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    TQFP 100 PACKAGE FOOTPRINT Search Results

    TQFP 100 PACKAGE FOOTPRINT Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    XPH13016MC Toshiba Electronic Devices & Storage Corporation P-ch MOSFET, -60 V, -60 A, 0.0099 Ω@-10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation

    TQFP 100 PACKAGE FOOTPRINT Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    qfn 44 PACKAGE footprint

    Abstract: qfn 76 PACKAGE footprint ML6652CM qfn 48 PACKAGE footprint QFN 36 footprint qfn 64 pcb layout ML6652CH ML6652 LPCC44 eco solder paste
    Text: AN-002 - ML6652 TQFP-LPCC DUAL FOOTPRINT TECHNIQUE AN-002 ML6652 TQFP-LPCC DUAL FOOTPRINT TECHNIQUE Introduction In November 2003, the ML6652CM/EM package version of the ML6652 10/100 Mb/s Ethernet Media Converter was introduced. The ML6652CM/EM is the QFN/LPCC44 package version of the ML6652. The


    Original     		PDF AN-002 ML6652 AN-002 ML6652CM/EM QFN/LPCC44 ML6652. ML6652CH/EH qfn 44 PACKAGE footprint qfn 76 PACKAGE footprint ML6652CM qfn 48 PACKAGE footprint QFN 36 footprint qfn 64 pcb layout ML6652CH LPCC44 eco solder paste

    sd3-75

    Abstract: FDC37C67X FDC37C93X cross PD6 GP20 GP25 SA10 SMSC Corporation cross reference
    Text: APPLICATION NOTE 6.13 FDC37C67x/FDC37C93x Dual Footprint By Nizar Azzam This document describes a dual footprint layout for the FDC37C67x and the FDC37C93x. The FDC37C67x is a 100 pin QFP/TQFP package and the FDC37C93x is a 160 pin QFP package. Refer to FDC37C67x and


    Original     		PDF FDC37C67x/FDC37C93x FDC37C67x FDC37C93x. FDC37C67x FDC37C93x FDC37C67x. sd3-75 cross PD6 GP20 GP25 SA10 SMSC Corporation cross reference

    SERIRQ

    Abstract: cross PD6
    Text: APPLICATION NOTE 6.13 FDC37C67x/FDC37C93x Dual Footprint By Nizar Azzam This document describes a dual footprint layout for the FDC37C67x and the FDC37C93x. The FDC37C67x is a 100 pin QFP/TQFP package and the FDC37C93x is a 160 pin QFP package. Refer to FDC37C67x and FDC37C93x data sheets for more information.


    Original     		PDF FDC37C67x/FDC37C93x FDC37C67x FDC37C93x. FDC37C93x FDC37C67x. SERIRQ cross PD6

    A301D

    Abstract: A211D 4bc 82
    Text: $GYDQFHLQIRUPDWLRQ $6&.3 $6&.3 9.ðSLSHOLQHEXUVWV\QFKURQRXV65$0  HDWXUHV • Multiple packaging options - Economical 100-pin TQFP package - Chip-scale fBGA package for smallest footprint • Byte write enables • Clock enable for operation hold


    Original     		PDF SLSHOLQHEXUVWV\QFKURQRXV65 100-pin AS7C3512K16P-5TQC AS7C3512K18P-3 AS7C3512K18P-4TQC AS7C3512K18P-5TQC AS7C3512K16P-3 AS7C3512K16P-4BC A301D A211D 4bc 82

    seven segment 10-pa5

    Abstract: 1480B 4480B
    Text: Data Sheet LANCAM B Family APPLICATION BENEFITS DISTINCTIVE CHARACTERISTICS • New low-cost LANCAM family in a space-saving TQFP package • • Fast speed allows processing of both DA and SA within 450 ns, equivalent to 138 ports of 10 Base-T or 13 ports of 100 Base-T Ethernet


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: $GYDQFHLQIRUPDWLRQ $6&.= $6&.= 9.ðV\QFKURQRXVEXUVW65$0ZLWK17'Œ  HDWXUHV • Multiple packaging options - Economical 100-pin TQFP package - Chip-scale fBGA package for smallest footprint • Byte write enables • Clock enable for operation hold


    Original     		PDF \QFKURQRXVEXUVW65 0ZLWK17' 100-pin

    seven segment 10-pa5

    Abstract: seven segment data sheet 10-pa5 10-pa5 1480B 4480B
    Text: Data Sheet Draft LANCAM B Family APPLICATION BENEFITS DISTINCTIVE CHARACTERISTICS • New low-cost LANCAM family in a space-saving TQFP package • • Fast speed allows processing of both DA and SA within 450 ns, equivalent to 138 ports of 10 Base-T or 13 ports of 100 Base-T Ethernet


