TSMC INV Search Results

TSMC INV Result Highlights (5)

Part	Manufacturer	Description
7UL1G07FU	Toshiba Electronic Devices & Storage Corporation	One-Gate Logic(L-MOS), Non-Inverter Buffer (Open Drain), USV, -40 to 85 degC
MGN1S1208MC-R7	Murata Manufacturing Co Ltd	DC-DC 1W SM 12-8V GAN
MGN1D120603MC-R7	Murata Manufacturing Co Ltd	DC-DC 1W SM 12-6/-3V GAN
MGN1S1212MC-R7	Murata Manufacturing Co Ltd	DC-DC 1W SM 12-12V GAN
MGN1S0508MC-R7	Murata Manufacturing Co Ltd	DC-DC 1W SM 5-8V GAN

TSMC INV Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
ISSI Abstract: TSMC embedded Flash TSMC Flash memory 0.18 motorola tsmc flash Integrated Silicon Solution Inc "embedded dram" tsmc memory issi tsmc 0.18 flash TSMC embedded EEPROM Text: Memory Based Solutions ISSI ¨ Integrated Silicon Solution, Inc. ISSI www.issi.com 1 ISSI198_11/98 ¨ Integrated Silicon Solution, Inc. Over Ten Years of High-Performance Memories ISSI Milestones Incorporated - 1988 u First Foundry Partnership TSMC - 1990	Original	PDF	ISSI198 ISSI TSMC embedded Flash TSMC Flash memory 0.18 motorola tsmc flash Integrated Silicon Solution Inc "embedded dram" tsmc memory issi tsmc 0.18 flash TSMC embedded EEPROM
TSMC embedded Flash Abstract: NT410 tsmc 0.18 flash TSMC Flash cmos tsmc 0.18 TSMC Flash memory 0.18 TSMC Flash IP tsmc cmos NT1208 NT1115 Text: Taiwan Semiconductor Manufacturing Company Ltd. January 27, 2000 Page 1 FOR IMMEDIATE RELEASE CONTACT IN TAIWAN CONTACT IN NEW YORK Derek Tien or Julie Chan Finance Division TSMC invest@tsmc.com.tw 886/3/567-2664 Mami Ogawa Thomson Financial Investor Relations	Original	PDF
TSMC embedded Flash Abstract: TSMC Flash memory 0.18 ISSI Integrated Silicon Solution Inc Text: Over Ten Years of High-Performance Memories ISSI Integrated Silicon Solution, Inc. ISSI www.issi.com 1 ISSI198_11/98 ® Integrated Silicon Solution, Inc. Over Ten Years of High-Performance Memories ISSI Milestones Incorporated - 1988 u First Foundry Partnership TSMC - 1990	Original	PDF	ISSI198 TSMC embedded Flash TSMC Flash memory 0.18 ISSI Integrated Silicon Solution Inc
roadmap ISSI Abstract: IS61C1024 IS61C64AH IS61C64B IS62C64 IS89C52 IS25M080A5T2R IS80C32 flash memory 5v 16M-bit 48 TSOP ISSI Text: Memory Based Solutions ISSI Integrated Silicon Solution, Inc. ISSI www.issi.com 1 ISSI_498 04/09/98 ® Integrated Silicon Solution, Inc. Memory Based Solutions ISSI Milestones • • • • • • • Incorporated - 1988 First Foundry Partnership TSMC - 1990	Original	PDF	IS22C020 IS22C040 IS22C041 IS22C042 IS82C600 roadmap ISSI IS61C1024 IS61C64AH IS61C64B IS62C64 IS89C52 IS25M080A5T2R IS80C32 flash memory 5v 16M-bit 48 TSOP ISSI
JESD22-A114F Abstract: JESD47 JESD-47 JEDEC JESD22-B116 free download JESD22-A102C JESD22-A108B JESD22-B116A JESD22-A114-F JESD78B JESD22-A102-C Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: W-1002-01(R4) DATE: October 4, 2010 Affected Products: Refer to the attached list of products transferring from IDT Fab 4 to TSMC	Original	PDF	JESD22-A115B, JESD78B AV265 JESD22-B116-A, EIA/JESD22-A110B, EIA/JESD22-A102C, 168hrs JESD22-A113 JESD22-A114F JESD47 JESD-47 JEDEC JESD22-B116 free download JESD22-A102C JESD22-A108B JESD22-B116A JESD22-A114-F JESD78B JESD22-A102-C
PCN0813 Abstract: EPM240T100C5N EP1C3T144C8N EPM240T100I5N EPM1270T144C5N EPM570T144C5N EPM240T100C5 EPM570T100C5N EPM2210F256A5N f324 Text: Revision: 1.0.0 PROCESS CHANGE NOTIFICATION PCN0813 POLYIMIDE WAFER COAT REMOVAL FOR SELECTED ALTERA DEVICES Change Description Altera is implementing a change to the wafer coat on selected product lines fabricated at Taiwan Semiconductor Manufacturing Co. TSMC . This change includes the exclusion of the existing	Original	PDF	PCN0813 PM2210GF256C5N EPM2210GF256C5RR EPM2210GF256I5 EPM2210GF256I5N EPM2210GF324C3 EPM2210GF324C3N EPM2210GF324C4 EPM2210GF324C4N EPM2210GF324C5 PCN0813 EPM240T100C5N EP1C3T144C8N EPM240T100I5N EPM1270T144C5N EPM570T144C5N EPM240T100C5 EPM570T100C5N EPM2210F256A5N f324
