Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    TSOP-48 PCB LAYOUT Search Results

    TSOP-48 PCB LAYOUT Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    EV1HMC470ALP3 Analog Devices Evaluation PCB Visit Analog Devices Buy
    EV1HMC321ALP4E Analog Devices Evaluation PCB Visit Analog Devices Buy
    EV1HMC558ALC3B Analog Devices Evaluation PCB Visit Analog Devices Buy
    EV1HMC787ALC3B Analog Devices Evaluation PCB Visit Analog Devices Buy
    104631-HMC361S8G Analog Devices HMC361S8G Evaluation PCB Visit Analog Devices Buy

    TSOP-48 PCB LAYOUT Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    56-Lead TSOP Package

    Abstract: TSOP 56 LAYOUT ORCAD PCB LAYOUT BOOK svs 357 28F008SA 28F016SA DD28F032SA PCB Layout surge PCB layout TSOP 54 Package used in where
    Text: AP-607 APPLICATION NOTE Multi-Site Layout Planning with Intel’s FlashFileTM Components Including ROM Compatibility BILAL QURESHI APPLICATIONS ENGINEER SALIM B FEDEL SENIOR APPLICATIONS ENGINEER December 1995 Order Number 292159-002 Information in this document is provided in connection with Intel products Intel assumes no liability whatsoever including infringement of any patent or copyright for sale and use of Intel products except as provided in


    Original     		PDF AP-607 56-Lead 16-Mbit 44-Lead 28F016SA 56-Lead TSOP Package TSOP 56 LAYOUT ORCAD PCB LAYOUT BOOK svs 357 28F008SA DD28F032SA PCB Layout surge PCB layout TSOP 54 Package used in where

    IC51-0242-1006-1

    Abstract: TSOP 44 socket IC51-0482-2018 TSOP 48 socket ic 4008 0262 IC51-0322-1207-1 IC51-0282-1032-1 IC51-0322-1031-1 IC51-0322-1219
    Text: IC51 - Clamshell Thin Small Outline Package TSOP Type I and II Part Number (Details) Specifications 1,000M Ω min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 700V AC for 1 minute 30m Ω max. at 10mA/20mV max. Contact Resistance:


    Original     		PDF 10mA/20mV 27x12 IC51-0262-1339 IC51-0442-1709 IC51-0502-1708 IC51-0242-1006-1 TSOP 44 socket IC51-0482-2018 TSOP 48 socket ic 4008 0262 IC51-0322-1207-1 IC51-0282-1032-1 IC51-0322-1031-1 IC51-0322-1219

    TSOP 54 socket

    Abstract: IC189 TSSOP YAMAICHI SOCKET IC189-0562 TSOP 48 socket IC189-0482 IC189-0482 TSOP 54 socket TSOP 62 Package IC189-0482-094 tsop 1230
    Text: Part Number Details Specifications 1,000M Ω min. at 100V DC, pitch 0.5 1,000M Ω min. at 500V DC, pitch 0.65, 0.8, 1.27 Insulation Resistance: IC189 - 042 2 - 025 * - * Series No. Dielec. Withstd. Voltage: for 1 minute at 100 V AC, pitch 0.5 for 1 minute at 500 V AC, pitch 0.65


    Original     		PDF IC189 10mA/20mV IC189-0562-067 IC189-0562-078 IC189-0622-084 TSOP 54 socket TSSOP YAMAICHI SOCKET IC189-0562 TSOP 48 socket IC189-0482 IC189-0482 TSOP 54 socket TSOP 62 Package IC189-0482-094 tsop 1230

    IC51-0482-2018

    Abstract: MAX 232 IC PIN DETAILS IC51-0322-1031-1 IC51 socket IC51-0282-1032-1 IC51-0322-1207-1 IC51-0242-1006-1 IC51-0322-1219 IC51-0322-883-1 IC51-0402-1174-1
    Text: IC51 - Clamshell Thin Small Outline Package TSOP Type I Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Mating Cycles: 1,000MΩ min. at 500V DC 700V AC for 1 minute


    Original     		PDF 10mA/20mV IC51-0402-1174-1 IC51-0482-2018 IC51-0482-2018 MAX 232 IC PIN DETAILS IC51-0322-1031-1 IC51 socket IC51-0282-1032-1 IC51-0322-1207-1 IC51-0242-1006-1 IC51-0322-1219 IC51-0322-883-1 IC51-0402-1174-1

