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    TRANSMISSION LINES IN SIGNAL INTEGRITY Search Results

    TRANSMISSION LINES IN SIGNAL INTEGRITY Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    TCTH022BE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Open-drain type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH022AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012BE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Open-drain type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TLP2701 Toshiba Electronic Devices & Storage Corporation Photocoupler (photo-IC output), 5000 Vrms, 4pin SO6L Visit Toshiba Electronic Devices & Storage Corporation
    74HC4053FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SPDT(1:2)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation

    TRANSMISSION LINES IN SIGNAL INTEGRITY Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    backplane design

    Abstract: PCI backplane Layout backplane layout GTLP16T1655 Signal Path Designer
    Text: Revised March 2002 Section 4 - Backplane Design Considerations Backplane Designer’s Guide This section focuses on designing high-performance parallel backplanes, a task that can be extremely complex. To assure high performance and good signal integrity, many issues must be considered during the design process. To a large extent,


    Original     		PDF

    SIGNAL PATH DESIGNER

    Abstract: DSA0050327
    Text: Revised March 2002 Section 6 - Noise, Cross-talk, Jitter, Skew, and EMI Backplane Designer’s Guide This section discusses backplane signal integrity, focusing on the phenomena and effects that can disrupt clean signals and high signal integrity. Enemies of signal integrity include noise, cross-talk, jitter, skew, and electromagnetic interference


    Original     		PDF

    SIGNAL PATH DESIGNER

    Abstract: No abstract text available
    Text: White Paper Basic Principles of Signal Integrity Introduction Digital designs have not traditionally suffered by issues associated with transmission line effects. At lower frequencies the signals remain within data characterization and the system performs as designed. But as system


    Original     		PDF

    SSTL-18

    Abstract: No abstract text available
    Text: Impact of I/O Settings on Signal Integrity in Stratix III Devices October 2007, ver. 1.0 Application Note 476 Introduction This application note provides information on the effects of the I/O settings on the quality of the signal. Its main focus is on drive strength


    Original     		PDF

    GS8170DW36B

    Abstract: CLAMSHELL
    Text: HSTL I/O Sync SRAM Board Design Guidelines System designers using high speed Synchronous Static RAM must consider how printed circuit board layout affects signal integrity when designing 100–300 MHz systems. Transmission line effects will affect signals even on short trace runs at these high speeds.


    Original     		PDF

    S1M A3

    Abstract: S1M a4 pin model spice
    Text: Simulation of the signal integrity of the ERNI ERmet 10Row 2mm H.M. connectors This application note is a demonstration for the use of the SPICE simulation models of the ERNI ERmet connector family. The goal of this simulation is to predict the crosstalk on a single connector pin issued by


    Original     		PDF 10Row S1M A3 S1M a4 pin model spice

    Untitled

    Abstract: No abstract text available
    Text: DataSource CD-ROM Q4-01: techXclusives techXclusives techXclusives Signal Integrity: Tips and Tricks By Austin Lesea Principal Engineer - Xilinx San Jose Signal Integrity SI engineering has become a necessary requirement for today's high-speed logic signals. Having control of cross-talk, ground


    Original     		PDF Q4-01:

    TN-46-06

    Abstract: FR4 substrate with dielectric constant 4.4 transmission lines in signal integrity TN4606 micron power resistor FR4 substrate with dielectric constant 4 MICRON 63 micron resistor Signal Integrity transmission line theory
    Text: TN-46-06 TERMINATON FOR POINT-TO-POINT SYSTEMS TECHNICAL NOTE TERMINATION FOR POINTTO-POINT SYSTEMS INTRODUCTION TRANSMISSION LINE THEORY Because digital signal rates in computing systems are increasing at an astonishing rate, signal integrity issues have become far more important to designers. At higher


    Original     		PDF TN-46-06 TN-46-06: TN4606 TN-46-06 FR4 substrate with dielectric constant 4.4 transmission lines in signal integrity micron power resistor FR4 substrate with dielectric constant 4 MICRON 63 micron resistor Signal Integrity transmission line theory

    CY7C038

    Abstract: SIGNAL PATH designer
    Text: Input Signal Integrity for CMOS Dual-Port Products Memory arrays are typically sensitive to noise and glitches at the input. Excessive undershoot or line noise may cause memory upset and data loss. When designing a circuit board, a good termination scheme is needed to maintain signal integrity. For details about the kinds of termination and transmission lines, please refer to the application notes “System


