M24C128
Abstract: 16KX8 M24128 M24C64 QREE0031 TSSOP14 STMicroelectronics lot number m24c64
Text: QREE0031 QUALIFICATION REPORT TSSOP8 / TSSOP14 High Density Lead Frame ANAM THIS REPORT This Qualification Report summarizes the reliability trials and results performed to qualify High Density Lead Frame HDLF used on TSSOP8 (Thin Shrink Small Outline Package) and TSSOP14 by our
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QREE0031
TSSOP14
TSSOP14
M24C128
16KX8
M24128
M24C64
QREE0031
STMicroelectronics lot number m24c64
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hf2c
Abstract: TS934 m1 sot23 TS931 TS932 TS93X TSSOP14 transistor st 932
Text: Q093XC1 ST Microelectronics GRENOBLE PLANT Standard Linear ICs, DSG SHORT QUALIFICATION REPORT LINE : 093X PRODUCT NAME : TS93X LINE DESCRIPTION : MICROPOWER OPERATIONAL AMPLIFIER WAFER CODE : 093XAAH PACKAGES : TS931 : SO8 / SOT23-5 TS932 : SO8 / DIP8 TS934 : SO14 / DIP14 / TSSOP14
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Q093XC1
TS93X
093XAAH
TS931
OT23-5
TS932
TS934
DIP14
TSSOP14
E917093XA
hf2c
TS934
m1 sot23
TS931
TS932
TS93X
TSSOP14
transistor st 932
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PVAPOX
Abstract: C0942 HFMS510 P100 TS944 TS94X DSA008446 OUTPUT RAIL TO RAIL OPERATIONAL AMPLIFIER SOT23 wafer code ST MICROELECTRONICS SO14
Text: Q094XS1 ST Microelectronics GRENOBLE PLANT Standard Linear ICs, DSG SHORT QUALIFICATION REPORT LINE : 094X PRODUCT NAME : TS94X LINE DESCRIPTION : OUTPUT RAIL TO RAIL BiCMOS µPOWER OPAMP WAFER CODE : C0941AAH/C0942AAZ/C0944AAH PACKAGES : SOT23/SO8/SO14/TSSOP14/DIP8/DIP14
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Q094XS1
TS94X
C0941AAH/C0942AAZ/C0944AAH
OT23/SO8/SO14/TSSOP14/DIP8/DIP14
E917093XA
TS942)
TSSOP14,
OT23-5,
DIP14)
PVAPOX
C0942
HFMS510
P100
TS944
TS94X
DSA008446
OUTPUT RAIL TO RAIL OPERATIONAL AMPLIFIER SOT23
wafer code
ST MICROELECTRONICS SO14
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OF TL084 OPAMP
Abstract: audio Amp. mosfet 1000 watt 3000 Watt BTL Audio Amplifier AUDIO AMPLIFIER 140 WATT MOSFET 24v 5 amp smps TDA2320A replacement DC MOTOR DRIVE WITH LM324 NE555 IGBT DRIVER TSM1001 lm336 sot23
Text: Standard linear portfolio From innovative devices to application specific products Package Flip chip DFN8 Mini SO8 SO8 S014/16 SO20 SO24 batwing SOT23-3/5 TO92 TQFP44/48 TSSOP8 TSSOP14/16 TSSOP28 Tape width mm Qty/reel (min.order qty) Lead-free available
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S014/16
OT23-3/5
TQFP44/48
TSSOP14/16
TSSOP28
Jan-04
SGSTDLINPO/1003
OF TL084 OPAMP
audio Amp. mosfet 1000 watt
3000 Watt BTL Audio Amplifier
AUDIO AMPLIFIER 140 WATT MOSFET
24v 5 amp smps
TDA2320A replacement
DC MOTOR DRIVE WITH LM324
NE555 IGBT DRIVER
TSM1001
lm336 sot23
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TSSOP14
Abstract: RH 012C Siliconix TSSOP14 package M2003
Text: Package Reliability Vishay Siliconix ENVIRONMENTAL AND PACKAGE TESTING DATA FOR TSSOP14 STRESS SAMPLE SIZE DEVICE HR./CYC CONDITION TOTAL FAILS HAST 165 16500 130 °C, 85 % RH FAIL PERCENTAGE 0.00 Pressure Pot 165 16500 121 °, 15 PSIG 0.00 Solderability 45
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TSSOP14
M2003
11-Jan-08
TSSOP14
RH 012C
Siliconix
TSSOP14 package
M2003
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CMOS NE555
Abstract: lm393 equivalent DC MOTOR DRIVE WITH LM324 PWM generator TL084 NE556 PWM tsm103 application LM358 replacement UA741 DIP14 TL071 IC equivalent ic MC33079
Text: Packages Thin Shrink Small Outline Packages Tiny Package OUT 1 SOT23-3 TSSOP8 SO8 DIP8 SOT23-5 TSSOP14 SO14 DIP14 TSSOP16 SO16 DIP16 SO20 DIP20 OPERATIONAL AMPLIFIERS COMPARATORS TIMERS VOLTAGE REFERENCES MIXED ANALOG 5 V+ V- 2 IN+ 3 Dual in Line Packages
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OT23-3
OT23-5
TSSOP14
DIP14
TSSOP16
DIP16
DIP20
OT23-5
SO14/16
TSSOP14/16
CMOS NE555
lm393 equivalent
DC MOTOR DRIVE WITH LM324
PWM generator TL084
NE556 PWM
tsm103 application
LM358 replacement
UA741 DIP14
TL071 IC equivalent ic
MC33079
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Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of TSSOP14 package SOT402-1 Hx Gx P2 0.125 (0.125) Hy By Gy Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land occupied area
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TSSOP14
OT402-1
sot402-1
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Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74LVX32FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74LVX32FT
TSSOP14
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Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74LVX04FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74LVX04FT
TSSOP14
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Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74LCX00FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74LCX00FT
TSSOP14
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Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74LVX74FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74LVX74FT
TSSOP14
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Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74VHCT74AFT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74VHCT74AFT
TSSOP14
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Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74VHCV17FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74VHCV17FT
TSSOP14
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Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74VHC11FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74VHC11FT
TSSOP14
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Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74VCX32FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74VCX32FT
TSSOP14
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Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74LCX125FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74LCX125FT
TSSOP14
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Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74VCX125FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74VCX125FT
TSSOP14
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TSSOP14
Abstract: No abstract text available
Text: PACKAGE OUTLINE DRAWING TSSOP14 MF-PO-D-0025 revision 0.0 TM Monolithic Power Systems TM 0.004 0.090 0.0256(0.650) TYP 0.010(0.250) GATE PLANE 0.004(0.090) 0o-8o 0.169(4.300) 0.177(4.500) Pin 1 IDENT. 0.244(6.200) 0.260(6.600) 0.018(0.450) 0.030(0.750) DETAIL "A"
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TSSOP14
MF-PO-D-0025
TSSOP14
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Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74LVX00FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74LVX00FT
TSSOP14
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Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74VHC05FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74VHC05FT
TSSOP14
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Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74VCX00FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74VCX00FT
TSSOP14
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Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74VHC00FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74VHC00FT
TSSOP14
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Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74LCX126FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74LCX126FT
TSSOP14
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Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74LCX04FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74LCX04FT
TSSOP14
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