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    10190N

    Abstract: tsmc Activation Energy
    Text: Cypress Semiconductor Technology Qualification Report QTP# 99285 VERSION 1.3 July, 2000 L28-TSMC Technology in TSMC-2A, Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069 Cypress Semiconductor L28-TSMC Technology in TSMC-2A


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    PDF L28-TSMC CY2280 CY2280PVC 100-MHz CY2280-OC 85C/85 10190N tsmc Activation Energy

    XPC823ZT66B2T

    Abstract: XPC823ZT81B2T XPC823 XPC823ZT75B2T motorola tsmc XPC823ZT66B2 KXPC823ZT81B2T MPC823 MOS11 xpc823zt66
    Text: Semiconductor Products Sector Networking and Computing Systems Group Networking and Communications System Division PCN: MPC823 XC Qualification in TSMC/WaferTech Motorola is pleased to announce an additional wafer fabrication facility, TSMC/WaferTech, for


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    PDF MPC823 XPC823 MOS11 W90913 W90904 W90912 XPC823ZT66B2T XPC823ZT81B2T XPC823ZT75B2T motorola tsmc XPC823ZT66B2 KXPC823ZT81B2T xpc823zt66

    XPC823ZT66B2T

    Abstract: XPC823 XPC823ZT75B2T XPC823ZT81B2T KXPC823ZT81B2T MPC823 W90913 XPC823ZT
    Text: M Semiconductor Products Sector Networking and Computing Systems Group Networking and Communications System Division PCN: MPC823 XC Qualification in TSMC/WaferTech Motorola is pleased to announce an additional wafer fabrication facility, TSMC/WaferTech, for


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    PDF MPC823 XPC823 MOS11 W90913 W90904 W90912 XPC823ZT66B2T XPC823ZT75B2T XPC823ZT81B2T KXPC823ZT81B2T W90913 XPC823ZT

    MIL-STD-883 Method 3015.7

    Abstract: tsmc design rule L28-TSMC tsmc Activation Energy tsmc cmos tsmc Ea CY2037-2WAF CY2037AWAF CY5037
    Text: Cypress Semiconductor Fab Transfer Qualification Report QTP# 001103 VERSION 2.0 July, 2000 CY2037A Wafer L28-TSMC Technology in TSMC-2A, Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069 Cypress Semiconductor


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    PDF CY2037A L28-TSMC CY5037AWAF/CY2037-2WAF CY2037AWAF/CY2037-2WAF, CY2037AWAF CY2037-2WAF CY2280-OC 85C/85 MIL-STD-883 Method 3015.7 tsmc design rule tsmc Activation Energy tsmc cmos tsmc Ea CY2037-2WAF CY5037

    L28-TSMC

    Abstract: tsmc cmos 7C80380A tsmc Activation Energy tsmc Ea tsmc design rule TSMC-2A
    Text: Cypress Semiconductor Technology Qualification Report QTP# 000402VERSION 1.1 July, 2000 CY5037A Wafer L28-TSMC Technology in TSMC-2A, Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Manager 408 432-7069 Cypress Semiconductor


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    PDF 000402VERSION CY5037A L28-TSMC CY5037A CY5037A, CY5037AWAF CY2280-OC 85C/85 tsmc cmos 7C80380A tsmc Activation Energy tsmc Ea tsmc design rule TSMC-2A

    XPC850SRZT50BT

    Abstract: XPC850ZT50BT XPC850DEZT50BT XPC850SRZT80BT XPC850DEZT66BT XPC850SRZT66A SPB25 SC5302 MPC850 XPC850SRCZT50B
    Text: Semiconductor Products Sector Networking and Computing Systems Group Networking and Communications System Division PCN: MPC850 XC Qualification in TSMC/WaferTech EFFECTIVE DATE: 30-SEPT-00 Motorola is pleased to announce an additional wafer fabrication facility, TSMC/WaferTech, for


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    PDF MPC850 30-SEPT-00 MOS11 C850ZT66A, PPC850SRZT50A, SC530206ZT50B, XPC850CZT50A, XPC850SRZT50BT XPC850ZT50BT XPC850DEZT50BT XPC850SRZT80BT XPC850DEZT66BT XPC850SRZT66A SPB25 SC5302 XPC850SRCZT50B