TSMC Flash Abstract: linear handbook E144 EP3C10 EP3C120 EP3C16 EP3C25 EP3C40 EP3C55 automatic heat detector project report Text: Cyclone III Design Guidelines November 2008 AN-466-1.2 Introduction The Cyclone III FPGA family offered by Altera ® is a cost-optimized, memory-rich FPGA family. Cyclone III FPGAs are built on Taiwan Semiconductor Manufacturing Company's TSMC 65-nm low-power (LP) process technology with additional silicon	Original	PDF	AN-466-1 65-nm TSMC Flash linear handbook E144 EP3C10 EP3C120 EP3C16 EP3C25 EP3C40 EP3C55 automatic heat detector project report
70241k Abstract: d5611 61c256 ic 9022 61c64 RELIABILITY REPORT ISSI vacuum tubes CMS 2015 S/TRANSISTOR J 5804 EQUIVALENT 28F010P Text: ISSI Integrated Silicon Solution, Inc. Quality and Reliability 1997-1998 An ISO 9001 Company ISSI ® Reliability Report 1997-1998 An ISO 9001 Company 1997 Integrated Silicon Solution, Inc. Integrated Silicon Solution, Inc. • 2231 Lawson Lane • Santa Clara, CA 95054	Original	PDF	R-118 70241k d5611 61c256 ic 9022 61c64 RELIABILITY REPORT ISSI vacuum tubes CMS 2015 S/TRANSISTOR J 5804 EQUIVALENT 28F010P
c9013 Abstract: 84 pin PBGA oscilloscope MTBF TSMC retention memory dc 8069 IS61C1024 IC Data-book Q-16 car radio 14x20 TSOP 8638 Text: ISSI Integrated Silicon Solution, Inc. Quality and Reliability 1997-1998 An ISO 9001 Company ISSI ® Quality System Manual QUALITY Reliabilty Report 1997-1998 RELIABILITY Integrated Silicon Solution, Inc. An ISO 9001 Company 1997 Integrated Silicon Solution, Inc.	Original	PDF	R-118 c9013 84 pin PBGA oscilloscope MTBF TSMC retention memory dc 8069 IS61C1024 IC Data-book Q-16 car radio 14x20 TSOP 8638
PCI AHB DMA Abstract: tsmc 0.18 axi bridge Text: Compliant with PCI Express Base Specification 1.1 CPXP-EP PCI Express Endpoint Controller Core with SoC Bridge Extensions for AHB, AXI and Wishbone Implements a PCI Express endpoint controller that is compliant with PCI Express Base specification 1.1, including the Transaction, Data Link, and Physical protocol layers. It	Original	PDF	250MB/s PCI AHB DMA tsmc 0.18 axi bridge
FW82801AA Abstract: Intel FW82801AA 4297a CS4297A PC99 FW82801AA sl3z2 Text: Product Change Notification Change Management Contact at Intel: Name: Mailing Address: Phone Number: Fax Number: Electronic Mail Address: Please respond to the Intel Contact above if you have any issues with the timeline or content of this change. No response from customers will be deemed as acceptance of change and the change will	Original	PDF	A01172-601 A01172-602 A01171-601 A01171-602 FW82801AA Intel FW82801AA 4297a CS4297A PC99 FW82801AA sl3z2
verilog code for implementation of des Abstract: verilog code for des tsmc sram des verilog RTL 604 Text: FIPS 46-3 Standard Compliant DES Data Encryption Standard Core Encryption/Decryption performed in 16 cycles ECB mode 56 bits of security For use in FPGA or ASIC designs Verilog IP Core Non Pipelined version Small gate count The DES core implements the Data Encryption Standard (DES) documented in the U.S.	Original	PDF	0x0123456789abcdef 0x4e6f772069732074 0x68652074696d6520 0x666f7220616c6c20 0x3fa40e8a984d4815 0x6a271787ab8883f9 0x893d51ec4b563b53 verilog code for implementation of des verilog code for des tsmc sram des verilog RTL 604
tsmc 130nm metal process Abstract: tsmc 130 lp 65nm tsmc design rule Qualcomm "power management" 2010 Altera Cyclone III qualcomm power Text: White Paper Achieving Low Power in 65-nm Cyclone III FPGAs With the introduction of the 65-nm Cyclone III family, Altera continues to deliver greater capabilities to designers of cost-sensitive high-volume applications. The move to the 65-nm process node provides the benefits associated with	Original	PDF	65-nm 90-nm tsmc 130nm metal process tsmc 130 lp 65nm tsmc design rule Qualcomm "power management" 2010 Altera Cyclone III qualcomm power
667 ecb Abstract: verilog code for implementation of des verilog code for des tsmc sram Text: FIPS 46-3 Standard Compliant Encryption/Decryption performed in 48 cycles ECB mode DES3 Up to 168 bits of security Triple Data Encryption Standard Core Verilog IP Core The DES3 core implements the Triple Data Encryption Standard (DES3) documented in the U.S. Government publication FIPS 46-3.	Original	PDF

