VQFP208 Search Results

VQFP208

Contextual Info: VQFP208 LSI Assembly Units : mm • VQFP208 156 30.6 28.0 105 104 208 53 1.25 1.25 30.6 28.0 157 1 H=3.5Max. The contents described herein are subject to change without notice. 52 Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any

VQFP208

Contextual Info: VQFP208 LSI Assembly • VQFP208 30.6±0.2 28.0±0.1 105 157 104 208 53 1 +0.05 0.17 -0.03 4 ±4 0.1 ± 0.05 3.3± 0.05 3.5MAX 1.25 52 1PIN MARK +0.05 0.22 -0.04 0.08 S 0.08 M 0.5± 0.1 Units : mm The contents described herein are subject to change without notice.

VQFP208

Abstract: 30602
Contextual Info: VQFP208 LSI Assembly Units : mm • VQFP208 30.6±0.2 28.0±0.1 156 105 1.25 0.1±0.05 3.5Max. 3.3±0.05 53 52 1 1.25 208 0.5±0.15 1.3±0.2 104 28.0±0.1 30.6±0.2 157 0.17+0.05 −0.03 4°±4° 0.08 S 0.5±0.1 +0.05 0.22−0.04 0.08 M ∗ The contents described herein are subject to change without notice.

vqfp100 package

Contextual Info: ravim •BU12200 series Parameter Integrated counts BU12206 BU12207 DU12208 BU12209 BU12210 Total No. of gates 5760 10476 13888 20100 25200 43560 Usable gates 3168 5762 7638 11055 13B60 23958 Total No. of PADs 88 108 128 152 168 216 No. of l/Os 78 98 118 142

Contextual Info: Dimensions m h #SIP/HSIP POW ER T Y P E /ZIP/SZIP (Unit : mm) TO-22QFP TO-92 0.510.1 0 .4 5 ± 0 .l 2.54 ± 0.5 SIPS FTR I I -8 ± 0 .2 I6 .8 ± 0 .2 2 .8 ± 0 .2 I9 .3 ± 0 .2 j_ 0 .3 ± 0 . I 38 2 .4 ± 0 .Z SIP8 SIP7 SIP9 ° - 55i S : o s SIP 10 Z .8 ± 0 .2

BU12108

Abstract: BU12101 BU12100 vqfp100 package
Contextual Info: CMOS Gate array CM OS gate array/BU12100 series high integration # BUI2100 series BU12101 BUI2102 BUI2103 BUI2104 BU12105 BU12155 BU12106 BUI2107 BU12108 BUI2109 BU12H0 BU12YH BU12«3 Parameter Integrated counts Total No. of gates 1224 2496 3240 4352 5616

03mn

Contextual Info: Introduction Standard IC packages SIP/HSIP Power type /ZIP/SZIP TO-92 TO-220FP 3.7i 0 7 U iO ? r ' □ _ 0 S ID I I 21 f 1 128 üi p 0 45 tO. I _ Q [?.3 10.8 3 1.27 2 .5 4 1 0 .5 FTR JI [? .5 4 ± 0 .5 SIP5 2. 0 . 0.2 I I . B i d .2 2M 2.bä^ SIP7 SIP8 16 .8 10 .2

SIP10

Contextual Info: Introduction Standard 1C packages SIP/HSIP Power type /ZIP/SZIP TO-92 TO-22QFP □ w O .S I O .I 0 .« ± 0 .l FTR SIP5 I l.8 ± 0 .2 n tv - I i ] I 0.5 5 ± 0 ,1 2.54 r 2 .4 ± 0 .2 1 n □ i H 0 .6 0.8 1 o .3 ± 0 . > I ¿J SIP7 SIP8 uwii) wii; w Jtr v ll lil U

BU12101

Abstract: BU12110 BU16503 BU12300 BU12104 vqfp100 package BU16515 8038 function generator application 16x4 ram vhdl BU242
Contextual Info: Introduction Microcontrollers and CMOS gate arrays Following is a summary of the microcontrollers and CMOS gate arrays offered by ROHM. For further details and data sheets for these devices, please contact your local representative. 4-bit single chip microcontrollers

ZM 1182

Abstract: 03IJH
Contextual Info: Standard 1C packages SIP/HSIP Power type /ZIP/SZIP TO-92 TO-22QFP FTR SIP5 11.8±0.2 3 — b B 2.4±0.2 i ¥ 0.6 0.8 SIP7 SIP8 SIP9 SIP10 Audio Integrated Circuits MHrn n |0 .3 ± 0 . I 21 HSIP10 SIP-M12 3.6±02 HSIP-B12 ZIP9 J t t e ZIP12 ZIP16 I 0.5±0. I

vqfp100 package

Abstract: TO220CP-3 TQFP128U SOP8 package tray VSOF5 TQFP176U TSSOP-B8J TSSOP-B14 tl 32 icp VQFP100
Contextual Info: Product Designation Company info Page 1 of 2 Products > LSIs Lineup • LSI Packages > Product Designation Sales Products LSIs ROHM LSI Solution General-purpose LSIs Mobile Phone LSIs Product Designation •When ordering, specify the part number. •Check each code against the tables shown below.

