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    WAFER CONNECTOR Search Results

    WAFER CONNECTOR Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MP-54RJ45UNNE-002 Amphenol Cables on Demand Amphenol MP-54RJ45UNNE-002 Cat5e Non-Booted Patch Cable with RJ45 Connectors (350MHz) 2ft Datasheet
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    MP-54RJ45UNNE-001 Amphenol Cables on Demand Amphenol MP-54RJ45UNNE-001 Cat5e Non-Booted Patch Cable with RJ45 Connectors (350MHz) 1ft Datasheet
    CN-ACPRREDAA0 Amphenol Cables on Demand RCA Male Plug Cable Connector (Red) - Amphenol ACPR-RED - Gold Plated Diecast Shell Datasheet
    CN-DSUB50PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals Datasheet

    WAFER CONNECTOR Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    YY11CT

    Abstract: YY5CT wire to wire YY12CT Wafer Connector YY4Nxx YY10CT yy5cxx YY9CT
    Text: Housing / Terminal & Wafer YY4Nxx Lock Wafer YY4Rxx Lock Wafer Right Angle YY5Cxx Housing (PINS 2-20) (PINS 2-20) (PINS 2-20) Y4 Y5 3.96mm YY6Nxx Wafer YY6Rxx Wafer (Right Angle) YY5CT Terminal (PINS 2-20) (PINS 2-20) (6K/ROLL) Y5 Y6 3.96mm YY7CRxx Housing


    Original     		PDF YY75CRxx YY75CPxx YY75CTR YY10CT YY10Cxx YY11Cxx YY11CT YY12CT YY12Cxx YY5CT wire to wire Wafer Connector YY4Nxx yy5cxx YY9CT

    Cascade Microtech

    Abstract: No abstract text available
    Text: High-stable HF wafer contact ideal for automated wafer testing Z Probe High-Frequency Wafer Probe GS/SG 10 GHz A Ground-Signal (GS) coniguration is the most cost-effective RF design as less wafer space is taken up with contact pads. Cascade Microtech’s |Z| Probe in a GS/SG coniguration enables wafer-level testing with the highest accuracy and throughput available while


    Original     		PDF ZProbe10-ss-0310 Cascade Microtech

    IC weight sensor

    Abstract: chloride ups circuit diagram relay 24v omron two leg infrared receiver led 12V ENERGY LIGHT CIRCUIT DIAGRAM EE-SPX303 hydrocarbon sensor hydrogen gas sensor omron plc Pulsating photoelectric Optical Sensor datasheet
    Text: Wafer-carrier Mounting Photomicrosensors EE-SPY801/802 Photomicrosensors for detecting wafer-carrier mounting. • The mounting position is set with a pedestal. ■ The contact surface with the wafer carrier uses a special chemical-resistant fluoro-resin.


    Original     		PDF EE-SPY801/802 EE-SPY801 IC weight sensor chloride ups circuit diagram relay 24v omron two leg infrared receiver led 12V ENERGY LIGHT CIRCUIT DIAGRAM EE-SPX303 hydrocarbon sensor hydrogen gas sensor omron plc Pulsating photoelectric Optical Sensor datasheet

    UN-D1400

    Abstract: WLCSP stencil design AN10439 EIA541 IEC60286 WLCSP chip mount Service Manual smd rework station Wafer Level Chip Size Package und14
    Text: AN10439 Wafer Level Chip Size Package Rev. 03 — 17 October 2007 Application note Document information Info Content Keywords wafer, level, chip-scale, chip-size, package, WLCSP Abstract This application note provides guidelines for the use of Wafer Level Chip


    Original     		PDF AN10439 AN10365 AN10439 UN-D1400 WLCSP stencil design EIA541 IEC60286 WLCSP chip mount Service Manual smd rework station Wafer Level Chip Size Package und14

    Untitled

    Abstract: No abstract text available
    Text: R Silicon Wafer Mapping Sensor F3M-S825-1 Allows Simultaneous Mapping of Up to 25 Silicon Wafers H Economical—one sensor detects most wafer types H 200 mm wafer size H Automatic and remote teaching capability H Self-diagnostic functions reduce downtime Ordering Information


    Original     		PDF F3M-S825-1 35-mm F3M-S825-1 F3M-S825-1, 1-800-55-OMRON D063-E3-825

    Untitled

    Abstract: No abstract text available
    Text: R Silicon Wafer Mapping Sensor F3M-S Allows Simultaneous Mapping of up to 25 Silicon Wafers H Economical, one sensor detects most wafer types, including dummy wafers H Models match wafer sizes of 300 mm, 200 mm and 150 mm H Automatic and remote teaching capability


    Original     		PDF 76-mm F3M-S625 F3M-S626 F3M-S825 F3M-S826 F3M-S1213 F3M-S1225 35-roperties 1-800-55-OMRON

    750197213

    Abstract: No abstract text available
    Text: HS Dock Receptacle Wafer Extractor Tool HS Dock™ Wafer Extraction Tool Application Tooling Specification Sheet Order No. 62202-3400 FEATURES This tool is designed for the removal of the wafer sub-assembly from a Right Angle HS Dock™ Receptacle connector assembly. To remove wafers from a plug assembly, use tool 62202-0220, 62202-0260, 622020280, or 62202-0290.