    Meritec 980020-56

    Abstract: IC179-44600-500 IC197-4807-2000 980020-48 IC197-5606-2000 980020 IC191-0482-004 Enplas OTS 648-0482211 wells 648-0482211
    Text: The Complete Socket Solution 3 PCB land-pad layout similar close to that of device PRODUCTION PROTOTYPING AND TEST SOCKETS TO HELP YOU DESIGN IN INTEL FLASH MEMORY Socket vendors are actively working on solutions for Small Outline Packages This work includes robust


    Original     		PDF IC191-0402-002N IC191-0402-002 OTS-40-0 IC191-0482-004N IC191-0482-004 648-0482211-A31 IC191-0562-003N IC191-0562-003 CSP044-052 IC51-0442-1536 Meritec 980020-56 IC179-44600-500 IC197-4807-2000 980020-48 IC197-5606-2000 980020 IC191-0482-004 Enplas OTS 648-0482211 wells 648-0482211

    TSSOP YAMAICHI SOCKET

    Abstract: IC189-0482-077 IC189-0482-094 IC189 Series Open Top SOP, SSOP, TSOP Type I a IC189-0482-066 IC189 IC189-0422-025 from TSOP Type II ssop40 IC189-0482
    Text: IC189 Series Open Top Part Number (Details) Specifications Insulation Resistance: 1,000M Ω min. at 100V DC, pitch 0.5 1,000M Ω min. at 500V DC, pitch 0.65, 0.8, 1.27 IC189on - 040 2 - 068 * - * i Series No. Dielec. Withstd. Voltage: for 1 minute at 100 V AC, pitch 0.5


    Original     		PDF IC189 10mA/20mV IC189-0482-066 IC189-0482-066-2 IC189-0482-047 IC189-0482-077 65x23 TSSOP YAMAICHI SOCKET IC189-0482-077 IC189-0482-094 IC189 Series Open Top SOP, SSOP, TSOP Type I a IC189-0482-066 IC189-0422-025 from TSOP Type II ssop40 IC189-0482

    diode A14A

    Abstract: BIOS 32 Pin PLCC 845 bios chip PLCC 32 intel package dimensions amd 29f040 thermal resistance INTEL FLASH MEMORY DATA SHEET transistor ap 431 tsop 28-LEAD Footprints picture in picture chip psop 1
    Text: E AP-623 APPLICATION NOTE Multi-Site Layout Planning with Intel's Boot Block Flash Memory CHARLES ANYIMI SENIOR TECHNICAL MARKETING ENGINEER December 1995 Order Number: 292178-002 Information in this document is provided solely to enable use of Intel products. Intel assumes no liability whatsoever, including


    Original     		PDF AP-623 AP-607, AB-57, AB-60, diode A14A BIOS 32 Pin PLCC 845 bios chip PLCC 32 intel package dimensions amd 29f040 thermal resistance INTEL FLASH MEMORY DATA SHEET transistor ap 431 tsop 28-LEAD Footprints picture in picture chip psop 1

    28F640J5a

    Abstract: iMC016FLSG 28F160B3 IMC016FLSC 9021b iMC008FLSC flash memory 5v 16m SmartDie 28F016B3 28F160F3
    Text: Flash Memory Quick Reference Guide ion 4 Vers ’98 June Flash Memory Components for New Designs New designs should be based on Intel’s “components for new designs” shown in bold text in this guide. For information on our full product line, including extended temperature products, contact your Intel Sales representative/distributor or refer to our linecard available on Intel’s Web site.


    Original     		PDF 28F320C3a 28F032C3a 28F320LSA USA/698/10K/MS 28F640J5a iMC016FLSG 28F160B3 IMC016FLSC 9021b iMC008FLSC flash memory 5v 16m SmartDie 28F016B3 28F160F3

    PLCC 32 intel package dimensions

    Abstract: 845 bios chip intel 845 circuit diagram all chip TSOP 48 thermal resistance TSOP 48 LAYOUT ap623 am 28f040 AP-623 PCB Layout tsop 48 PIN SOCKET
    Text: E AP-623 APPLICATION NOTE Multi-Site Layout Planning with Intel’s Boot Block Flash Memory December 1996 Order Number: 292178-003 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of


    Original     		PDF AP-623 AP-607 AB-57 AB-60 PLCC 32 intel package dimensions 845 bios chip intel 845 circuit diagram all chip TSOP 48 thermal resistance TSOP 48 LAYOUT ap623 am 28f040 AP-623 PCB Layout tsop 48 PIN SOCKET

