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    USV KI Search Results

    USV KI Result Highlights (1)

    Part ECAD Model Manufacturer Description Download Buy
    7UL1G07FU Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Non-Inverter Buffer (Open Drain), USV, -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    SF Impression Pixel

    USV KI Price and Stock

    Crowd Supply CS-USVC-KIT-03

    Crowd Supply Accessories Power & Data Cables
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    Mouser Electronics CS-USVC-KIT-03 26
    • 1 $4.51
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    Crowd Supply CS-USVC-KIT-02

    Crowd Supply Accessories 3D-Printed Enclosure for uSVC
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    Mouser Electronics CS-USVC-KIT-02 21
    • 1 $12.54
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    Crowd Supply CS-USVC-KIT-04

    Development Boards & Kits - Other Processors Microcontroller development board
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    Mouser Electronics CS-USVC-KIT-04 16
    • 1 $18
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    Crowd Supply CS-USVC-KIT-01

    Development Boards & Kits - ARM uChip Simple VGA Console (uSVC) Kit
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    Mouser Electronics CS-USVC-KIT-01 9
    • 1 $30.36
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    Kontron KISS-1US-V3-CFL-BBA21RXBX1X30

    Rack Mount / Server PCs
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    Mouser Electronics KISS-1US-V3-CFL-BBA21RXBX1X30 1
    • 1 $2872
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    USV KI Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    KIC7SU04FU

    Abstract: No abstract text available
    Text: SEMICONDUCTOR KIC7SU04FU MARKING SPECIFICATION USV PACKAGE 1. Marking method Laser Marking SS 1 No. C 6 2. Marking 2 Item Marking Description Device Mark SS KIC7SU04FU * Lot No. C6 2008. 36th Week [C:1st Character, 6:2nd Character] Note * Lot No. marking method


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    KIC7SU04FU KIC7SU04FU PDF

    KIC7S66FU

    Abstract: SW_ marking marking sw
    Text: SEMICONDUCTOR KIC7S66FU MARKING SPECIFICATION USV PACKAGE 1. Marking method Laser Marking SW 1 No. C 6 2. Marking 2 Item Marking Description Device Mark SW KIC7S66FU * Lot No. C6 2008. 36th Week [C:1st Character, 6:2nd Character] Note * Lot No. marking method


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    KIC7S66FU KIC7S66FU SW_ marking marking sw PDF

    KIC7S02FU

    Abstract: No abstract text available
    Text: SEMICONDUCTOR KIC7S02FU MARKING SPECIFICATION USV PACKAGE 1. Marking method Laser Marking SQ 1 No. C 6 2. Marking 2 Item Marking Description Device Mark SQ KIC7S02FU * Lot No. C6 2008. 36th Week [C:1st Character, 6:2nd Character] Note * Lot No. marking method


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    KIC7S02FU KIC7S02FU PDF

    Untitled

    Abstract: No abstract text available
    Text: TechnischeInformation/TechnicalInformation IGBT-Module IGBT-modules DD500S33HE3 IHM-BModul IHM-Bmodule VCES = 3300V IC nom = 500A / ICRM = 1000A TypischeAnwendungen • Mittelspannungsantriebe • Motorantriebe • Traktionsumrichter • USV-Systeme


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    DD500S33HE3 PDF

    Untitled

    Abstract: No abstract text available
    Text: TechnischeInformation/TechnicalInformation IGBT-Module IGBT-modules DD1000S33HE3 IHM-BModul IHM-Bmodule VCES = 3300V IC nom = 1000A / ICRM = 2000A TypischeAnwendungen • Mittelspannungsantriebe • Motorantriebe • Traktionsumrichter • USV-Systeme


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    DD1000S33HE3 PDF

    Untitled

    Abstract: No abstract text available
    Text: TechnischeInformation/TechnicalInformation IGBT-Module IGBT-modules DD1000S33HE3 IHM-BModul IHM-Bmodule VCES = 3300V IC nom = 1000A / ICRM = 2000A TypischeAnwendungen • Mittelspannungsantriebe • Motorantriebe • Traktionsumrichter • USV-Systeme


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    DD1000S33HE3 PDF

    Untitled

    Abstract: No abstract text available
    Text: TechnischeInformation/TechnicalInformation IGBT-Module IGBT-modules DD500S33HE3 IHM-BModul IHM-Bmodule VCES = 3300V IC nom = 500A / ICRM = 1000A TypischeAnwendungen • Mittelspannungsantriebe • Motorantriebe • Traktionsumrichter • USV-Systeme


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    DD500S33HE3 PDF

    KIC7SZ04FU

    Abstract: marking TC
    Text: SEMICONDUCTOR KIC7SZ04FU MARKING SPECIFICATION USV PACKAGE 1. Marking method Laser Marking TC 1 No. C 6 2. Marking 2 Item Marking Description Device Mark TC KIC7SZ04FU * Lot No. C6 2008. 36th Week [C:1st Character, 6:2nd Character] Note * Lot No. marking method


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    KIC7SZ04FU KIC7SZ04FU marking TC PDF

    KIC7S14FU

    Abstract: No abstract text available
    Text: SEMICONDUCTOR KIC7S14FU MARKING SPECIFICATION USV PACKAGE 1. Marking method Laser Marking SU 1 No. C 6 2. Marking 2 Item Marking Description Device Mark SU KIC7S14FU * Lot No. C6 2008. 36th Week [C:1st Character, 6:2nd Character] Note * Lot No. marking method


