Untitled
Abstract: No abstract text available
Text: 11-05-7 TSS N Series Specifications: Finish Insulation : Gold plated centre contact and nickel plated body. : Teflon. Straight Plug Clamp CM-07 For Clamp Type Connectors Page 1 26/05/06 V1.0 11-05-7 TSS N Series Preparation of Cable: 1 1. Slide nut, washer and gasket onto cable.
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CM-07
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M103
Abstract: M105 M107
Text: ACSM-2047 SCHOTTKY DIODE MODULE DETECTORS Frequency Range min Sensitivity (min) Flatness vs. Frequency (max) Typical TSS Nominal Video Capacitance 1 – 18 1800 1.0 -51 20 GHz mV/mW ±dB dBm pF NOTES: Maximum input power: +20dBm Sensitivity is measured into an open circuit load (>10k ohm).
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ACSM-2047
20dBm
100uA.
MIL-STD-883,
ACSM-2047N)
ACSM-2047NZ)
ACSM-2047NZM12)
ACSM-2047NZM12-RC)
M103
M105
M107
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Untitled
Abstract: No abstract text available
Text: ACSM-2047 SCHOTTKY DIODE MODULE DETECTORS Frequency Range min Sensitivity (min) Flatness vs. Frequency (max) Typical TSS Nominal Video Capacitance 1 – 18 1800 1.0 -51 20 GHz mV/mW ±dB dBm pF NOTES: Maximum input power: +20dBm Sensitivity is measured into an open circuit load (>10k ohm).
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ACSM-2047
20dBm
100uA.
MIL-STD-883,
ACSP-2047N)
ACSP-2047NZ)
ACSP-2047NZM12)
ACSP-2047NZM12-RC)
-20dBm
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LPC TPM
Abstract: ST19WP18-TPM-C ST19WP18 TSSOP28 PKCS-11 st19wp18-tpm intel LPC interface spec 1.0
Text: ST19WP18-TPM-C Trusted Platform Module TPM With complete TCG Software Solution DATA BRIEF PRODUCT FEATURES SINGLE-CHIP TRUSTED PLATFORM MODULE (TPM) • EMBEDDED TPM 1.2 FIRMWARE ■ TPM DRIVER FOR BIOS AND WINDOWSTM 2000/XP ■ TCG SOFTWARE STACK (TSS)(1)
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ST19WP18-TPM-C
2000/XP
33-MHz
LPC TPM
ST19WP18-TPM-C
ST19WP18
TSSOP28
PKCS-11
st19wp18-tpm
intel LPC interface spec 1.0
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Untitled
Abstract: No abstract text available
Text: V.35 - Interface connectors V.35 DTE/DCE Interface connectors Description The Telecommunications Standardization Sector TSS V.35, formerly CCITT V.35 is the international standard termed “Data Transmission at 48 Kbps using 60108 Khz Group-Band Circuits. It makes
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MSO34
MS34PMEHMMET1
MS34RMEHMMET1
MS34PMEH2(
MS34RMEH2(
MS34PMEH3(
MS34RMEH3(
MS34PMEH0(
MS34RMEH0(
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LPC TPM
Abstract: lpc interface ST19WP18 ST19WP18-TPM-C TSSOP28 Trusted platform module SERIRQ intel LPC interface spec 1.0 lad1 NTRU Cryptosystems
Text: ST19WP18-TPM-C Trusted Platform Module TPM With complete TCG Software Solution DATA BRIEF PRODUCT FEATURES SINGLE-CHIP TRUSTED PLATFORM MODULE (TPM) • EMBEDDED TPM 1.2 FIRMWARE ■ TPM DRIVER FOR BIOS AND WINDOWSTM 2000/XP ■ TCG SOFTWARE STACK (TSS)(1)
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ST19WP18-TPM-C
2000/XP
33-MHz
LPC TPM
lpc interface
ST19WP18
ST19WP18-TPM-C
TSSOP28
Trusted platform module
SERIRQ
intel LPC interface spec 1.0
lad1
NTRU Cryptosystems
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Untitled
Abstract: No abstract text available
Text: V.35 - interface connectors V.35 DTE/DCE Interface connectors Description The Telecommunications Standardization Sector TSS V.35, formerly CCITT V.35 is the international standard termed “Data Transmission at 48 Kbps using 60-108 Khz Group-Band Circuits. It makes use of a 34
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MSO34
UL94-V0
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intel LPC interface spec 1.0
Abstract: No abstract text available
Text: ST19WP18-TPM-C Trusted Platform Module TPM With complete TCG Software Solution DATA BRIEF PRODUCT FEATURES SINGLE-CHIP TRUSTED PLATFORM MODULE (TPM) • EMBEDDED TPM 1.2 FIRMWARE ■ TPM DRIVER FOR BIOS AND WINDOWSTM 2000/XP ■ TCG SOFTWARE STACK (TSS)(1)
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ST19WP18-TPM-C
2000/XP
33-MHz
ST19W
ST19WP18-TPM-C
intel LPC interface spec 1.0
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Untitled
Abstract: No abstract text available
Text: A43E06161 Preliminary 512K X 16 Bit X 2 Banks Synchronous DRAM Document Title 512K X 16 Bit X 2 Banks Synchronous DRAM Revision History History Issue Date Remark 0.0 Initial issue May 3, 2005 Preliminary 0.1 Modify tSS from 3ns to 2ns July 31, 2005 Rev. No.