    ISSI

    Abstract: TSMC embedded Flash TSMC Flash memory 0.18 motorola tsmc flash Integrated Silicon Solution Inc "embedded dram" tsmc memory issi tsmc 0.18 flash TSMC embedded EEPROM
    Text: Memory Based Solutions ISSI ¨ Integrated Silicon Solution, Inc. ISSI www.issi.com 1 ISSI198_11/98 ¨ Integrated Silicon Solution, Inc. Over Ten Years of High-Performance Memories ISSI Milestones Incorporated - 1988 u First Foundry Partnership TSMC - 1990


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    PDF ISSI198 ISSI TSMC embedded Flash TSMC Flash memory 0.18 motorola tsmc flash Integrated Silicon Solution Inc "embedded dram" tsmc memory issi tsmc 0.18 flash TSMC embedded EEPROM

    TSMC embedded Flash

    Abstract: TSMC Flash memory 0.18 ISSI Integrated Silicon Solution Inc
    Text: Over Ten Years of High-Performance Memories ISSI Integrated Silicon Solution, Inc. ISSI www.issi.com 1 ISSI198_11/98 ® Integrated Silicon Solution, Inc. Over Ten Years of High-Performance Memories ISSI Milestones Incorporated - 1988 u First Foundry Partnership TSMC - 1990


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    PDF ISSI198 TSMC embedded Flash TSMC Flash memory 0.18 ISSI Integrated Silicon Solution Inc

    tristate buffer cmos

    Abstract: TSMC 0.18 um CMOS "embedded dram" tsmc tsmc cmos 0.13 um TSMC 0.18um tsmc cmos 0.13 MOSAID Technologies TSMC cmos 0.18um
    Text: SoC-RAMTM PL Memory Core 0.18µm 4.97Mbit embedded DRAM Macrocell Memory Type: Process: Geometry: Configuration: Structure: Synchronous DRAM 0.18µm Generic TSMC Logic Process Memory Density Area Height Width Cell-Efficiency Number of banks Number of pages in a bank


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    PDF 97Mbit tristate buffer cmos TSMC 0.18 um CMOS "embedded dram" tsmc tsmc cmos 0.13 um TSMC 0.18um tsmc cmos 0.13 MOSAID Technologies TSMC cmos 0.18um

    tsmc design rule

    Abstract: tsmc cmos tsmc Activation Energy tsmc L28-TSMC
    Text: Cypress Semiconductor Product Qualification Report QTP# 001205 VERSION 1.2 July, 2000 Low Cost Three-PLL Clock Generator CY2081SC/CY2081SL TSMC-2A, Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Manager 408 432-7069 Cypress Semiconductor


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    PDF CY2081SC/CY2081SL L28-TSMC CY2081SC/CY2081SL CY2280-OC 85C/85 tsmc design rule tsmc cmos tsmc Activation Energy tsmc

    TSMC 0.13um CMOS

    Abstract: "programmable on-chip termination" 10gbps serdes tsmc cmos XCVR CHIP EXPRESS SB1011 ethernet mdio circuit diagram mdio termination
    Text: SB1011 PRODUCT BRIEF SILICON BRIDGE SB1011 - Quad 0.625 - 4.25Gbps Low Power CMOS Transceiver Macro Cell in 0.13um TSMC Process FEATURES BENEFITS/ADVANTAGES • • • • • • • • • • • • • • • Quad SerDes transceivers with Clock multiplier and


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    PDF SB1011 SB1011 25Gbps 0625Gbps, 125Gbps, 25Gbps, 10b/20b TSMC 0.13um CMOS "programmable on-chip termination" 10gbps serdes tsmc cmos XCVR CHIP EXPRESS ethernet mdio circuit diagram mdio termination

    roadmap ISSI

    Abstract: IS61C1024 IS61C64AH IS61C64B IS62C64 IS89C52 IS25M080A5T2R IS80C32 flash memory 5v 16M-bit 48 TSOP ISSI
    Text: Memory Based Solutions ISSI Integrated Silicon Solution, Inc. ISSI www.issi.com 1 ISSI_498 04/09/98 ® Integrated Silicon Solution, Inc. Memory Based Solutions ISSI Milestones • • • • • • • Incorporated - 1988 First Foundry Partnership TSMC - 1990