    Original     		PDF

    XC95144XL-10TQG100C

    Abstract: XC95144XL-10TQ100I XC95144XL-10CSG144C XC95144XL-10TQ144I XC95144XL-5-TQ100 XC95144XL-10TQG144C xc95144xl XC95144XL-10TQG100I XC95144XL-7TQ100C TQFP 100 PACKAGE footprint
    Text: XC95144XL High Performance CPLD R DS056 v2.0 April 3, 2007 Features • • • • • • • • • • • 5 ns pin-to-pin logic delays System frequency up to 178 MHz 144 macrocells with 3,200 usable gates Available in small footprint packages - 100-pin TQFP (81 user I/O pins)


    Original     		PDF XC95144XL DS056 100-pin 144-pin 144-CSP 220oC. XC95144XL-10TQG100C XC95144XL-10TQ100I XC95144XL-10CSG144C XC95144XL-10TQ144I XC95144XL-5-TQ100 XC95144XL-10TQG144C XC95144XL-10TQG100I XC95144XL-7TQ100C TQFP 100 PACKAGE footprint

    xc9572xl pin configuration

    Abstract: XC9572XL XC9572XL-10PCG44C XC9572XL-10CS48I XC9572XL-10VQG44C XC9572XL-7TQ100C XC9572XL-10PC44C xc9572xl-10PCG44C pin XC9572XL-7PCG44C XC9572XL-5TQG100C
    Text: XC9572XL High Performance CPLD R DS057 v2.0 April 3, 2007 Features • • • • • • • • • • • 5 ns pin-to-pin logic delays System frequency up to 178 MHz 72 macrocells with 1,600 usable gates Available in small footprint packages - 44-pin PLCC (34 user I/O pins)


    Original     		PDF XC9572XL DS057 44-pin 48-pin 64-pin 100-pin 220oC. xc9572xl pin configuration XC9572XL-10PCG44C XC9572XL-10CS48I XC9572XL-10VQG44C XC9572XL-7TQ100C XC9572XL-10PC44C xc9572xl-10PCG44C pin XC9572XL-7PCG44C XC9572XL-5TQG100C

    12 ohm register

    Abstract: 0 OHM RESISTOR FDC37C669FR FDC37N769
    Text: APPLICATION NOTE 7.0 FDC37C669FR and FDC37N769 Dual Layout By Nizar Azzam This application note describes a dual footprint layout for the SMSC FDC37C669FR and the SMSC FDC37N769. This is a TQFP package design since the SMSC FDC37N769 comes in a TQFP package only. There are two parts


    Original     		PDF FDC37C669FR FDC37N769 FDC37N769. 12 ohm register 0 OHM RESISTOR

    FDC37C669FR

    Abstract: TQFP 100 PACKAGE footprint TQFP 80 PACKAGE footprint FDC37N769 12 ohm register
    Text: APPLICATION NOTE 7.0 FDC37C669FR and FDC37N769 Dual Layout By Nizar Azzam This application note describes a dual footprint layout for the SMSC FDC37C669FR and the SMSC FDC37N769. This is a TQFP package design since the SMSC FDC37N769 comes in a TQFP package only. There are two parts


    Original     		PDF FDC37C669FR FDC37N769 FDC37N769. TQFP 100 PACKAGE footprint TQFP 80 PACKAGE footprint 12 ohm register

    Untitled

    Abstract: No abstract text available
    Text: XC95144XV High-Performance CPLD DS051 v2.5 September 13, 2002 1 Features • • • • • • • • 144 macrocells with 3,200 usable gates Available in small footprint packages - 100-pin TQFP (81 user I/O pins) - 144-pin TQFP (117 user I/O pins) - 144-pin CSP (117 user I/O pins)


    Original     		PDF XC95144XV DS051 XC9500XV

    XC95144

    Abstract: No abstract text available
    Text: XC95144XV High-Performance CPLD DS051 v2.8 April 15, 2005 1 Features • • • • • • • • 144 macrocells with 3,200 usable gates Available in small footprint packages - 100-pin TQFP (81 user I/O pins) - 144-pin TQFP (117 user I/O pins) - 144-pin CSP (117 user I/O pins)


    Original     		PDF XC95144XV DS051 XC9500XV 220oC. XC95144

    xc95144xl tq144

    Abstract: No abstract text available
    Text: XC95144XL High Performance CPLD DS056 v1.3 October 13, 2000 5 Features • • • • • • • • • • • 5 ns pin-to-pin logic delays System frequency up to 222 MHz 144 macrocells with 3,200 usable gates Available in small footprint packages - 100-pin TQFP (81 user I/O pins)


    Original     		PDF XC95144XL DS056 54V18 100-pin 144-pin 144-CSP XC95144XL TQ100 CS144 xc95144xl tq144

    Untitled

    Abstract: No abstract text available
    Text: XC95144XV High-Performance CPLD DS051 v2.6 June 18, 2003 1 Features • • • • • • • • 144 macrocells with 3,200 usable gates Available in small footprint packages - 100-pin TQFP (81 user I/O pins) - 144-pin TQFP (117 user I/O pins) - 144-pin CSP (117 user I/O pins)


    Original     		PDF XC95144XV DS051 100-pin 144-pin 54-input 220oC.