Broadcom product roadmap Abstract: 65-nm 65nm sources tsmc 130nm metal process 2015 static ram BROADCOM "heat sink" Qualcomm "power management" 2010 WP-01002-1 65nm Text: White Paper Altera’s Strategy for Delivering the Benefits of the 65-nm Semiconductor Process Introduction Altera's strategy for delivering the benefits of the 65-nm semiconductor manufacturing process focuses on leveraging advanced technologies and methods to provide the most capable and highest performance devices at the lowest cost,	Original	PDF	65-nm 65-nm Broadcom product roadmap 65nm sources tsmc 130nm metal process 2015 static ram BROADCOM "heat sink" Qualcomm "power management" 2010 WP-01002-1 65nm
Untitled Abstract: No abstract text available Text: Compliant with PCI Express Base Specification 1.1 CPXP-EPx8 PCI Express Endpoint Controller Core with SoC Bridge Extensions for AMBA AXI Implements a PCI Express endpoint controller that is compliant with PCI Express Base specification 1.1, including the Transaction, Data Link, and Physical protocol layers. It	Original	PDF
DC04 display Abstract: how to test POWER MOSFET with digital multimeter tektronix 576 curve tracer VISHAY VT 300 WEIGHT INDICATOR TSMC 0.35Um FLUKE 79 manual THERMAL ELECTRIC COOLER hp 4274A 532 nm laser diode PHOTO TRANSISTOR ppt Text: Quality And Reliability Report 2005 DC04-0001 Page 1 of 79	Original	PDF	DC04-0001 DC04 display how to test POWER MOSFET with digital multimeter tektronix 576 curve tracer VISHAY VT 300 WEIGHT INDICATOR TSMC 0.35Um FLUKE 79 manual THERMAL ELECTRIC COOLER hp 4274A 532 nm laser diode PHOTO TRANSISTOR ppt
tsmc 0.18 Abstract: C32025TX C32025 TMS320C25 ram tsmc 0.18 Text: Control Unit o Single-clock per machine cycle operation o 16-bit instruction decoding C32025TX o Repeat instructions for effi- Digital Signal Processor Core cient use of program space o 8-level Hardware Stack Central Arithmetic-Logic Unit o 16-bit sign-extended parallel	Original	PDF	16-bit C32025TX C32025TX TMS320C25 tsmc 0.18 C32025 ram tsmc 0.18
verilog code for 128 bit AES encryption Abstract: vhdl code for cbc verilog code for 32 bit AES encryption TSMC 90nm vhdl code for aes decryption SP800-38A vhdl code for AES algorithm FIPS-197 Text: Conforms to the Advanced Encryption Standard AES standard (FIPS PUB 197) AES-C Single module efficiently integrates multiple AES functions AES Optimized Encrypt/Decrypt Core Run-time programmable for: The AES-C core implements hardware data encryption and decryption using Rijndael	Original	PDF	FIPS-197 256-bits 128ectors, SP800-38A verilog code for 128 bit AES encryption vhdl code for cbc verilog code for 32 bit AES encryption TSMC 90nm vhdl code for aes decryption vhdl code for AES algorithm