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A43E06161
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A43E06161
Abstract: A43E06161V
Text: A43E06161 Preliminary 512K X 16 Bit X 2 Banks Synchronous DRAM Document Title 512K X 16 Bit X 2 Banks Synchronous DRAM Revision History History Issue Date Remark 0.0 Initial issue May 3, 2005 Preliminary 0.1 Modify tSS from 3ns to 2ns July 31, 2005 Rev. No.
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A43E06161
50-pin
A43E06161
A43E06161V
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Untitled
Abstract: No abstract text available
Text: A43E06161 Preliminary 512K X 16 Bit X 2 Banks Synchronous DRAM Document Title 512K X 16 Bit X 2 Banks Synchronous DRAM Revision History History Issue Date Remark 0.0 Initial issue May 3, 2005 Preliminary 0.1 Modify tSS from 3ns to 2ns July 31, 2005 Rev. No.
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A43E06161
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ST19WP18-TPM-B
Abstract: year 2000 compliant motherboard LPC TPM ST19WP18 TSSOP28 "multiplexed command" pkcs-11
Text: ST19WP18-TPM-B Trusted Platform Module TPM With TCG Software Stack DATA BRIEF PRODUCT FEATURES SINGLE-CHIP TRUSTED PLATFORM MODULE (TPM) • EMBEDDED TPM 1.2 FIRMWARE ■ TPM DRIVER FOR BIOS AND WINDOWSTM 2000/XP ■ TCG SOFTWARE STACK (TSS)(1) ■ 33-MHz LOW PIN COUNT (LPC)
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ST19WP18-TPM-B
2000/XP
33-MHz
ST19W
1088-bit
ST19WP18-TPM-B
year 2000 compliant motherboard
LPC TPM
ST19WP18
TSSOP28
"multiplexed command"
pkcs-11
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A43E06161
Abstract: A43E06161V
Text: A43E06161 Preliminary 512K X 16 Bit X 2 Banks Synchronous DRAM Document Title 512K X 16 Bit X 2 Banks Synchronous DRAM Revision History History Issue Date Remark 0.0 Initial issue May 3, 2005 Preliminary 0.1 Modify tSS from 3ns to 2ns July 31, 2005 Rev. No.
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A43E06161
A43E06161
A43E06161V
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D1710
Abstract: JIS-C3604 RG58U SK 474 22-4250
Text: REVISIONS PART NO. 13-06-1 TSS RG58U ECN # REV DESCRIPTION DRAWN DATE CHECKD DATE APPRVD DATE - A RELEASED S. K 17/5/06 K. S 17/5/06 N. K 31/5/06 Dimensions : Millimetres Inches This data sheet and its contents (the "Information") belong to the Premier Farnell Group
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RG58U
RG58U
M10000323
D1710
JIS-C3604
SK 474
22-4250
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Trusted platform module
Abstract: 1. Mobile Computing block diagram
Text: ST19WP18-TPM-B Trusted Platform Module TPM With TCG Software Stack DATA BRIEF PRODUCT FEATURES SINGLE-CHIP TRUSTED PLATFORM MODULE (TPM) • EMBEDDED TPM 1.2 FIRMWARE ■ TPM DRIVER FOR BIOS AND WINDOWSTM 2000/XP ■ TCG SOFTWARE STACK (TSS)(1) ■ 33-MHz LOW PIN COUNT (LPC)
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ST19WP18-TPM-B
2000/XP
33-MHz
ST19W
1088-bit
ST19WP18-TPM-B
Trusted platform module
1. Mobile Computing block diagram
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15-03 TSS RG58 CABLE 50 OHM
Abstract: TSS 204 rg58 tnc crimp TNC female 50 ohm RG58-50 110-GH
Text: TSS Series TNC 50 Ohm Plugs, Jacks & Socket Features: • Silver plated bodies and contacts. • Teflon insulators. N series connectors are similar to BNC connectors except for their mating threaded coupling which is designed to provide low reflection from DC to 11GHz under extreme environmental conditions, especially shock and vibration.
