QFP160-P-2828-0
Abstract: QFP304 TSOP 66 pin Package thermal resistance TSOP 48 thermal resistance bga 208 PACKAGE QFJ32-P-R450-1 SDIP64-P-750-1 SOJ28-P-400-1 QFP208-P-2828-0 TSOP 48 thermal resistance junction to case
Text: This version: Apr. 2001 Previous version:Jun. 1997 PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE This document is Chapter 5 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE
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Abstract: No abstract text available
Text: NVGS3130N Product Preview Power MOSFET 20 V, 5.9 A, Single N−Channel, TSOP−6 Features • • • • • Leading Edge Trench Technology for Low On Resistance Low Gate Charge for Fast Switching Small Size 3 x 2.75 mm TSOP−6 Package AEC−Q101 Qualified and PPAP Capable
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NVGS3130N
NVGS3130N/D
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Abstract: No abstract text available
Text: NTGS3130N, NVGS3130N Power MOSFET 20 V, 5.6 A Single N-Channel, TSOP-6 Features • • • • • Leading Edge Trench Technology for Low On Resistance Low Gate Charge for Fast Switching Small Size 3 x 2.75 mm TSOP−6 Package NV Prefix for Automotive and Other Applications Requiring Unique
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NTGS3130N,
NVGS3130N
NTGS3130N/D
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TSOP 48 thermal resistance
Abstract: TSOP 48 thermal resistance type1 thin TSOP 8x20 package tray TSOP 32 thermal resistance TSOP 48 package tray JEDEC tray standard 13 Ablestik 12-1 signetics TSOP package tray TSOP1-48
Text: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSOP Type 1 Signetics Thin Small Outline Package Type1 Cross Section View of TSOP Type 1 Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSOP Type1 packages are available in 32 - 48 lead counts with 0.50mm lead
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12x20
TSOP 48 thermal resistance
TSOP 48 thermal resistance type1
thin TSOP 8x20 package tray
TSOP 32 thermal resistance
TSOP 48 package tray
JEDEC tray standard 13
Ablestik 12-1
signetics
TSOP package tray
TSOP1-48
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Untitled
Abstract: No abstract text available
Text: CY62128DV30 1-Mb 128K x 8 Static RAM Features also has an automatic power-down feature that significantly reduces power consumption by 90% when addresses are not toggling. The device can be put into standby mode reducing power consumption by more than 99% when deselected Chip
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CY62128DV30
CY62128V
32-lead
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Untitled
Abstract: No abstract text available
Text: RN ICPAK N uaant Specifications for TSOP Sockets MATERIALS Body: Liquid crystal polymer Plating: TT = 2.03 pm 80 pinch Tin/Lead overall. 1.27 pm (50 pinch) Nickel underplate. Frame: Glass-filled PPS Contact: Copper alloy Holder: Copper alloy Flammability: UL 94V-0
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OCR Scan
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490m/s2
98m/s2
TSOP-4050XX-SMT-TT
S13N30S
TSOP-28XX-SMT-TT
TSOP-32XX-SMT-TT
TSOP-40XX-SMT-TT
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TSOP 32 thermal resistance
Abstract: CY62128DV cy62128dv30ll-55ZXI SOIC-32L
Text: CY62128DV30 1-Mb 128K x 8 Static RAM Features also has an automatic power-down feature that significantly reduces power consumption by 90% when addresses are not toggling. The device can be put into standby mode reducing power consumption by more than 99% when deselected Chip
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CY62128DV30
CY62128V
32-lead
TSOP 32 thermal resistance
CY62128DV
cy62128dv30ll-55ZXI
SOIC-32L
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land pattern for TSOP 2-44
Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter
Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions
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TSOP-48 pcb LAYOUT
Abstract: str 6654 pin details of str f 6654 pin details of str W 6654 amd socket 940 pinout str W 6654 land pattern tsop 66 56-Lead TSOP Package 28F002BC 28F010
Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions
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70241k
Abstract: d5611 61c256 ic 9022 61c64 RELIABILITY REPORT ISSI vacuum tubes CMS 2015 S/TRANSISTOR J 5804 EQUIVALENT 28F010P
Text: ISSI Integrated Silicon Solution, Inc. Quality and Reliability 1997-1998 An ISO 9001 Company ISSI ® Reliability Report 1997-1998 An ISO 9001 Company 1997 Integrated Silicon Solution, Inc. Integrated Silicon Solution, Inc. • 2231 Lawson Lane • Santa Clara, CA 95054
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R-118
70241k
d5611
61c256
ic 9022
61c64
RELIABILITY REPORT ISSI
vacuum tubes
CMS 2015
S/TRANSISTOR J 5804 EQUIVALENT
28F010P
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c9013
Abstract: 84 pin PBGA oscilloscope MTBF TSMC retention memory dc 8069 IS61C1024 IC Data-book Q-16 car radio 14x20 TSOP 8638
Text: ISSI Integrated Silicon Solution, Inc. Quality and Reliability 1997-1998 An ISO 9001 Company ISSI ® Quality System Manual QUALITY Reliabilty Report 1997-1998 RELIABILITY Integrated Silicon Solution, Inc. An ISO 9001 Company 1997 Integrated Silicon Solution, Inc.
