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    TSOP-II TRAY 11.76 Search Results

    TSOP-II TRAY 11.76 Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    D6417709SHF200BV Renesas Electronics Corporation 32-bit Microcontrollers, HFQFP, /Tray Visit Renesas Electronics Corporation
    JM38510/12203BGA Renesas Electronics Corporation Amplifiers, CAN, /Tray Visit Renesas Electronics Corporation
    DF38122WV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), TFQFP, /Tray Visit Renesas Electronics Corporation
    DF38347HWV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), FQFP, /Tray Visit Renesas Electronics Corporation
    DF38347HV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), FQFP, /Tray Visit Renesas Electronics Corporation
    DF38327WV Renesas Electronics Corporation 8-bit Microcomputers (Non Promotion), TFQFP, /Tray Visit Renesas Electronics Corporation

    TSOP-II TRAY 11.76 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    TRAY TSOP

    Abstract: No abstract text available
    Text: Packing NEC Tray JEDEC Tray Name LA-1006B-1 TSOP 2 400MIL18 Mounting Pad 28 pin TSOP (II) (400 mil) 28 15 E 3°±3° F detail of lead end 1 14 A H I K G J N C D B L M M S28G5-50-7JD1-1 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at


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    PDF LA-1006B-1 400MIL18 S28G5-50-7JD1-1 TRAY TSOP

    Untitled

    Abstract: No abstract text available
    Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 28 pin TSOP (II) (400 mil) 28 15 F E P detail of lead end 1 14 A D M M C L B G K N I J H NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.


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    PDF 400MIL21 S28G5-50-7KD4

    Untitled

    Abstract: No abstract text available
    Text: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 44 pin TSOP (II) (400 mil) 44 23 1 P E F detail of lead end 22 A H I K G J N C D M B L M NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.


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    PDF 400MIL18 S44G5-80-7JF5

    TSOP 54 tray

    Abstract: No abstract text available
    Text: Packing JEDEC Tray Name TSOP 2 400MIL22 Mounting Pad 54 pin TSOP (II) (400 mil) 54 28 detail of lead end F E 1 P 27 A H J I G C D M L N K M B NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.


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    PDF 400MIL22 S54G5-80-9JF TSOP 54 tray

    S44G5-80-7KF2

    Abstract: No abstract text available
    Text: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL18 44 pin TSOP (II) (400 mil) 44 23 P F E detail of lead end 1 22 A D M M N L B G K C I J H NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.


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    PDF 400MIL18 S44G5-80-7KF2 S44G5-80-7KF2

    0038 tsop

    Abstract: No abstract text available
    Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 32 pin TSOP (II) (400 mil) 32 17 1 P E F detail of lead end 16 A H J K G I N C D M B L M NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.


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    PDF 400MIL21 S32G5-50-7JD2 0038 tsop

    44PINTSOP

    Abstract: No abstract text available
    Text: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL18 44 pin TSOP (II) (400 mil) 44 23 E P F detail of lead end 1 22 A H I K G J N C D M B L M NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.


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    PDF 400MIL18 S44G5-80-7JF2 44PINTSOP

    Untitled

    Abstract: No abstract text available
    Text: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 44 pin TSOP (II) (400 mil) 44 23 P F E detail of lead end 1 22 A D M M N L B G K C I J H NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.


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    PDF 400MIL18 S44G5-80-7KF3

    Untitled

    Abstract: No abstract text available
    Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 50 pin TSOP (II) (400 mil) 50 26 F E P detail of lead end 1 25 A D M M C B L G K N I J H NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.


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    PDF 400MIL21 00Each S50G5-80-7KF1

    Untitled

    Abstract: No abstract text available
    Text: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 44 pin TSOP (II) (400 mil) 44 23 E P F detail of lead end 1 22 A H I K G J C D N M B L M NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.


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    PDF 400MIL18 S44G5-80-7JF3

    Untitled

    Abstract: No abstract text available
    Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 32 pin TSOP (II) (400 mil) 32 17 F P E detail of lead end 1 16 A D M M C L B G K N I H NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.