    Original     		PDF ATS-622023400 750197213

    OCI 531

    Abstract: m1b marking s1225 IEC60529 F3M-S1213 F3M-S1225
    Text: R Silicon Wafer Mapping Sensor F3M-S Allows Simultaneous Mapping of up to 25 Silicon Wafers H Economical, one sensor detects most wafer types, including dummy wafers H Models match wafer sizes of 300 mm, 200 mm and 150 mm H Automatic and remote teaching capability


    Original     		PDF 76-mm F3M-S625 35-mm F3M-S626 F3M-S825 F3M-S826 F3M-S1213 1-800-55-OMRON OCI 531 m1b marking s1225 IEC60529 F3M-S1213 F3M-S1225

    15001LR

    Abstract: 20022WS 20022WS-02A00 20022WS-03A00 20022WS-04A00 20022WS-05A00 20022WS-06A00 20022WS-07A00 20022WS-08A00 FFC 0.8mm
    Text: 2.00mm 0.079" PITCH CONNECTOR Material 20022WS Series Wire-to-Board Wafer I/NO 1 2 3 SMT Straight DESCRIPTION WAFER PIN HOOK Available Pin PARTS NO. 20022WS-02A00 20022WS-03A00 20022WS-04A00 20022WS-05A00 20022WS-06A00 20022WS-07A00 20022WS-08A00 20022WS-09A00


    Original     		PDF 20022WS 20022WS-02A00 20022WS-03A00 20022WS-04A00 20022WS-05A00 20022WS-06A00 20022WS-07A00 20022WS-08A00 20022WS-09A00 20022WS-10A00 15001LR 20022WS-02A00 20022WS-03A00 20022WS-04A00 20022WS-05A00 20022WS-06A00 20022WS-07A00 20022WS-08A00 FFC 0.8mm

    20015LR

    Abstract: 20022WR-04A00 20022WR02 20022WR 20022WR-02A00 20022WR-03A00 20022WR-05A00 20022WR-06A00 20022WR-07A00 20022WR-08A00
    Text: 2.00mm 0.079" PITCH CONNECTOR Material 20022WR Series Wire-to-Board Wafer I/NO 1 2 3 SMT Right Angle DESCRIPTION WAFER PIN HOOK TITLE 20022WR 20015LR Available Pin PARTS NO. 20022WR-02A00 20022WR-03A00 20022WR-04A00 20022WR-05A00 20022WR-06A00 20022WR-07A00


    Original     		PDF 20022WR 20022WR 20015LR 20022WR-02A00 20022WR-03A00 20022WR-04A00 20022WR-05A00 20022WR-06A00 20022WR-07A00 20022WR-08A00 20015LR 20022WR-04A00 20022WR02 20022WR-02A00 20022WR-03A00 20022WR-05A00 20022WR-06A00 20022WR-07A00 20022WR-08A00

    MIL-STD-202f Method 106e

    Abstract: No abstract text available
    Text: LANGUAGE PRODUCT SPECIFICATION ENGLISH 8624 Dual Row Wafer Header .025 Sq. Pins on .100 Grid w/Break Off Option 1.0 SCOPE: This specification covers a dual row wafer (header) system on .100 grid. The wafer (header) body has a low profile, and the system is designed for printed circuit board mounting. The pins are .025(.064mm)


    Original     		PDF 064mm) U81681 ES-4000-3006 UDT2001-0676 PS-8624-001 ES-4000-3996 95/MAR/10 U5-0926 DCBRD07 MIL-STD-202f Method 106e

    SMAW250-03g

    Abstract: SMAW250-02G SMAW250-04G SMAW250-NNG SMAW250-05G SMAW250-07G SMAW250-11G SMAW250-NN PA66 GF 25 connector 064c
    Text: 2.50mm 0.098" PITCH CONNECTOR Material SMAW250G Series Wire-to-Board Wafer I/NO 1 2 DIP DESCRIPTION TITLE MATERIAL PA66, UL94 V Grade WAFER SMAW250-NNG Brass & Tin-Plated PIN Right Angle Available Pin PARTS NO. SMAW250-02G SMAW250-03G SMAW250-04G SMAW250-05G


