131-4114-11D
Amphenol Communications Solutions
Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
131-4114-11H
Amphenol Communications Solutions
Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
10136353-14111LF
Amphenol Communications Solutions
Minitek® 1.5mm Wire to Board Receptacle Right Angle Surface Mount Type, Tin plating, 14 positions
10132450-1411GLF
Amphenol Communications Solutions
Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 14 Positions, GW Compatible PA9T, Tray packing.
68771-411HLF
Amphenol Communications Solutions
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions, 2.54 mm Pitch, Vertical, 6.86 mm (0.27 in.) Mating, 2.54 mm (0.1 in.) Tail
