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    F37011

    Abstract: No abstract text available
    Text: TN0055 Technical note SRI4K die description Product information ● Product name: SRI4K ● Die code: P117ZMY Wafer and die features October 2007 Wafer diameter 8" Wafer thickness 180 µm Die technology F6SPs40s 3M 1P Diffusion Plant Chartered Die identification


    Original     		TN0055 P117ZMY F6SPs40s F37011 F37011 PDF

    electrical engineering mini project

    Abstract: V13-4 98c0945 RM0041 f91mac eZ80eval
    Text: Technical Note ZTP Porting Guide TN005502-1206 General Overview This Technical Note provides details on porting ZiLOG's TCP/IP ZTP v1.3.4 applications to the latest ZTP v2.0.0. Powered by ZiLOG's Real-Time Kernel (RZK), ZTP v2.0.0 offers a full-feature operating system service in addition to the network services occupying


    Original     		TN005502-1206 electrical engineering mini project V13-4 98c0945 RM0041 f91mac eZ80eval PDF