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    PDF 400MIL21 S32G5-50-7KD2

    Untitled

    Abstract: No abstract text available
    Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 50 pin TSOP (II) (400 mil) 26 50 F P E detail of lead end 1 25 A D M M C B L G K N I J H NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.


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    PDF 400MIL21 S50G5-80-7KF2

    Untitled

    Abstract: No abstract text available
    Text: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 E P F detail of lead end 1 25 A H J K G I N B C D M L M NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.


    Original
    PDF 400MIL21 005Each S50G5-80-7JF1

    Untitled

    Abstract: No abstract text available
    Text: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 28 pin TSOP (II) (400 mil) 28 15 1 P E F detail of lead end 14 A H I K G J N C D M B L M NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.


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    PDF 400MIL18 S28G5-50-7JD4

    Untitled

    Abstract: No abstract text available
    Text: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 28 pin TSOP (II) (400 mil) 28 15 1 P E F detail of lead end 14 A H I K G J N C D M B L M NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.


    Original
    PDF 400MIL18 S28G5-50-7JD5

    Untitled

    Abstract: No abstract text available
    Text: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 44 pin TSOP (II) (400 mil) 44 23 F E P detail of lead end 1 22 A D M M C L B G K N I J H NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.


    Original
    PDF 400MIL18 S44G5-80-7KF5

    Untitled

    Abstract: No abstract text available
    Text: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 E P F detail of lead end 1 25 A H J K G I N B C D M L M NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.


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    PDF 400MIL21 S50G5-80-7JF2

    Untitled

    Abstract: No abstract text available
    Text: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL18 28 pin TSOP (II) (400 mil) 28 15 E 3°±3° F detail of lead end 1 14 A H I K G J N C D B L M M S28G5-50-7JD-2 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at


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    PDF 400MIL18 S28G5-50-7JD-2

    Untitled

    Abstract: No abstract text available
    Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 32 pin TSOP (II) (400 mil) 17 32 E 5°±5° F detail of lead end 1 16 A H J K G I N C D M B L M S32G5-50-7JD1-1 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at


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    PDF 400MIL21 S32G5-50-7JD1-1

    AD14

    Abstract: TRAY TSOP S28G5-50-7KD2
    Text: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 28 pin TSOP (II) (400 mil) 15 28 3°±3° F E detail of lead end 1 A D 14 M M C L B G K N I H J S28G5-50-7KD-2 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at


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    PDF 400MIL18 S28G5-50-7KD-2 AD14 TRAY TSOP S28G5-50-7KD2

    TSOP 54 tray

    Abstract: tsop 0038
    Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 32 pin TSOP (II) (400 mil) 17 32 F E 5°±5° detail of lead end 1 16 A D M M C L B G K N I J H S32G5-50-7KD1-1 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at


    Original
    PDF 400MIL21 S32G5-50-7KD1-1 TSOP 54 tray tsop 0038

    Untitled

    Abstract: No abstract text available
    Text: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 28 pin TSOP (II) (400 mil) 28 15 F E 3°±3° detail of lead end 1 14 A D M M C B L G K N I J H S28G5-50-7KD1-1 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at


    Original
    PDF 400MIL18 S28G5-50-7KD1-1

    S28G5-50-7JD2-1

    Abstract: No abstract text available
    Text: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 28 pin TSOP (II) (400 mil) 28 15 E 5°±5° F detail of lead end 1 14 A H I K G J N B C D M L M S28G5-50-7JD2-1 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at


    Original
    PDF 400MIL18 S28G5-50-7JD2-1 S28G5-50-7JD2-1

    tsop 0038

    Abstract: No abstract text available
    Text: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL18 44 pin TSOP (II) (400 mil) 44 23 F E 3°±3° detail of lead end 1 22 A D M M C N L G K B I J H S44G5-80-7KF-1 NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at


    Original
    PDF 400MIL18 S44G5-80-7KF-1 tsop 0038