to +125°) T = High Temp Grade (-55°C to +125°C) DSCC = Mil-STD-883 Compliant PROCESS FLOW PROCESS STEP I T M DSCC COMMENTS X X X X INCOMING WAFER INSPECTION


    Original     		PDF Mil-STD-883 MIL-STD-883, Mil-Std-883 Wire Bond Pull Method 2011 mil-std-883 2015 MIL-STD883 MIL-STD-883 Method 2010 MIL-STD-883 method 2011 mil-std-883* 2015 centrifuge

    IPC-6011

    Abstract: IPC-D-279 IPC-6013 ipc 7094 IPC-6012 IPC-2223 IPC 6012 IPC-6016 IPC-2221 IPC-2222
    Text: Maxim > App Notes > General Engineering Topics Prototyping and PC-Board Layout Wireless, RF, and Cable Keywords: chip scale package, flip chip, CSP, UCSP, U-CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-Level Packaging WLP and Its Applications


    Original     		PDF 1000x com/an1891 AN1891, APP1891, Appnote1891, IPC-6011 IPC-D-279 IPC-6013 ipc 7094 IPC-6012 IPC-2223 IPC 6012 IPC-6016 IPC-2221 IPC-2222

    PHHI

    Abstract: phui PGYI TPS79301 TPS79318 TPS79325 TPS79328 TPS793285 TPS79330 TPS79333
    Text: DBV 5 DBV 6 TPS79301, TPS79318 TPS79325, TPS79328, TPS793285 TPS79330, TPS79333, TPS793475 YEQ, YZQ www.ti.com SLVS348I – JULY 2001 – REVISED MAY 2005 ULTRALOW-NOISE, HIGH PSRR, FAST RF 200-mA LOW-DROPOUT LINEAR REGULATORS IN NanoStar WAFER CHIP SCALE AND SOT23


    Original     		PDF TPS79301, TPS79318 TPS79325, TPS79328, TPS793285 TPS79330, TPS79333, TPS793475 SLVS348I 200-mA PHHI phui PGYI TPS79301 TPS79318 TPS79325 TPS79328 TPS793285 TPS79330 TPS79333

    PGVI

    Abstract: phui PHHI PGYI TPS79333DBVR TPS79301 TPS79318 TPS79325 TPS79328 sot 23 x 316
    Text: DBV 6 DBV 5 TPS79301, TPS79318 TPS79325, TPS79328, TPS793285 TPS79330, TPS79333, TPS793475 YEQ www.ti.com SLVS348H – JULY 2001 – REVISED OCTOBER 2004 ULTRALOW-NOISE, HIGH PSRR, FAST RF 200-mA LOW-DROPOUT LINEAR REGULATORS IN NanoStar WAFER CHIP SCALE AND SOT23


    Original     		PDF TPS79301, TPS79318 TPS79325, TPS79328, TPS793285 TPS79330, TPS79333, TPS793475 SLVS348H 200-mA PGVI phui PHHI PGYI TPS79333DBVR TPS79301 TPS79318 TPS79325 TPS79328 sot 23 x 316