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    PDF IS22C020 IS22C040 IS22C041 IS22C042 IS82C600 roadmap ISSI IS61C1024 IS61C64AH IS61C64B IS62C64 IS89C52 IS25M080A5T2R IS80C32 flash memory 5v 16M-bit 48 TSOP ISSI

    tsmc cmos 0.13 um

    Abstract: "embedded dram" tsmc
    Text: SoC-RAMTM PL Memory Core 0.18µm 3Mbit embedded DRAM Macrocell Memory Type: Process: Geometry: Configuration: Structure: Synchronous DRAM 0.18µm Generic TSMC Logic Process Memory Density Area Height Width Cell-Efficiency Number of banks Number of pages in a bank


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    tsmc cmos 0.13 um

    Abstract: "embedded dram" tsmc D1270 TSMC cmos 0.18um TSMC 0.18Um MOSAID Technologies
    Text: SoC-RAMTM PL Memory Core 0.18µm 8Mbit embedded DRAM Macrocell Memory Type: Process: Geometry: Configuration: Structure: Synchronous DRAM 0.18µm Generic TSMC Logic Process Memory Density Area Height Width Cell-Efficiency Number of banks Number of pages in a bank


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    TSMC 0.35Um

    Abstract: TSMC 1P4M HP83K cmos tsmc 0.18 tsmc FAB10 FAB-10 tsmc cmos 0.35 PI7C8150B PI7C8150A PI7C8152A
    Text: 3545 North First St. • San Jose, CA 95134 • USA PRODUCT/PROCESS CHANGE NOTICE PCN PCN Number: 06-04 Date Issued: June 30, 2006 Product(s) Affected: PI7C8150A, 8150A-33, 8150B, 8150B-33, PI7C8152A, 8152B Manufacturing Location Affected: TSMC Fab 7 and 10


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    PDF PI7C8150A, 150A-33, 8150B, 8150B-33, PI7C8152A, 8152B FAB10 TSMC 0.35Um TSMC 1P4M HP83K cmos tsmc 0.18 tsmc FAB10 FAB-10 tsmc cmos 0.35 PI7C8150B PI7C8150A PI7C8152A

    Untitled

    Abstract: No abstract text available
    Text: CC2538 www.ti.com SWRS096 – DECEMBER 2012 A Powerful System-On-Chip for 2.4-GHz IEEE 802.15.4-2006 and ZigBee Applications FEATURES 1 • Microcontroller – Powerful ARM Cortex M3 With Code Prefetch – 512-KB, 256-KB or 128-KB In-SystemProgrammable TSMC Flash


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    PDF CC2538 SWRS096 512-KB, 256-KB 128-KB 512-KB 32-KB 16-KB

    CC2538

    Abstract: CC2538SF53 SWRU319 TSMC Flash L372
    Text: CC2538 www.ti.com SWRS096 – DECEMBER 2012 A Powerful System-On-Chip for 2.4-GHz IEEE 802.15.4-2006 and ZigBee Applications FEATURES 1 • Microcontroller – Powerful ARM Cortex M3 With Code Prefetch – 512-KB, 256-KB or 128-KB In-SystemProgrammable TSMC Flash


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    PDF CC2538 SWRS096 512-KB, 256-KB 128-KB 512-KB 32-KB 16-KB AES-128/2i CC2538 CC2538SF53 SWRU319 TSMC Flash L372

    tsmc design rule

    Abstract: 1120008 tsmc tsmc cmos MIL-STD-883C method 2011 tsmc Activation Energy tsmc cmos model
    Text: Cypress Semiconductor Product Qualification Report QTP# 002105 VERSION 1.0 October, 2000 High Accuracy EPROM Programmable Single-PLL Clock Generator L28 Technology, CTI fab 2 and TSMC fab 2A, Taiwan CY2077 390 kHz - 133MHz at 5V 390 kHz -100 MHz at 3.3V CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA:


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    PDF CY2077 133MHz CY2077SC/CY2077ZC CY2280-OC 85C/85 tsmc design rule 1120008 tsmc tsmc cmos MIL-STD-883C method 2011 tsmc Activation Energy tsmc cmos model

    tsmc cmos

    Abstract: Mixed Signal Integration N-7075 INTEGRATED CIRCUIT DESIGNS
    Text: PRELIMINARY PRODUCT SPECIFICATION nAD820-65d 8-bit 20 MSPS Analog-to-Digital Converter IP FEATURES • • • • • • INSE0 INSE1 INSE2 INSE3 • CYCLIC ADC 4:1 MUX VOLTAGE REFERENCE APPLICATIONS • TIMING GENERATOR DIGITAL CONTROL OPM[1:0] CLK TSMC CL65LP 1.2/2.5 V Technology