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R-118
c9013
84 pin PBGA
oscilloscope MTBF
TSMC retention memory
dc 8069
IS61C1024
IC Data-book
Q-16
car radio 14x20
TSOP 8638
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CY62128DV30LL-55ZI
Abstract: CY62128DV30LL-70SXI CY62128DV30LL-70ZXI CY62128DV30 CY62128DV30L-55SI CY62128V CY62128DV30LL-70ZAXI
Text: CY62128DV30 1-Mb 128K x 8 Static RAM Features also has an automatic power-down feature that significantly reduces power consumption by 90% when addresses are not toggling. The device can be put into standby mode reducing power consumption by more than 99% when deselected Chip
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CY62128DV30
CY62128V
CY62128DV30LL-55ZI
CY62128DV30LL-70SXI
CY62128DV30LL-70ZXI
CY62128DV30
CY62128DV30L-55SI
CY62128V
CY62128DV30LL-70ZAXI
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CY62128DV30
Abstract: CY62128DV30L-55SI CY62128V TSOP 32 thermal resistance
Text: CY62128DV30 1-Mb 128K x 8 Static RAM Features also has an automatic power-down feature that significantly reduces power consumption by 90% when addresses are not toggling. The device can be put into standby mode reducing power consumption by more than 99% when deselected Chip
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CY62128DV30
CY62128V
CY62128DV30
CY62128DV30L-55SI
CY62128V
TSOP 32 thermal resistance
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PAL 007 pioneer
Abstract: pioneer PAL 007 A PAL 008 pioneer sn 7600 n 648-0482211 sem 2106 Trays tsop56 TSOP 86 land pattern amd socket 940 pinout Meritec 980020-56
Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions
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pioneer PAL 007 A
Abstract: PAL 007 pioneer str 6654 PAL 008 pioneer pin details of str W 6654 sem 2106 Yamaichi Electronics ic197 648-0482211 TSOP56 jackson
Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions
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TSOP 48 thermal resistance
Abstract: TSOP 48 stacked die package MS-024 MO-142 TSOP 32 thermal resistance TSOP 48 package tray MO-183 marking code 56l jedec ms-024
Text: LEADFRAME data sheet TSOP Features: Thin Small Outline Package TSOP : Amkor offers a family of popular TSOP packages to serve the needs of IC designers, PCB/system engineers and component specifiers. Small and thin, these 1.0 mm thick packages were designed and introduced to operate
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MS-024
TSOP 48 thermal resistance
TSOP 48 stacked die package
MS-024
MO-142
TSOP 32 thermal resistance
TSOP 48 package tray
MO-183
marking code 56l
jedec ms-024
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Untitled
Abstract: No abstract text available
Text: CY62128DV30 MoBL 1-Mb 128K x 8 Static RAM Features • • • • • • • • • an automatic power-down feature that significantly reduces power consumption by 90% when addresses are not toggling. The device can be put into standby mode reducing power consumption by more than 99% when deselected Chip Enable 1
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05300
Abstract: CY62128BLL-55SXI A5 GNC CY62128BLL-55SXC TSOP 87 CY62128B CY62128BLL-55ZXI
Text: CY62128B MoBL 128K x 8 Static RAM Functional Description[1] Features • Temperature Ranges The CY62128B is a high-performance CMOS static RAM organized as 131,072 words by 8 bits. Easy memory expansion is provided by an active LOW Chip Enable CE1 , an active HIGH Chip Enable (CE2), an active LOW Output