JESD22-B116 Abstract: MIL-STD-883 Method 2019 EIA/JESD22-B116 "MIL-STD-883 Method 2019" 74LVC16245 JESD78 74LVC16244 74LVCH162244 L0007-04 Text: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN 7/31/00 PCN #: L0007-04 DATE: Product Affected: 74LVC16244, 74LVC16245 74LVCH162244 Manufacturing Location Affected: IDT Salinas Fab Date Effective:	Original	PDF	L0007-04 74LVC16244, 74LVC16245 74LVCH162244 QLG-00-07 EIA/JESD22-B116 Mil-Std-883, JESD22-B116 MIL-STD-883 Method 2019 EIA/JESD22-B116 "MIL-STD-883 Method 2019" 74LVC16245 JESD78 74LVC16244 74LVCH162244 L0007-04
NEC protocol Abstract: Nec Infrared protocol decoder NEC IR circuit diagram for simple IR receiver IR decoder transmission NEC CIR NEC DECODER home theater IR remote control circuit diagram NEC IR protocol ir pulse decoder Text:  8-bit address and 8-bit com- mand length IR-NEC-E and -D Infrared Encoder and Decoder Cores  Carrier frequency of 38 kHz as per the NEC standard  Pulse distance modulation  Fully synchronous design Encoder Features  Address and command are	Original	PDF
JESD22-B116 Abstract: MIL-STD-883 method 2019 JESD22-A110 MIL-STD-883 PRESSURE JESD22A110 Text: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN 7/31/2000 PCN #: L0007-04 DATE: Product Affected: 74LVC16244, 74LVC16245 74LVCH162244 Manufacturing Location Affected: IDT Salinas Fab Date Effective:	Original	PDF	L0007-04 74LVC16244, 74LVC16245 74LVCH162244 L0007-04 QLG-00-07 74LVC16245 EIA/JESD22-B116 Mil-Std-883, JESD22-B116 MIL-STD-883 method 2019 JESD22-A110 MIL-STD-883 PRESSURE JESD22A110
tsmc 0.18um Abstract: pci 2.3 TSMC memory guide Text: Fully compliant with the PCI Local Bus Specification, Revision 2.3. PCI-M32MF Multi-Function PCI Master/Target Interface Core 33 MHz performance 66 MHz optional 32-bit datapath Full Master/Target functionality, with support for these commands: o Configuration Read, Configu-	Original	PDF	PCI-M32MF 32-bit PCI-M32MF tsmc 0.18um pci 2.3 TSMC memory guide
ISSI Abstract: NEXFLASH Integrated Silicon Solution Inc Jabil Circuit Text: NexFlash Technologies, Inc. 1 ISSI Highlights b Memory solutions for Internet infrastructure and wireless communications b High growth markets b Expanding product portfolio; high end products b Capacity commitments from the three largest foundries b Blue chip customer list	Original	PDF

TSMC INV Search Results

TSMC INV Result Highlights (5)

TSMC INV Datasheets Context Search

ISSI

TSMC embedded Flash

TSMC embedded Flash

roadmap ISSI

JESD22-A114F

PCN0813

TSMC Flash

70241k

c9013

PCI AHB DMA

FW82801AA

verilog code for implementation of des

tsmc 130nm metal process

667 ecb

Broadcom product roadmap

Untitled

DC04 display

tsmc 0.18

verilog code for 128 bit AES encryption

JESD22-B116

NEC protocol

JESD22-B116

tsmc 0.18um

ISSI