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    PDF nAD820-65d CL65LP N-7075 tsmc cmos Mixed Signal Integration INTEGRATED CIRCUIT DESIGNS

    tsmc cmos 0.13 um

    Abstract: internal block diagram of 8088 CL013G N-7075 tsmc cmos tsmc cmos 0.13
    Text: BRIEF PRODUCT SPECIFICATION nPLL20160-13a 160 MHz Low Jitter PLL FEATURES • • • • • • • • • TSMC CL013G 1.2/3.3 V 160 MHz Low Jitter PLL Reference Clock Input 20-22 MHz, 25-27 MHz, 40-44MHz and 80-88 MHz Programmable Steps, 2, 4, 6 and 8 Divider


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    PDF nPLL20160-13a CL013G 40-44MHz N-7075 tsmc cmos 0.13 um internal block diagram of 8088 tsmc cmos tsmc cmos 0.13

    H.264 encoder

    Abstract: EP3C10 EP3C120 EP3C16 EP3C25 EP3C40 EP3C55 TSMC 90nm cyclone III TSMC memory
    Text: A D V E R T O R I A L DesignPerspective Unlimited possibilities Designing for high-volume, low-power applications. Altera Cyclone® III low-cost FPGAs deliver an unprecedented combination of low power, high functionality, and low cost. Manufactured using the Taiwan Semiconductor Manufacturing Company’s TSMC’s 65-nm low-power (LP) process technology, these devices consume


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    PDF 65-nm EP3C10 EP3C16 EP3C25 EP3C40 EP3C55 EP3C80 EP3C120 H.264 encoder EP3C10 EP3C120 EP3C16 EP3C25 EP3C40 EP3C55 TSMC 90nm cyclone III TSMC memory

    70241k

    Abstract: d5611 61c256 ic 9022 61c64 RELIABILITY REPORT ISSI vacuum tubes CMS 2015 S/TRANSISTOR J 5804 EQUIVALENT 28F010P
    Text: ISSI Integrated Silicon Solution, Inc. Quality and Reliability 1997-1998 An ISO 9001 Company ISSI ® Reliability Report 1997-1998 An ISO 9001 Company 1997 Integrated Silicon Solution, Inc. Integrated Silicon Solution, Inc. • 2231 Lawson Lane • Santa Clara, CA 95054


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    PDF R-118 70241k d5611 61c256 ic 9022 61c64 RELIABILITY REPORT ISSI vacuum tubes CMS 2015 S/TRANSISTOR J 5804 EQUIVALENT 28F010P

    c9013

    Abstract: 84 pin PBGA oscilloscope MTBF TSMC retention memory dc 8069 IS61C1024 IC Data-book Q-16 car radio 14x20 TSOP 8638
    Text: ISSI Integrated Silicon Solution, Inc. Quality and Reliability 1997-1998 An ISO 9001 Company ISSI ® Quality System Manual QUALITY Reliabilty Report 1997-1998 RELIABILITY Integrated Silicon Solution, Inc. An ISO 9001 Company 1997 Integrated Silicon Solution, Inc.


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    PDF R-118 c9013 84 pin PBGA oscilloscope MTBF TSMC retention memory dc 8069 IS61C1024 IC Data-book Q-16 car radio 14x20 TSOP 8638

    HYNIX lot date code

    Abstract: HYNIX manufacturing code HP8110A "TSMC 0.6um" thermostream 1P2M A18-B18 TBS24 1p2m tsmc HP8116A
    Text: 3545 North First St. • San Jose, CA 95134 • USA PRODUCT/PROCESS CHANGE NOTICE PCN PCN Number: 04-03 Date Issued: March 1, 2004 Product(s) Affected: PI5C16862C Manufacturing Location Affected: Hynix Semiconductor Date Effective: June 1, 2004 (calendar week 23, 2004).


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    PDF PI5C16862C 50pF//500W 50pF//500W, 10MHz 20MHz HYNIX lot date code HYNIX manufacturing code HP8110A "TSMC 0.6um" thermostream 1P2M A18-B18 TBS24 1p2m tsmc HP8116A