    IC191-0562-003

    Abstract: IC191-0482-004 ic191-0482-004 pin details IC191 TSOP 56 socket IC191-0402-002 TSOP 56 Package TSOP 48 socket
    Text: IC191 Series Open Top Thin Small Outline Package (TSOP - Type I) Part Number (Details) Specifications 1,000M Ω min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 700V AC for 1 minute 30m Ω max. at 10mA/20mV max. Contact Resistance:


    Original     		PDF IC191 10mA/20mV IC191-0402-002 IC191-0562-003 IC191-0482-004 IC191-0562-003 IC191-0482-004 ic191-0482-004 pin details TSOP 56 socket IC191-0402-002 TSOP 56 Package TSOP 48 socket

    IC191-0482-004

    Abstract: IC191-0322-001 TSOP 48 socket ic191-0482-004 pin details IC191 IC191-0402-002
    Text: IC191 - Open Top Type I ng Thin Small Outline Package (TSOP) Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Current Rating: Operating Temperature Range: Mating Cycles: Contact Force: 1,000M Ω min. at 500V DC


    Original     		PDF IC191 10mA/20mV IC191-0322-001 IC191-0482-004 IC191-0402-002 IC191-0482-004 IC191-0322-001 TSOP 48 socket ic191-0482-004 pin details IC191-0402-002

    ic 1830

    Abstract: IC1974807200
    Text: TSOP Type I Metal Lid SMT IC197 Series Ordering Information IC197- * *- 200 * Lid Socket Characteristics Current Rating: Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: Mating Cycles: Socket Series No. of Contacts


    Original     		PDF IC197 IC197- 300mA 10mA/20mV Thermoplastic-UL94V-0 IC197-3202-210* IC197-3203-210* IC197-4001-210* IC197-4004-210* IC197-4807-210* ic 1830 IC1974807200

    Yamaichi Electronics ic197

    Abstract: L 0629 IC197-5606 IC1974807200
    Text: TSOP Type I Metal Lid SMT IC197 Series Ordering Information IC197- * *- 200 * Lid Socket Characteristics Current Rating: Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: Mating Cycles: Socket Series No. of Contacts


    Original     		PDF IC197 IC197- 300mA 10mA/20mV Thermoplastic-UL94V-0 IC197-3202-210* IC197-3203-210* IC197-4001-210* IC197-4004-210* IC197-4807-210* Yamaichi Electronics ic197 L 0629 IC197-5606 IC1974807200

    Untitled

    Abstract: No abstract text available
    Text: Migration from 16 Megabit to 64 Megabit Flash Memory Devices Application Note This document will assist board-designers in creating a seamless migration path from AMD 16 Mb or 32 Mb low voltage LV flash and Simultaneous Read/Write (DL) devices to higher densities.


    Original     		PDF LV320 LV640U

    amd 15h power

    Abstract: TSOP-48 pcb LAYOUT TSOP 48 LAYOUT AM29LV640 TSOP-48 FOOTPRINT
    Text: Implementing a Common Layout for AMD MirrorBit and Intel StrataFlash™ Memory Devices Application Note -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ


    Original     		PDF

    amd 15h power

    Abstract: AM29LV640
    Text: Implementing a Common Layout for AMD MirrorBitTM and Intel StrataFlashTM Memory Devices Application Note Overview This document describes the benefits of designing with AMD MirrorBit Flash memory and the ease with which system designers can layout a board to accommodate high-density flash devices from both AMD and


    Original     		PDF 32Mb-128Mb 64Megabit amd 15h power AM29LV640

    sample code read and write flash memory spansion

    Abstract: AMD29LV SPANSION date code format spansion S29GL064 sample code write buffer spansion intel MLC flash Intel 56 TSOP PL32LM amd 15h power S29GL
    Text: Implementing a Common Layout for Spansion MirrorBitTM and Intel StrataFlashTM Memory Devices Application Note Overview This document describes the benefits of designing with Spansion MirrorBit Flash memory and the ease with which system designers can layout a board to accommodate high-density flash devices from both


    Original     		PDF S29GL 32Mb-256Mb sample code read and write flash memory spansion AMD29LV SPANSION date code format spansion S29GL064 sample code write buffer spansion intel MLC flash Intel 56 TSOP PL32LM amd 15h power

    28F160S3

    Abstract: 28F320J5 28F640J5 29221* intel intel 44-lead psop
    Text: E AP-660 APPLICATION NOTE Intel StrataFlash Memory 0.25 µ Generation Migration Guide May 1998 Order Number: 292218-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of