SOP42

Contextual Info: SIP-M12 HSIP10 +\ +i L_ ' HSIP-B12 ZIP9 3 0 .0 + 0 .3 I l.8±0.2 2 8 .5 + 0 .2 r~ H ¥i| • '“ i J I J ^ o .s t o . 2 8 ZIP 16 ZIP 12 I r r I9 .3 ± 0 .2 -1 | 0 .5 5 ± 0 . I 0 .5 + 0 . I I 2 .7 5 ± D .25 E 5 2 H 2 S 5 D 2 12 Z F 18 SZIP24 1,0.5610.:

BU163

Abstract: 63536
Contextual Info: ranún •BU16300 series BU16308 BÜ16309 BU16310 BU163H Total No. of gates 33220 49312 63536 110400 Usable gates 14392 21269 27343 47489 Total No. of PADs 120 144 160 208 No. of l/O s 104 128 144 192 Parameter Integrated counts 5.0V±5% I/0 only , 5.0V±10%(I/0 only), 2.7V~3.6V

vqfp100 package

Abstract: S2P24 BA4558F-T1
Contextual Info: Packaging Packaging type Package DIP/SDIP Tube SIP/HSIP/ZtP/SZIP Tube Packaging code Tube SOP/SSOP/HSOP QFP/SQFP/VQFP Paper taping T l, T2 Difference in taping direction Embossed taping E1, E2 (Difference in taping direction) Tray VP Tray (dry pack) FTR/TO-92/TO-220/TO-220FP

vqfp100 package

Abstract: TQFP128U SSOP-A20 Contact Image Sensor VQFP100
Contextual Info: Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use, therefore, please request

BU12101

Abstract: BU12300 vqfp100 package
Contextual Info: CMOS Gate array CMOS gate array/BU12100 series high integration •BU12100 series BU12101 BU12102 BU12103 BUI2104 BU12105 BU12155 BU12106 BLM2107 BUI2108 BUI2109 BU12ÎIO BU12ÎI1 BU12113 Param eter T otal No. o f gates 1224 2496 3240 4352 5616 7216 9200

vqfp100 package

Abstract: VQFP-100 Tray SOP24 065j SCHP30 p04m BA4558F-T1 SQFP-144
Contextual Info: Dimensions I l l II I I I I Dimensions •DIP/SDIP/SK-DIP Unit : mm DIP 14 DIP8 o o 0. 5+ 0. I O’ - |[o's±o. 15" 1 O' ~ I 5 ' DIP 18 DIP 16 o 19 . 4 ± 0. 3 l?6_ ' o 9 -t-i I l;.5±o, I ’o" DIP22 DIP20 22 O 12 () ) o O H J v °.5 .± 0 . I 0.5± 0. I

Contextual Info: •SIP/HSIP{POWER TYPE /ZIP/SZIP T0220FP TO-92 ¿ 3 .2 ± 0 .1 n I 2.8 ?T 0.5±0.1 1.27 ! I 0 .45±D. I 1.27 2 .5 4 ± 0 .5 [2 .5 4 ± 0 . 5 Q‘ S ^ a SIPS P ll.8±0.2 2.d±0.2 □ U °-6 U 3 _c I °_'._55±0-1 I I 0.8 0 45±Q. I I".3 2.54 ]2.64 ^ SIPS SIP7

68fl

Contextual Info: Introduction Standard IC packages SIP/HSIP Power typey/ZIP/SZIP TO-220FP TO-92 10-0 ? 4>3 .2 ± 0 .1 I I 2 .8 _ TÏ— ? 1.3 0.8 3 2 .s * ± 0 . s \ [ ¡, 2 . 5 4 * 0.5 SIP5 FTR r H .B ± 0 .2 UÎ-jJiÜ 1 I q 2 .4 ± 0 .2 Î 0.6 0.8 Uj a SIP8 SIP7 I6 .8 ± 0 .2

RPM600

Abstract: T0220FP-5-V5
Contextual Info: IC P a c k a g e Dimensions Diagram (Unit : mm) Monolithic ICs SIP/HSIP (POWER TYPE) /ZIP/SZIP •T 0 2 20 F P #T0220FP-5(V5) #T0220FP-5 4 .5 1 r - ; 2-B-Ö:, r~ ~ I o ,1 .3 0 .8 2 .5 4 ± 0 - 5 3 2 . 5 4 = :0 .5 •°-U|L • °-5 5 •S IP 8 •S IP 7

BU12307

Abstract: vqfp100 package BU12310
Contextual Info: CMOS Gate array CMOS gate array/BU12300 series ultra multiple pin type •BU12300 seríes BU12307 Parameter Integrated counts BU12308 BU1230Q BU12310 BU123Î1 Total No. of gates 4650 6660 10282 12744 22152 Usable gates 2502 3764 5655 7009 12183 Total No. of PADs