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11GHz
15-03 TSS RG58 CABLE 50 OHM
TSS 204
rg58 tnc crimp
TNC female 50 ohm
RG58-50
110-GH
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RG174U
Abstract: No abstract text available
Text: REVISIONS PART NO. 13-11 TSS RG174U Main Body This data sheet and its contents the "Information" belong to the Premier Farnell Group (the "Group") or are licensed to it. No licence is granted for the use of it other than for information purposes in connection with the products to which it relates. No licence
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RG174U
RG174U-
M10000247
RG174U
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D1710
Abstract: JIS-C3604 RG58U
Text: REVISIONS PART NO. 13-10-1 TSS RG58U ECN # REV DESCRIPTION DRAWN DATE CHECKD DATE APPRVD DATE - A RELEASED S. K 17/5/06 K. S 17/5/06 N. K 31/5/06 Stripping Dimension This data sheet and its contents the "Information" belong to the Premier Farnell Group (the "Group") or are licensed to it. No licence is granted for the use of it other than for
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RG58U
RG58U
M10000327
D1710
JIS-C3604
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Untitled
Abstract: No abstract text available
Text: ACSM-2047 Schottky Diode Module Detector Features: • Contains hermetically sealed modules, internal RF matching, DC return, and RF bypass capacitor. • The video port is protected from static or transient charges. • Input impedance matching. • Models may be chosen for broadband RF
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ACSM-2047
20dBm
100uA.
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Untitled
Abstract: No abstract text available
Text: ACSM-2047 Schottky Diode Module Detector Features: • Contains hermetically sealed modules, internal RF matching, DC return, and RF bypass capacitor. • The video port is protected from static or transient charges. • Input impedance matching. • Models may be chosen for broadband RF
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ACSM-2047
MIL-STD-883,
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Untitled
Abstract: No abstract text available
Text: F-204 amtec T/H BOX CONNECTOR STRIPS SPEC IFIC A TIO N S BCS For complete specifications see www.samtec.com?BCS NO. PINS PER ROW Insulator Material: Black Liquid Crystal Mates w ith: Polymer C ontact Material: TSW, MTSW, TSS, Phosphor Bronze ^ = 10 m" 0,25Mm
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OCR Scan
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Untitled
Abstract: No abstract text available
Text: SIEMENS Standard EEPROM ICs SLx 24C08/16 8/16 Kbit 1024/2048 x 8 bit Serial CM O S-EEPRO M with I2C Synchronous 2-Wire Bus D atasheet 1998-07-27 ÖHBSbQS O l l W S TSS I SLx 24C08/16 Revision History: Current Version: 1998-07-27 Previous Version: 06.97 Page
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24C08/16
A23SbD5
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Untitled
Abstract: No abstract text available
Text: S P E C IF IC A T IO N S For complete specifications see www.samtec.com?SSW or www.samtec.com?SSQ Mates With: TSW, MTSW, MTLW, LCW, EW, ZW, TSS, ZSS, TSM, TSSH Insulator Material: Black Liquid Crystal T O Polymer -S & -D or !IIIS« Black High Temperature
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OCO14
Abstract: TP3077 TP3072V-X
Text: TP3072V-X blE D • bSGllEH DDfilôMS TSS ■NSCE! NATL SEMICOND LINEAR National mm Semiconductor TP3072V-X COMBO II Programmable PCM CODEC/Filter General Description Features The TP3072V-X is a second-generation combined PCM CO DEC and Filler devices optimized for digital switching appli
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TP3072V-X
TP3072V-X
OCO14
TP3077
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