    Original     		PDF SMAW250G SMAW250-NNG SMAW250-02G SMAW250-03G SMAW250-04G SMAW250-05G SMAW250-06G SMAW250-07G SMAW250-08G SMAW250-09G SMAW250-03g SMAW250-02G SMAW250-04G SMAW250-NNG SMAW250-05G SMAW250-07G SMAW250-11G SMAW250-NN PA66 GF 25 connector 064c

    wafer connector 1.25

    Abstract: 12507WR-02LD 12507WR-03LD 12507WR-04LD 12507WR-05LD 12507WR-06LD 12507WR-07LD 12507WR-08LD 12507WR-NNLD 20032LR
    Text: 1.25mm 0.049" PITCH CONNECTOR Material 12507WR-NNLD Series Wire-to-Board Wafer I/NO DESCRIPTION TITLE MATERIAL 1 WAFER 12507WR-NNLD PA46 or PA6T, UL 94V Grade 2 Brass & Tin plated PIN 3 Brass & Tin plated HOOK 20032LR DIP Right Angle Available Pin PARTS NO.


    Original     		PDF 12507WR-NNLD 20032LR 12507WR-02LD 12507WR-03LD 2507W-05LD 12507WR-06LD 12507WR-07LD 12507WR-08LD 12507WR-09LD wafer connector 1.25 12507WR-02LD 12507WR-03LD 12507WR-04LD 12507WR-05LD 12507WR-06LD 12507WR-07LD 12507WR-08LD 20032LR

    0 shape header with square pins

    Abstract: MFAS156 mfss156 CT156F CE156F
    Text: MAS-CON* IDC Connectors A23 l-Y ¿¿>105-09 .156" £ Molded Wafer Flat Headers Performance Data MATERIALS Wafer: Pin: Plating: PANDUIT’S .156" centerline molded wafer flat header is available in straight or right angle post versions in circuit sizes 2 through


    OCR Scan     		PDF 15jji" MFSS15 MFSR15 0 shape header with square pins MFAS156 mfss156 CT156F CE156F

    LSS156

    Abstract: No abstract text available
    Text: _ MAS-CON*1DC Connectors A25 .156" £ M olded Wafer Locking Headers Performance Data M ATERIALS Wafer: Pin: Plating: PANDUIT’S .156" centerline locking header has a locking backwall that friction latches its mating connector to prevent an open


    OCR Scan     		PDF LSS15 L8S15 LSR15 S156-1B LSS156

    20010WR05

    Abstract: 20010WR 20010WR-02000 20010WR-03000 20010WR-04000 pa66 45
    Text: 2.00mm 0.079" PITCH CONNECTOR DIP type Material 20010WR Series Wire-to-Board Wafer DIP I/NO DESCRIPTION 1 WAFER 2 PIN TITLE 2001OWR MATERIAL PA66, UL94V Grade BRASS & Tin Plated Right Angle Available Pin PARTS NO. 20010WR-02000 5.6 4.5 2.0 20010WR-03000


    OCR Scan     		PDF 20010WR rt-03 2001OWR UL94V 20010WR-02000 20010WR-03000 20010WR-04000 20010WR-05000 20010WR-06000 20010WR-07000 20010WR05 pa66 45

    35001HS

    Abstract: 35002WR 35002WR-02A00 PA46
    Text: 3.50mm 0.138" PITCH CONNECTOR DIP type Material 35002WR Series Wire-to-Board Wafer DIP I/NO DESCRIPTION 1 WAFER 35002WR PA46 or PA6T.UL94V Grade PIN 35002PR Phosphor Bronze & Tin plated HOOK 35002LR Brass & Tin-Plated 2 3 Right Angle TITLE MATERIAL Available Pin


    OCR Scan     		PDF 35002WR UL94V 35002PR 35002LR 35002WR-02A00 30mfi AC3800V/1min 1000MQ/min 35001HS PA46

    MLAS156

    Abstract: CT156F MLSs156 MLSS156-20-O CE156F MLSS156-22 MLSS156-2 MLAS156-14-D MLSS156-11 MLSS156-13-D
    Text: MAS-CON \DC Connectors A25 A-¿>/'05-C5 3 .156" <£ Molded Wafer Locking Headers Performance Data MATERIALS Wafer: Pin: Plating: PANDUIT’S .156" centerline locking header has a locking backwall that friction latches its mating connector to prevent an open