    Original     		PDF CY7C038or CY7C038 SIGNAL PATH designer

    DS3662

    Abstract: AN-337
    Text: INTRODUCTION As the microcomputer bus bandwidth is extended to handle ever increasing clock rates, the noise susceptibility of a single-ended bus poses a serious threat to the overall system integrity. Thus, it is mandatory that the various noise contributions be taken into account in the design of the bus


    Original     		PDF an005281 DS3662 AN-337

    DPRAM

    Abstract: CY7C038 Signal Path Designer
    Text: Input Signal Integrity for CMOS Dual-Port Products AN1142 Introduction Ground and Power Supply Bounce Memory arrays are typically sensitive to noise and glitches at the input. Excessive undershoot or line noise may cause memory upset and data loss. When designing a circuit board,


    Original     		PDF AN1142 DPRAM CY7C038 Signal Path Designer

    DSLAM drawing

    Abstract: DSLAM board layout hyperlynx SIGNAL INTEGRITY AND TIMING SIMULATION PC3T04 IDT74FCT3807 PMC-1990815 PC3B01 74LCX244MCT
    Text: VORTEX CHIPSET RELEASED DSLAM APPS NOTE PMC-1990816 ISSUE 1 SIGNAL INTEGRITY AND TIMING SIMULATION DSLAM DSLAM APPS NOTE: SIGNAL INTEGRITY AND TIMING SIMULATION FOR THE VORTEX CHIPSET S/UNI-DUPLEX, S/UNI-VORTEX, S/UNI-APEX AND S/UNI-ATLAS Released Issue 1


    Original     		PDF PMC-1990816 DSLAM drawing DSLAM board layout hyperlynx SIGNAL INTEGRITY AND TIMING SIMULATION PC3T04 IDT74FCT3807 PMC-1990815 PC3B01 74LCX244MCT

    alan 100 plus

    Abstract: Microwave PIN diode spice power supply diagram
    Text: DesignCon 2007 FPGA Design for Signal and Power Integrity Larry Smith, Altera Corporation Hong Shi, Altera Corporation CP-01023-1.0 January 2007 Abstract FPGAs have traditionally been optimized for low-cost environments where signal and power integrity are minor considerations. With today’s requirements for high-speed


    Original     		PDF CP-01023-1 alan 100 plus Microwave PIN diode spice power supply diagram

    buffer driver ic SPICE MODEL S

    Abstract: hyperlynx what is the drawback of operating system SN65LVDS31 SN65LVDS32 ic 4145B converter spice model 4145B
    Text: Generating Accurate Behavioral Models of I/O Buffers Thomas Fisher Texas Instruments Abstract As data rates continue to rise the need for Signal Integrity simulation grows in importance. With this new interest in SI simulation comes the need to simulate accurately down to the device level. Silicon manufacturers are being asked with


    Original     		PDF ANSI/EIA-656) accuraNSI/EIA656) buffer driver ic SPICE MODEL S hyperlynx what is the drawback of operating system SN65LVDS31 SN65LVDS32 ic 4145B converter spice model 4145B

    Fairchild Switching power supply Technologies

    Abstract: AN-5017 EIA-644 TR30 RS-644 Signal path designer
    Text: Fairchild Semiconductor Application Note December 2000 Revised December 2000 LVDS Fundamentals Introduction What is LVDS? With the recent developments in the communications market, the demand for throughput is becoming increasingly more crucial. Although older differential technologies provide significant signal integrity benefits compared to singleended technologies, many of them consume much more


    Original     		PDF TIA/EIA-644 AN-5017 Fairchild Switching power supply Technologies EIA-644 TR30 RS-644 Signal path designer

    AN1051

    Abstract: AN2127 MPC5500 MPC5553 MPC5554 MPC5554 evb AN2705
    Text: Freescale Semiconductor Application Note Signal Integrity Considerations with MPC5500-based Systems by: Stevan Dobrasevic and John Phillippe MCD Design 1 Introduction As external bus interfaces increase in operating frequency, signal integrity becomes a major concern for


    Original     		PDF MPC5500-based MPC5500 AN2705 MPC5553 MPC5554 AN1051 AN2127 MPC5554 evb AN2705

    of 1000 microfarad electrolytic capacitor

    Abstract: JTAG series termination resistors
    Text: R Printed Circuit Board Considerations Layout Considerations The PC board is no longer just a means to hold ICs in place. At today’s high clock rates and fast signal transitions, the PC board performs a vital function in feeding stable supply voltages to the IC and in maintaining signal integrity between devices.


