TQFP100
Abstract: No abstract text available
Text: 100P6V-A Plastic 100pin 12✕12mm body TQFP EIAJ Package Code TQFP100-P-1212-0.40 Weight g JEDEC Code – Lead Material Alloy 42 HD D 100 76 1 HE E 75 Symbol 25 51 26 50 A L1 F y A1 b c A2 e L Detail F A A1 A2 b c D E e HD HE L L1 y Dimension in Millimeters
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100P6V-A
100pin
TQFP100-P-1212-0
TQFP100
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TQFP100
Abstract: 14X14
Text: SANYO Semiconductor Thin Quad Flat Package 100Pin Plastic TQFP100 14X14 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。
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100Pin
TQFP100
14X14)
ED-7303A
TQFP100
14X14
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MN101C56A
Abstract: MN101C56C
Text: MN101C56A , MN101C56C Type ROM x× 8-bit MN101C56A (under planning) MN101C56C (under development) 32 K 48 K 1.79 K 1.79 K External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package TQFP100-P-1414E Minimum Instruction Execution Time
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MN101C56A
MN101C56C
TQFP100-P-1414E
PX-ICE101C
PX-PRB101C56-C
MN101CP56C
MN101C56A
MN101C56C
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TQFP100
Abstract: tQFP100 package TQFP100-P-1414-0
Text: TQFP100-P-1414-0.50-K Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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TQFP100-P-1414-0
TQFP100
tQFP100 package
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PTQP0100KA-A
Abstract: TQFP100
Text: JEITA Package Code P-TQFP100-14x14-0.50 RENESAS Code PTQP0100KA-A Previous Code TFP-100B/TFP-100BV MASS[Typ.] 0.5g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 75 51 76 50 bp c c1 HE Reference
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P-TQFP100-14x14-0
PTQP0100KA-A
TFP-100B/TFP-100BV
PTQP0100KA-A
TQFP100
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TQFP100
Abstract: No abstract text available
Text: JEITA Package Code P-TQFP100-12x12-0.40 RENESAS Code PTQP0100LB-A Previous Code 100PFB-A MASS[Typ.] 0.4g HD *1 D 75 51 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. *2 HE 50 E 76 26 1 25 ZD Reference
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P-TQFP100-12x12-0
PTQP0100LB-A
100PFB-A
TQFP100
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ADSTB xilinx
Abstract: Add.dat XILINX/TSOP 137
Text: XILINX PROGRAMMER QUALIFICATION SPECIFICATION XC9500XL FAMILY 1. Introduction This document pertains to the following devices and packages: 9536XL - PLCC44, CSP48, and VQFP64 9572XL - PLCC44, CSP48, VQFP64, and TQFP100 95144XL - TQFP100, TQFP144, and CSP144
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XC9500XL
9536XL
PLCC44,
CSP48,
VQFP64
9572XL
VQFP64,
TQFP100
ADSTB xilinx
Add.dat
XILINX/TSOP 137
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TQFP100
Abstract: 14X14 TQFP-100
Text: SANYO Semiconductor Thin Quad Flat Package 100Pin Plastic TQFP100 14X14 Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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100Pin
TQFP100
14X14)
ED-7303A)
TQFP100
14X14
TQFP-100
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Untitled
Abstract: No abstract text available
Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC To Top / Package Lineup / Package Index FPT-100P-M09 EIAJ code : TQFP100-P-1414-1 100-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 14 × 14 mm Lead shape
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FPT-100P-M09
TQFP100-P-1414-1
100-pin
FPT-100P-M09)
F100011S-1C-2
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TQFP100
Abstract: No abstract text available
Text: JEITA Package Code P-TQFP100-14x14-0.50 RENESAS Code PTQP0100KB-D Previous Code TFP-100JV MASS[Typ.] 0.5g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 75 51 76 50 HE c Reference Symbol *2 E
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P-TQFP100-14x14-0
PTQP0100KB-D
TFP-100JV
4x14-0
TQFP100
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Untitled
Abstract: No abstract text available
Text: MN101C56A , MN101C56C Type ROM x× 8-bit MN101C56A (under planning) MN101C56C 32 K 48 K 1.5 K 1.79 K External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package TQFP100-P-1414E *Pb free (under planning) Minimum Instruction Execution Time
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MN101C56A
MN101C56C
MN101C56C
TQFP100-P-1414E
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Untitled
Abstract: No abstract text available
Text: Package outline TQFP100: plastic thin quad flat package; 100 leads; body 14 x 14 x 1 mm SOT386-1 c y X A 51 75 50 76 ZE e E HE A A2 w M A 3 A1 θ bp Lp pin 1 index L 100 detail X 26 1 25 e ZD w M bp v M A D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)
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TQFP100:
OT386-1
137E20
MS-026
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TQFP100 package SOT386-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land
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TQFP100
OT386-1
OT386-1
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Untitled
Abstract: No abstract text available
Text: TQFP100V LSI Assembly Units : mm • TQFP100V 16.0 14.0 75 51 50 100 26 16.0 14.0 76 1 25 H=1.2Max. The contents described herein are subject to change without notice. Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any
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TQFP100V
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sot386
Abstract: MA26
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline TQFP100: plastic thin quad flat package; 100 leads; body 14 x 14 x 1.0 mm SOT386-1 c y X A 51 75 50 76 ZE e E HE A A2 w M A 3 A1 θ bp Lp pin 1 index L 100 detail X 26 1 25 ZD e v M A w M bp D B HD
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TQFP100:
OT386-1
OT386-1
sot386
MA26
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Untitled
Abstract: No abstract text available
Text: 100PFD-B Plastic 100pin 14 ✕20mm body TQFP Weight g JEDEC Code – Lead Material Cu Alloy MD e EIAJ Package Code TQFP100-P-1420-0.65 HD 100 ME D 1 b2 76 75 l2 Symbol HE E Recommended Mount Pad A A1 A2 b c D E e HD HE L L1 y 51 25 26 A 50 L1 F b y A1 c A2
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100PFD-B
100pin
TQFP100-P-1420-0
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Untitled
Abstract: No abstract text available
Text: JEITA Package Code P-TQFP100-14x14-0.50 RENESAS Code PTQP0100KA-A Previous Code TFP-100B/TFP-100BV MASS[Typ.] 0.5g HD *1 D 75 51 76 NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. 50 bp c c1 HE *2 E b1
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P-TQFP100-14x14-0
PTQP0100KA-A
TFP-100B/TFP-100BV
00QFP100-14x14-0
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TQFP-100P
Abstract: No abstract text available
Text: TQFP100-P-1414-0.50-K 0.125t Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 (g) 版数／改版日 エポキシ樹脂 42 アロイ 半田メッキ(≥5µm) 0.55 TYP. 1 版/00.3.30
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TQFP100-P-1414-0
TQFP-100P
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TQFP100
Abstract: tQFP100 package MS-026 MS-026 tqfp100
Text: PDF: 2000 Feb 02 Philips Semiconductors Package outline TQFP100: plastic thin quad flat package; 100 leads; body 14 x 14 x 1.0 mm SOT386-1 c y X A 51 75 50 76 ZE e E HE A A2 w M A 3 A1 θ bp Lp pin 1 index L 100 detail X 26 1 25 ZD e v M A w M bp D B HD
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TQFP100:
OT386-1
137E20
MS-026
TQFP100
tQFP100 package
MS-026
MS-026 tqfp100
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TQFP100
Abstract: No abstract text available
Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC FPT-100P-M09 EIAJ code : TQFP100-P-1414-1 100-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 14 × 14 mm Lead shape Gullwing Sealing method Plastic mold FPT-100P-M09
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FPT-100P-M09
TQFP100-P-1414-1
100-pin
FPT-100P-M09)
F100011S-1C-2
TQFP100
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tQFP100 package
Abstract: Atmel STK600 schematic STK600 SC03 New products 1
Text: Products: 0 Home / Starter kits Subtotal: $0 Shopping List Search / Atmel STK600 -TQFP100 Starter kits Home Store Search Starter kits Select Device Select Category Enter Keywords: Debuggers Starter kits Programmers Atmel STK600 -TQFP100 ATSTK600 -SC03 Touch kits
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STK600
-TQFP100
ATSTK600
-SC03)
-SC03
TQFP100
14x14
tQFP100 package
Atmel STK600 schematic
SC03 New products 1
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Untitled
Abstract: No abstract text available
Text: MN101C56A , MN101C56C Type ROM x× 8-bit MN101C56A (under planning) MN101C56C 32 K 48 K 1.5 K 1.79 K External memory can be expanded RAM (×× 8-bit) External memory can be expanded Package TQFP100-P-1414E *Pb free (under planning) Minimum Instruction Execution Time
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MN101C56A
MN101C56C
MN101C56C
TQFP100-P-1414E
KEY10
PX-ICE101C
PX-PRB101C56-TQFP100-P-1414E
MN101CP56C
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Untitled
Abstract: No abstract text available
Text: TQFP100—P—1420—0.65A Uniti nn Feb,2007
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TQFP100-Pâ
2007TQFP100-Pâ
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Untitled
Abstract: No abstract text available
Text: TQFP10Q— P— 1414— 0.50A Uniiii nn ic nn*n o «m , n w |l|l|l|l|l|l|l|l|l|l|l|l|l|l|l|l|l|l|l|l|l|l|l|l|l^ a v ' t-@ n 15, o tg e Feb,2007
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