underfill
Abstract: SN63A FR4 substrate hysol with or without underfill PCB design for csp package FR4 substrate epoxy hysol 4520
Text: CHIP SCALE PACKAGE ASSEMBLY GUIDE INTRODUCTION Dallas Semiconductor developed Chip Scale Package CSP to be assembled with processes typical of Surface Mount Technology (SMT). Applying some special considerations to the traditional SMT assembly processes, customers realize reliable product assemblies. This document supplies the process
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Abstract: No abstract text available
Text: APPLICATION NOTE Wafer Level Chip Scale Packages: SMT Process Guidelines and Handling Considerations Introduction The Skyworks Wafer Level Chip Scale Package WLCSP is a bumped die solution that can be used for in-module and/or standalone applications. WLCSP packaging technology is applied
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outsourcing IBM
Abstract: avnet celestica flextronics national semiconductor CC
Text: Considerations in Converting from SMT to Die Assemblies National Semiconductor Technical Seminar Series Die Product Business Unit June 26 2003 1 Approaches, Options & Solutions • Die conversion trends and drivers • Die interconnect approaches • Device and information resources
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WLCSP smt
Abstract: EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition
Text: AN69061 Design, Manufacturing, and Handling Guidelines for Cypress Wafer-Level Chip Scale Packages WLCSP Author: Wynces Silvoza, Bo Chang Associated Project: No Associated Part Family: All Cypress WLCSP products Software Version: None Associated Application Notes: None
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AN69061
AN69061
WLCSP smt
EIA-481-D-2008
Cu OSP and Cu SOP
qfn tray pocket size 5 x 6
SUF1577-15
WLCSP stencil design
without underfill
SAC396
cte table flip chip substrate
SAC 2.3 Ag bump composition
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BGA heatsink compressive force
Abstract: BGA Solder Ball compressive force PowerPC 970 MULTIPLE EFFECT EVAPORATOR bga thermal cycling reliability original Coffin-Manson Equation underfill SMT underfill 100C reflow temperature bga
Text: Development of BGA Solution for the IBM PowerPC 970 Module in Apple's Power Mac G5 Presented at ECTC 2004 David Edwards*, Hope Chambers*, Mukta Farooq*, Lewis Goldmann*, Amir Salehi* *IBM Microelectronics, 2070 Route 52, Hopewell Jct, NY 12533 *Apple Computer, 1 Infinite Loop, Cupertino, CA 95014
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BGA heatsink compressive force
BGA Solder Ball compressive force
PowerPC 970
MULTIPLE EFFECT EVAPORATOR
bga thermal cycling reliability
original Coffin-Manson Equation
underfill SMT
underfill
100C
reflow temperature bga
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Loctite 3567
Abstract: underfill Kester FDZ202P fbga Substrate design guidelines reflow hot air BGA fine BGA thermal profile reball INTEL underfill SMT
Text: Application Note 7001 March 2002 Guidelines for Mounting Fairchild’s BGA Packages Dennis Lang, Applications Engineer Introduction The development of MOSFETs in BGA packages was a technology breakthrough, producing a device that combined excellent thermal transfer characteristics, high-current handling capability, ultra-low profile
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underfill
Abstract: rework reflow hot air BGA Loctite PCB design for very fine pitch csp package thick bga die size Loctite 3567 Intel BGA Solder FDZ202P Fairchild, BGA fbga Substrate design guidelines
Text: Application Note 7001 March 2004 Guidelines for Using Fairchild’s BGA Packages Dennis Lang, Applications Engineer Introduction The development of MOSFETs in Chip Scale Package BGA packages was a technology breakthrough, producing a device that combined excellent thermal transfer characteristics, high-current handling
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INCOMING PACKAGING MATERIAL INSPECTION form
Abstract: MIL-STD-105C underfill 45X45mm motherboard major problems & solutions Low viscosity underfill for flip chip
Text: FUJITSU/SUN MICROSYSTEMS ULTRASPARC-IIi MCM: MINIATURIZATION TO THE EXTREME Michelle Hou Fujitsu San Jose, CA USA Takashi Ozawa Fujitsu Kawasaki, JAPAN Dev Malladi, Chris Furman, Mary Krebser, Steve Boyle, Mohsen Saneinejad Sun Microsystems Palo Alto, CA USA
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300MHz
45mmx45mems)
0-100C)
INCOMING PACKAGING MATERIAL INSPECTION form
MIL-STD-105C
underfill
45X45mm
motherboard major problems & solutions
Low viscosity underfill for flip chip
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underfill
Abstract: Casio
Text: NEW PRODUCTS 8 HIGH-DENSITY MOUNTING MODULE USING GOLD-TOGOLD CONTACT BARE CHIP Takao Miyoshi Introduction The method of directly mounting a semiconductor chip on a low-price glass epoxy substrate as bare chip has been widely used for a long time in packaging
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"0.4mm" bga "ball collapse" height
Abstract: cga 624 ibm semi reflow temperature bga
Text: A High Performance, Low Stress, Laminate Ball Grid Array Flip Chip Carrier D. J. Alcoe, T. E. Kindl, J. S. Kresge, J. P. Libous, C. L. Tytran-Palomaki, R. J. Stutzman IBM Corporation Endicott, New York Biography Dr. David J. Alcoe joined IBM in 1982 and is the
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"0.4mm" bga "ball collapse" height
cga 624
ibm semi
reflow temperature bga
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AN1279
Abstract: WLCSP stencil design AN-1279 WLCSP underfill HASL underfill IPC-SM-785 JESD51-3 without underfill solder joint reliability
Text: National Semiconductor Application Note 1279 March 2003 Table of Contents Introduction . Package Construction .