    Original     		PDF UG002 of 1000 microfarad electrolytic capacitor JTAG series termination resistors

    Untitled

    Abstract: No abstract text available
    Text: RFSeries High-performance RF Pyramid Probe cards DATA SHEET Cascade Microtech’s high-performance RF Pyramid Probe cards provide state-of-the-art signal integrity for wireless RF and microwave production test. Microstrip transmission lines maintain impedance control all the way to the bond pad. Patented ground and power planes


    Original     		PDF PyramidRF-DS-0212

    Tektronix P6056

    Abstract: microstrip antenna mf AN-831 C1995 SUMITOMO F2 AN-831 national
    Text: National Semiconductor Application Note 831 Michael L Gilbert James W Davison William M Hall July 1992 INTRODUCTION Electromagnetic Interference EMI has long been an issue in the integrity and certification of electronic systems Until recently design and measurement of electromagnetic compatibility (EMC) has predominantly been the focus of the


    Original     		PDF 20-3A Tektronix P6056 microstrip antenna mf AN-831 C1995 SUMITOMO F2 AN-831 national

    Signal Integrity Handbook

    Abstract: Signal Integrity edge rate processing microwave products TWISTED SHIELDED PAIR SPICE MODEL transmission line model orcad pspice samtec PCIE 1-800-SAMTEC-9 samtec PCIE design
    Text: INTERCONNECT SIGNAL INTEGRITY HANDBOOK AUGUST 2007 INTERCONNECT SIGNAL INTEGRITY HANDBOOK 2007 by Samtec, Inc. All rights reserved. Table of Contents Introduction . 4


    Original     		PDF 1-800-SAMTEC-9 Signal Integrity Handbook Signal Integrity edge rate processing microwave products TWISTED SHIELDED PAIR SPICE MODEL transmission line model orcad pspice samtec PCIE 1-800-SAMTEC-9 samtec PCIE design

    FF1136

    Abstract: SSTL18I thevenin DDR2 sstl_18 class magic eye ML461 ML561 UG190 UG199 XAPP863
    Text: Application Note: Virtex-5, Virtex-4, and Spartan-3 Generation Devices R XAPP863 v1.0 June 1, 2007 Using Digitally Controlled Impedance: Signal Integrity vs. Power Dissipation Considerations Author: David Banas Summary On-die termination (ODT) promises higher signaling rates for printed circuit board (PCB) interchip interfaces through improved signal integrity. However, when using ODT, there is


    Original     		PDF XAPP863 org/download/search/JESD8-15a UG190, com/bvdocs/userguides/ug190 UG079, ML461 com/bvdocs/userguides/ug079 UG199, ML561 com/bvdocs/userguides/ug199 FF1136 SSTL18I thevenin DDR2 sstl_18 class magic eye UG190 UG199 XAPP863

    N3215B

    Abstract: EESof
    Text: Agilent EEsof EDA Designing for Signal Integrity with Advanced Design System Course Overview Course Numbers Agilent-Training Center: N3215A Onsite-Training: N3215B Length What you will learn Prerequisites 3 Days • A brief introduction to ADS is presented, showing schematic capture,


    Original     		PDF N3215A N3215B 5989-2890EN N3215B EESof

    transmission lines Twisted Pair spice model

    Abstract: transmission lines Twisted Pair characteristics of twisted pair cable LVDS 30 pin connector cable slla053 twisted pair cable with parameter XAPP230 idc 20 pin data ribbon connector receiver LVDS XAPP231
    Text: Application Note: Virtex-E Family The LVDS I/O Standard R XAPP230 v1.1 November 16, 1999 Application Note: Jon Brunetti & Brian Von Herzen Ph.D. Summary This application note describes the LVDS I/O standard. LVDS provides higher noise immunity than single-ended techniques, allowing for higher transmission speeds, smaller signal swings,


    Original     		PDF XAPP230 transmission lines Twisted Pair spice model transmission lines Twisted Pair characteristics of twisted pair cable LVDS 30 pin connector cable slla053 twisted pair cable with parameter XAPP230 idc 20 pin data ribbon connector receiver LVDS XAPP231

    GA9012

    Abstract: GA22V10
    Text: GA9011/GA9012 Hoi Rod Update The following changes have been made to the Hot Rod data sheet, dated July, 1991: Figure I.Chip Set Data Flow Communications Protocol Unidirectional Link HOT ROD TRANSMITTER 40 • The maximum transmit strobe interval requirement for guaranteed data integrity


    OCR Scan     		PDF GA9011/GA9012 GA9011, GA9012 28-Pin GA9101, GA9102 GA9102 68-Pin GA9012 GA22V10