    OCR Scan     		PDF -6I-05-C5 MLSS156-18d MLSR156-18-D MLAS156-18d MLSR156- MLAS156- MLSS156-19d MLSR156-19-D MLAS156-19-D MLSS156-8-Q MLAS156 CT156F MLSs156 MLSS156-20-O CE156F MLSS156-22 MLSS156-2 MLAS156-14-D MLSS156-11 MLSS156-13-D

    20015LR

    Abstract: 40006WR-02A00 40006WR
    Text: SMT 4.00mm 0.157" PITCH CONNECTOR type Material Wire-to-Board Wafer 40006WR Series l/NO DESCRIPTION 1 WAFER SMT 2 PIN Right Angle 3 HOOK TITLE MATERIAL 40006WR PPS.UL94V Grade 20015LR Brass & Tin-Plated Brass & Tin-Plated Available Pin PARTS NO. 40006WR-02A00


    OCR Scan     		PDF 40006WR UL94V 20015LR 40006WR-02A00 -25TC- AC1800V/1min 1000MQ

    YDAW200-16

    Abstract: YDAW200 YDAW200-24 YDAW200-22 YDAW200-04 YDAW200-06 YDAW200-08 YDAW200-10 YDAW200-12 YDAW200-14
    Text: DIP 2.00mm 0.079" PITCH CONNECTOR Wire-to-Board Wafer YDAW200 Series type Material DIP Right Angle I/NO DESCRIPTION 1 2 WAFER PIN TITLE YDAW200 MATERIAL PA66, UL 94V Grade Brass & Tin-Plated Available Pin PARTS NO. YDAW200-04 YDAW200-06 YDAW200-08 YDAW200-10


    OCR Scan     		PDF YDAW200 YDAW200-04 YDAW200-06 YDAW200-08 YDAW200-10 YDAW200-12 YDAW200-14 YDAW200-16 YDAW200-18 YDAW200-24 YDAW200-22

    YBD254B

    Abstract: YBD254B-52E YBD254B-NNE
    Text: DIP 2.54mm 0.100" PITCH CONNECTOR Board-to-Board Wafer YBD254B-NNE Series typ Material DIP Right Angle l/NO DESCRIPTION 1 2 WAFER PIN TITLE MATERIAL PBT, UL94V Grade YBD254B-52E Brass & Gold-Plated Available Pin PARTS NO. YBD254B -10E YBD254B -12E YBD254B -14E


    OCR Scan     		PDF YBD254B-NNE YBD254B-52E UL94V YBD254B

    PA66 GF 25

    Abstract: pa66 fr YFW800-04BL YFW800-NNBL
    Text: 8.00m m type 0.315" PITCH CONNECTOR YFW800-NNBL Series Wire-to-Board Wafer DIP Material DIP I/NO DESCRIPTION 1 WAFER 2 PIN TITLE MATERIAL PA66, UL94V Grade YFW800-NNBL Brass &Tin-Plated Straight Available Pin PARTS NO. DIM. A YFW800-04BL 34.0 I Specification


    OCR Scan     		PDF YFW800-NNBL UL94V YFW800-04BL AC1500V/1min 1000MQ PA66 GF 25 pa66 fr

    Untitled

    Abstract: No abstract text available
    Text: _ MAS-CON* IDC Connectors A23 .156" £ Molded Wafer Flat Headers Performance Data MATERIALS Wafer: Polyester, U.L. 94 V-0 Rated Pin: Copper Alloy Plating: 2 0 0 /" Tin Over Nickel 3 0 /" Gold Over Nickel (Contact factory 15(jl" Gold Over Nickel (Contact factory)


    OCR Scan     		PDF MFSS156-14-D 156-15-D MFSS156-16-D MFSS156-17-D MFSS156-18-D MFSS156-19-D MFSS156-20-D MFSS156-21-D 156-22-D MFSS156-23-D

    E108706

    Abstract: SMAW250-08V SMAW250 SMAW250-22V SMAW250-NNV SMAW250-NN
    Text: 2.50mm 0.098" PITCH CONNECTOR Material Wire-to-Board Wafer SMAW250-NNV Series DIP I/NO DESCRIPTION 1 WAFER 2 PIN TITLE MATERIAL PA66, UL94V Grade SMAW250 - NN V Brass & Tin-Plated Right Angle Available Pin A B C SMAW250 - 04V 7.45 5.8 2.50 SMAW250 - 06V


    OCR Scan     		PDF SMAW250-NNV SMAW250 UL94V SMAW250- E108706 SMAW250-08V SMAW250-22V SMAW250-NN