    Original     		PDF AP-660 28F160S3, 28F320S3 AP-646 AP-647 28F160S3 28F320J5 28F640J5 29221* intel intel 44-lead psop

    28F032SA

    Abstract: 28F008S5 28F008SA 28F016S5 28F016SA 28F016SV 28F160S5 AP-644 Intel 56 TSOP 29220* intel
    Text: E AP-644 APPLICATION NOTE Intel StrataFlash Memory Migration Guide December 1997 Order Number: 292202-002 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of


    Original     		PDF AP-644 AP-646 AP-647 28F032SA 28F008S5 28F008SA 28F016S5 28F016SA 28F016SV 28F160S5 AP-644 Intel 56 TSOP 29220* intel

    IC197-5606

    Abstract: IC197-4807 IC197 Yamaichi Electronics ic197
    Text: TSOP Type I Shielded Lid SMT IC197 Series Ordering Information IC197- * *- 210 * Characteristics Current Rating: Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: Mating Cycles: Socket Series No. of Contacts Design Number


    Original     		PDF IC197 IC197- 300mA 10mA/20mV Thermoplastic-UL94V-0 IC197-3202-210* IC197-3203-210* IC197-4001-210* IC197-4004-210* IC197-4807-210* IC197-5606 IC197-4807 Yamaichi Electronics ic197

    IC197-4807-200

    Abstract: IC197-4807 IC197-5606 IC197-4807-2 IC197-3202-200 Yamaichi Electronics ic197
    Text: TSOP Type I Metal Lid SMT IC197 Series Ordering Information IC197- * *- 200 * Lid Socket Characteristics Current Rating: Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: Mating Cycles: Socket Series No. of Contacts


    Original     		PDF IC197 IC197- 300mA 10mA/20mV Thermoplastic-UL94V-0 pac14 IC197-3202-200* IC197-3203-200* IC197-4001-200* IC197-4004-200* IC197-4807-200 IC197-4807 IC197-5606 IC197-4807-2 IC197-3202-200 Yamaichi Electronics ic197

    SmartDie

    Abstract: 28F008B3 28F016B3 28F032B3 28F032C3 28F160B3 28F160F3 28F320B3 28F400B3 28F800B3
    Text: Flash Memory Quick Reference Guide ion 5 Vers ’98 Aug. Intel package lineup Intel Package Lineup Refer to Intel’s World Wide Web Site for Additional Flash Information Development Tools/Electronic Tools Catalog http://developer.intel.com/design/flash/swtools/


    Original     		PDF USA/0898/15K/MS SmartDie 28F008B3 28F016B3 28F032B3 28F032C3 28F160B3 28F160F3 28F320B3 28F400B3 28F800B3

    toshiba toggle mode nand

    Abstract: TC518128 TC518129 TC551001 equivalent 551664 TC518512 sgs-thomson power supply Toggle DDR NAND flash jeida 38 norm APPLE A5 CHIP
    Text: DRAM Technology n TOSHIBA DRAM TECHNOLOGY Toshiba DRAM Technology 2 DRAM Technology n DRAM TECHNOLOGY TRENDS Density Design Rule 64M→128M →256M →512M →1G 0.35µm →0.25 µm →0.20 µm →0.175 µm Cost Down, Yield Improvement High Bandwidth Multi - bit


    Original     		PDF 64M128M 66MHz 100MHz 200MHz) 500/600MHz 800MHz 400MHz 800MHz) X16/X18X32 PhotoPC550 toshiba toggle mode nand TC518128 TC518129 TC551001 equivalent 551664 TC518512 sgs-thomson power supply Toggle DDR NAND flash jeida 38 norm APPLE A5 CHIP

    JEDEC SPD No.21

    Abstract: JEDEC MO 224 MO-224 dimm ddr 400 x16 configuration sdram pcb gerber PC2100 PC2700 SDA Physical Layer Specification Version 2.00 gerber so-dimm 200
    Text: JEDEC Standard No. 21–C Page 4.20.6–1 4.20.6 – 200 Pin, PC2700 DDR SDRAM Unbuffered SO–DIMM REFERENCE DESIGN SPECIFICATION PC2700 DDR SDRAM Unbuffered SO-DIMM Reference Design Specification Revision 1.0 Release 11 Revision 1.0 JEDEC Standard No. 21–C


    Original     		PDF PC2700 MO-224 JEDEC SPD No.21 JEDEC MO 224 dimm ddr 400 x16 configuration sdram pcb gerber PC2100 SDA Physical Layer Specification Version 2.00 gerber so-dimm 200