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Abstract: WLCSP underfill AN-1279 without underfill IPC-SM-785 Solder paste stencil life WLCSP stencil design
Text: National Semiconductor Application Note 1279 November 2003 Table of Contents Introduction . Package Construction .
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AG04
Abstract: No abstract text available
Text: SI00-06 Surging Ideas TVS Diode Application Note PROTECTION PRODUCTS Semtech utilizes a proprietary electroless nickel plate process for the UBM paired with screen printed solder balls. The balls are laid out in a grid with a pin out pattern per JEDEC standard outline MO-211.
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MO-211.
AG04
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Abstract: SN62 PB36 ag2 SN62 PB36 ag2 Copper design ideas with or without underfill MO-211 SFC05-4 thermal cycling reliability SN62 PB36 ag2 gold smd ag2
Text: SI00-06 Surging Ideas TVS Diode Application Note PROTECTION PRODUCTS Semtech utilizes a proprietary electroless nickel plate process for the UBM paired with screen printed solder balls. The balls are laid out in a grid with a pin out pattern per JEDEC standard outline MO-211.
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SI00-06
MO-211.
SI00-06
SN62 PB36 ag2
SN62 PB36 ag2 Copper
design ideas
with or without underfill
MO-211
SFC05-4
thermal cycling reliability
SN62 PB36 ag2 gold
smd ag2
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WLCSP flip chip
Abstract: WLCSP smt 0.3mm pitch csp package wlcsp inspection WLCSP chip mount WLCSP PBO design amkor flip amkor RDL amkor polyimide system in package WLCSP underfill
Text: data sheet wafer level packaging WLCSP Features • 4 - 196 ball count • 0.8 mm – 6.5 mm body size • Repassivation, Redistribution and Bumping options available • Electroplated and Ball-loaded bumping options • Eutectic and Lead-free solder • Standard JEDEC / EIAJ pitches and CSP solder ball diameters
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Abstract: with or without underfill flip SMT Texas "Strain Gage" ENIG strain rate texas instruments automotive flip chip underfill Texas alternative ENIG
Text: Application Report SPRAA55 - August 2004 Use and Handling of Semiconductor Packages with ENIG Pad Finishes Eddie Moltz DSP Packaging ABSTRACT Electroless Nickel/Immersion Gold plating, or ENIG, is a versatile process and enables fabrication of high-density flip chip BGA substrates needed for high-performance IC chips.
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SPRAA55
Strain gage report
with or without underfill
flip SMT Texas
"Strain Gage"
ENIG
strain rate
texas instruments automotive flip chip
underfill Texas
alternative ENIG
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doctor-blade
Abstract: 150um
Text: Application Note AN-1011 Assembly of FlipFET Devices by Hazel Schofield and Martin Standing, International Rectifier FlipFET™ is a new generation of HEXFET Power MOSFET package from International Rectifier. FlipFET™ combines the latest die design and wafer
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AN-1011
doctor-blade
150um
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amkor RDL
Abstract: amkor flip FCCSP JEDEC tray standard amkor Sip
Text: data sheet wafer level packaging CSPnl Features: CSPnl DSBGA / WLCSP / WSCSP / WLP Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the
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CSPNL
Abstract: amkor RDL wafer map format amkor amkor flip amkor Sip amkor polyimide FCCSP wafer map
Text: data sheet wafer level packaging CSPnl RDL Features: Packaging CSPnl Bump on Redistribution RDL (DSBGA / WLCSP / WSCSP / WLP) Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the
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Abstract: FCCSP amkor RDL
Text: data sheet W A F E R L E V E L PAC K AG I N G CSPnl Features: Wafer Level Packaging CSPnl™ Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP Chip Scale Package products. Through the
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Abstract: wlcsp inspection amkor RDL amkor Sip dS721
Text: data sheet wafer level packaging CSPnl BOR CSPnl Bump on Repassivation BOR (DSBGA / WLCSP / WSCSP / WLP) Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the
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Abstract: flip chip substrate tolerance
Text: Designing for Cost Effective Flip Chip Technology Application Note DESIGNING FOR COST EFFECTIVE FLIP CHIP TECHNOLOGY Bump and flip approaches to semiconductor packaging have gained acceptance in the industry. For the designer to take full advantage of this technology, attention to bump
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Pb210
flip chip substrate tolerance
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PCB design for very fine pitch csp package
Abstract: gold embrittlement joint IRF6100 IRF6150 with or without underfill process of mosfet
Text: FlipFETTM MOSFET Design for High Volume SMT Assembly Hazel Schofield, Tim Sammon, Aram Arzumanyan, Dan Kinzer. International Rectifier Introduction & Summary International Rectifier has used a proprietary technique to position all the terminals of a HEXFET device on the same face of the die. This has enabled the development of wafer scale
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ISBN0-442-00260-2
ISPSD-99,
PCB design for very fine pitch csp package
gold embrittlement
joint
IRF6100
IRF6150
with or without underfill
process of mosfet
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J-STD-005
Abstract: IPC-SM-785 dispense needle for csp underfill dispense needle PCB design for very fine pitch csp package
Text: AND8081/D Flip Chip CSP Packages Prepared by: Denise Thienpont ON Semiconductor Staff Engineer http://onsemi.com APPLICATION NOTE Package Construction and Process Description Introduction to Chip Scale Packaging This application note provides guidelines for the use of
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J-STD-005
IPC-SM-785
dispense needle for csp
underfill dispense needle
PCB design for very fine pitch csp package
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