    in400x

    Abstract: P0640EA70 bd 625 QFN 64 8x8 footprint 32-PIN 44-PIN MUR120 le79555-3vc TQFP044 795552QC
    Text: SLIC Subscriber Line Interface Circuit Le79555 Device APPLICATIONS DESCRIPTION • Ideal for high-density, low-power linecard applications The Le79555 device was designed for high-density POTS applications requiring a power saving, small footprint SLIC device. The new SLIC device fulfills today's requirements for


    Original     		PDF Le79555 44-pin in400x P0640EA70 bd 625 QFN 64 8x8 footprint 32-PIN 44-PIN MUR120 le79555-3vc TQFP044 795552QC

    smsc

    Abstract: FDC37C669FR FDC37N769
    Text: APPLICATION NOTE 7.0 FDC37C669FR and FDC37N769 Dual Layout By Nizar Azzam This application note describes a dual footprint layout for the SMSC FDC37C669FR and the SMSC FDC37N769. This is a TQFP package design since the SMSC FDC37N769 comes in a TQFP package only.


    Original     		PDF FDC37C669FR FDC37N769 FDC37N769. smsc

    Untitled

    Abstract: No abstract text available
    Text: XC9572XV High-performance CPLD R DS052 v2.3 May 31, 2002 5 Features • • • • • • • • 72 macrocells with 1,600 usable gates Available in small footprint packages - 44-pin PLCC (34 user I/O pins) - 44-pin VQFP (34 user I/O pins) - 48-pin CSP (38 user I/O pins)


    Original     		PDF XC9572XV DS052 XC9500XV

    Untitled

    Abstract: No abstract text available
    Text: XC95144XV High-Performance CPLD R DS051 v2.0 January 25, 2001 1 Advance Product Specification Features Power Estimation • 144 macrocells with 3,200 usable gates • Available in small footprint packages - 100-pin TQFP (81 user I/O pins) - 144-pin TQFP (117 user I/O pins)


    Original     		PDF XC95144XV DS051 100-pin 144-pin 54-input Indivi70 TQ100 TQ144

    a6252

    Abstract: CS144 TQ100 TQ144 XC9500XV XC95144XV
    Text: XC95144XV High-Performance CPLD R DS051 v2.2 August 27, 2001 1 Advance Product Specification Features Power Estimation • 144 macrocells with 3,200 usable gates • Available in small footprint packages - 100-pin TQFP (81 user I/O pins) - 144-pin TQFP (117 user I/O pins)


    Original     		PDF XC95144XV DS051 100-pin 144-pin XC9500XV a6252 CS144 TQ100 TQ144

    Untitled

    Abstract: No abstract text available
    Text: A Advance information •■ I l AS7C3256K36Z AS7C3256K32Z 3.3V 256Kx32/36 synchronous burst SRAM with NTD Features • • • • • • • • • Multiple packaging options - Economical 100-pin TQFP package - Chip-scale fBGA package for smallest footprint


    OCR Scan     		PDF AS7C3256K36Z AS7C3256K32Z 256Kx32/36 100-pin synchroC3256K36Z AS7C3256K32Z-3 AS7C3256K32Z-4TQC AS7C3256K32Z-5TQC AS7C3256K36Z-3 AS7C3256K36Z-4TQC

    Untitled

    Abstract: No abstract text available
    Text: Advance information •■ Il AS7C3256K36Z AS7C3256K32Z II 3.3V 256Kx32/36 synchronous burst SRAM with ZBT1 Features • • • • • • • • • • M ultiple packaging options - Economical 100-pin TQFP package - Chip-scale fBGA package for smallest footprint


    OCR Scan     		PDF AS7C3256K36Z AS7C3256K32Z 256Kx32/36 100-pin 3256K 32Z-4B 32Z-5B

    ADA17

    Abstract: No abstract text available
    Text: Advance information •■ I l AS7C3256K36Z AS7C3256K32Z A 3.3V 2 5 6 K x 32/36 synchronous burst SRAM with ZBT1 Features Multiple packaging options - Economical 100-pin TQFP package - Chip-scale fBGA package for smallest footprint Byte write enables Qock enable for operation hold


    OCR Scan     		PDF AS7C3256K36Z AS7C3256K32Z 100-pin 00000DID1DDDD 5M-1982. IPC-SM-782 ADA17

    351N

    Abstract: FBGA-F
    Text: Advance information •■ I l A S7C3256K36Z A S7C3256K32Z I 3.3V 2 5 6 K x 3 2 /3 6 synchronous burst SRAM with ZB T1 Features • • • • • • • • • M ultiple p ackagin g op tion s - Econom ical 100-pin TQFP package - C hip-scale fBGA package for sm allest footprint


    OCR Scan     		PDF AS7C3256K36Z AS7C3256K32Z 256KX32/36 100-pin AS7C3256K32Z-3 AS7C3256K32Z-4TQC AS7C3256K32Z-5TQC AS7C3256K36Z-3 AS7C3256K36Z-4TQC AS7C3256K36Z-5TQC 351N FBGA-F