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CY62128B
CY62128B
CY62128BLL-55ZC,
CY62128BLL-55ZAC,
CY62128BLL-55ZRC,
CY62128BLL-70ZAC,
CY62128BLL-70ZRI,
CY62128BLL-70ZRC
05300
CY62128BLL-55SXI
A5 GNC
CY62128BLL-55SXC
TSOP 87
CY62128BLL-55ZXI
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Untitled
Abstract: No abstract text available
Text: CY62128DV30 1-Mb 128K x 8 Static RAM Features also has an automatic power-down feature that significantly reduces power consumption by 90% when addresses are not toggling. The device can be put into standby mode reducing power consumption by more than 99% when deselected Chip
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a5 gnc
Abstract: CY62128BLL-55SXC CY62128B CY62128BLL-55SC cy62128bll-55zc cy62128bll
Text: CY62128B MoBL 1-Mbit 128K x 8 Static RAM Functional Description[1] Features • Temperature Ranges — Commercial: 0°C to 70°C The CY62128B is a high-performance CMOS static RAM organized as 131,072 words by 8 bits. Easy memory expansion is provided by an active LOW Chip Enable (CE1),
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CY62128B
CY62128B
CY62128BLL-55ZC,
CY62128BLL-55ZAC,
CY62128BLL-55ZRC,
CY62128BLL-70ZAC,
CY62128BLL-70ZRI,
CY62128BLL-70ZRC
a5 gnc
CY62128BLL-55SXC
CY62128BLL-55SC
cy62128bll-55zc
cy62128bll
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A5 GNC
Abstract: CY62128B
Text: CY62128B MoBL 1-Mbit 128K x 8 Static RAM Functional Description[1] Features • Temperature Ranges — Commercial: 0°C to 70°C The CY62128B is a high-performance CMOS static RAM organized as 131,072 words by 8 bits. Easy memory expansion is provided by an active LOW Chip Enable (CE1),
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CY62128B
CY62128B
sta128K
CY62128BLL-55ZC,
CY62128BLL-55ZAC,
CY62128BLL-55ZRC,
CY62128BLL-70ZAC,
CY62128BLL-70ZRI,
CY62128BLL-70ZRC
A5 GNC
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Abstract: No abstract text available
Text: CY14B116L/CY14B116N/CY14B116S CY14E116L/CY14E116N/CY14E116S PRELIMINARY 16-Mbit 2048 K x 8/1024 K × 16/512 K × 32 nvSRAM Features • ■ 16-Mbit nonvolatile static random access memory (nvSRAM) ❐ 25-ns, 30-ns and 45-ns access times ❐ Internally organized as 2048 K × 8 (CY14X116L),
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CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
16-Mbit
16-Mbit
25-ns,
30-ns
45-ns
CY14X116L)
CY14X116N)
CY14X116S)
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Abstract: No abstract text available
Text: CY14B116L/CY14B116N/CY14B116S CY14E116L/CY14E116N/CY14E116S PRELIMINARY 16-Mbit 2048 K x 8/1024 K × 16/512 K × 32 nvSRAM Features • 16-Mbit nonvolatile static random access memory (nvSRAM) ❐ 25-ns, 30-ns and 45-ns access times ❐ Internally organized as 2048 K × 8 (CY14X116L),
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CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
16-Mbit
16-Mbit
25-ns,
30-ns
45-ns
CY14X116L)
CY14X116N)
CY14X116S)
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Abstract: No abstract text available
Text: CY14B116L/CY14B116N/CY14B116S CY14E116L/CY14E116N/CY14E116S PRELIMINARY 16-Mbit 2048 K x 8/1024 K × 16/512 K × 32 nvSRAM Features • 16-Mbit nonvolatile static random access memory (nvSRAM) ❐ 25-ns, 30-ns and 45-ns access times ❐ Internally organized as 2048 K × 8 (CY14X116L),
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CY14B116L/CY14B116N/CY14B116S
CY14E116L/CY14E116N/CY14E116S
16-Mbit
16-Mbit
25-ns,
30-ns
45-ns
CY14X116L)
CY14X116N)
CY14X116S)
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