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    KIC7S14FU KIC7S14FU PDF

    KIC7S32FU

    Abstract: 36TH marking SV SV J2
    Text: SEMICONDUCTOR KIC7S32FU MARKING SPECIFICATION USV PACKAGE 1. Marking method Laser Marking SV 1 No. C 6 2. Marking 2 Item Marking Description Device Mark SV KIC7S32FU * Lot No. C6 2008. 36th Week [C:1st Character, 6:2nd Character] Note * Lot No. marking method


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    KIC7S32FU KIC7S32FU 36TH marking SV SV J2 PDF

    marking SX

    Abstract: KIC7S86FU
    Text: SEMICONDUCTOR KIC7S86FU MARKING SPECIFICATION USV PACKAGE 1. Marking method Laser Marking SX 1 No. C 6 2. Marking 2 Item Marking Description Device Mark SX KIC7S86FU * Lot No. C6 2008. 36th Week [C:1st Character, 6:2nd Character] Note * Lot No. marking method


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    KIC7S86FU marking SX KIC7S86FU PDF

    MARKING SR

    Abstract: KIC7S04FU
    Text: SEMICONDUCTOR KIC7S04FU MARKING SPECIFICATION USV PACKAGE 1. Marking method Laser Marking SR 1 No. C 6 2. Marking 2 Item Marking Description Device Mark SR KIC7S04FU * Lot No. C6 2008. 36th Week [C:1st Character, 6:2nd Character] Note * Lot No. marking method


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    KIC7S04FU MARKING SR KIC7S04FU PDF

    TE marking

    Abstract: MARKING TE KIC7SZ08FU
    Text: SEMICONDUCTOR KIC7SZ08FU MARKING SPECIFICATION USV PACKAGE 1. Marking method Laser Marking TE 1 No. C 6 2. Marking 2 Item Marking Description Device Mark TE KIC7SZ08FU * Lot No. C6 2008. 36th Week [C:1st Character, 6:2nd Character] Note * Lot No. marking method


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    KIC7SZ08FU TE marking MARKING TE KIC7SZ08FU PDF

    KIC7SZ32FU

    Abstract: marking specification for usv package marking TG
    Text: SEMICONDUCTOR KIC7SZ32FU MARKING SPECIFICATION USV PACKAGE 1. Marking method Laser Marking TG 1 No. C 6 2. Marking 2 Item Marking Description Device Mark TG KIC7SZ32FU * Lot No. C6 2008. 36th Week [C:1st Character, 6:2nd Character] Note * Lot No. marking method


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    KIC7SZ32FU KIC7SZ32FU marking specification for usv package marking TG PDF

    ST 2008

    Abstract: KIC7S08FU
    Text: SEMICONDUCTOR KIC7S08FU MARKING SPECIFICATION USV PACKAGE 1. Marking method Laser Marking ST 1 No. C 6 2. Marking 2 Item Marking Description Device Mark ST KIC7S08FU * Lot No. C6 2008. 36th Week [C:1st Character, 6:2nd Character] Note * Lot No. marking method


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    KIC7S08FU ST 2008 KIC7S08FU PDF

    marking SP

    Abstract: KIC7S00FU marking "E.5"
    Text: SEMICONDUCTOR KIC7S00FU MARKING SPECIFICATION USV PACKAGE 1. Marking method Laser Marking SP 1 No. C 6 2. Marking 2 Item Marking Description Device Mark SP KIC7S00FU * Lot No. C6 2008. 36th Week [C:1st Character, 6:2nd Character] Note * Lot No. marking method


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    KIC7S00FU KIC7S00FU-01 marking SP KIC7S00FU marking "E.5" PDF

    MARKING TA

    Abstract: KIC7SZ00FU KIC7SZ00F
    Text: SEMICONDUCTOR KIC7SZ00FU MARKING SPECIFICATION USV PACKAGE 1. Marking method Laser Marking TA 1 No. C 6 2. Marking 2 Item Marking Description Device Mark TA KIC7SZ00FU * Lot No. C6 2008. 36th Week [C:1st Character, 6:2nd Character] Note * Lot No. marking method


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    KIC7SZ00FU MARKING TA KIC7SZ00FU KIC7SZ00F PDF

    DF160R12W2H3

    Abstract: No abstract text available
    Text: TechnischeInformation/TechnicalInformation IGBT-Module IGBT-modules DF160R12W2H3_B11 VorläufigeDaten/PreliminaryData J VCES = 1200V IC nom = 160A / ICRM = 320A TypischeAnwendungen • SolarAnwendungen • USV-Systeme TypicalApplications • SolarApplications


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    DF160R12W2H3 BarcodeCode128 PDF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC75S58FU Package Name: USV 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


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    TC75S58FU PDF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC7SG02FU Package Name: USV 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


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    TC7SG02FU PDF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC7SG34FU Package Name: USV 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


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    TC7SG34FU PDF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC7S00FU Package Name: USV 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


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    TC7S00FU PDF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC7SET00FU Package Name: USV 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


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    TC7SET00FU PDF

    Untitled

    Abstract: No abstract text available
    Text: Reliability Tests Report Product Name: TC7S08FU Package Name: USV 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s


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    TC7S08FU PDF