741C083
Abstract: 741X043 741X083 741X163 CTS CORPORATION 744 745 510
Text: 4/16/02 Series 741, 742, 743, 744, 745, 746 Technical R THICK FILM CHIP RESISTOR ARRAYS * Low cost * High density packaging * Leadless surface mount construction * Tape & reel packaging * Solder coated nickel barrier pads * Isolated and bussed circuits * Convex or Concave Termination Options
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742C083
742X083
742C163
743C043
743C083
744C043
744C083
745C101
745C102
745X101
741C083
741X043
741X083
741X163
CTS CORPORATION
744 745 510
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153 RESISTOR CHIP MARKING CODE
Abstract: No abstract text available
Text: Series 742, 743, 744, 745, 746 Technical R THICK FILM CHIP RESISTOR ARRAYS * Low cost * High density packaging * Leadless surface mount construction * Tape & reel packaging * Solder coated nickel barrier pads * Isolated and bussed circuits * Convex or Concave Termination Options
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742X083101J
742C043
742C083
742X083
742C163
743C043
743C083
744C043
744C083
745C101
153 RESISTOR CHIP MARKING CODE
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741C083
Abstract: 741X043 741X083 741X163 742C043 470k RESISTORS 153 RESISTOR CHIP MARKING CODE
Text: 8/05/02 Series 741, 742, 743, 744, 745, 746 Technical R THICK FILM CHIP RESISTOR ARRAYS * Low cost * High density packaging * Leadless surface mount construction * Tape & reel packaging * Solder coated nickel barrier pads * Isolated and bussed circuits * Convex or Concave Termination Options
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470KOhm
100KOhm
742C083
742X083
742C163
743C043
743C083
744C043
744C083
745C101
741C083
741X043
741X083
741X163
742C043
470k RESISTORS
153 RESISTOR CHIP MARKING CODE
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Untitled
Abstract: No abstract text available
Text: Series 742, 743, 744, 745, 746 Technical R THICK FILM CHIP RESISTOR ARRAYS * Low cost * High density packaging * Leadless surface mount construction * Tape & reel packaging * Solder coated nickel barrier pads * Isolated and bussed circuits * Convex or Concave Termination Options
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Original
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PDF
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742X083101J
742C043
742C083
742X083
742C163
743C043
743C083
744C043
744C083
745C101
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741C083
Abstract: 742C083 Array chip resistors size 8 0402 resistor array 4.7k 741X043 741X083 742C163
Text: Resistor Chip Arrays Technical Data Features • • • • • • • • • Low Cost Thick Film Technology High Density Packaging Leadless Surface Mount Construction Tape and Reel Packaging Solder Coated Nickel Barrier Pads Isolated and Bussed Circuits
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7310R0F
741X043
742C043
742C083
745C101
745X101
741C083
742C163
743C043
743C083
741C083
742C083
Array chip resistors size 8 0402
resistor array 4.7k
741X043
741X083
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740X043
Abstract: 741C083 741X043 741X083
Text: Chip Resistor Arrays Technical Data Features • • • • • • • • • Low Cost Thick Film Technology High Density Packaging Leadless Surface Mount Construction Tape and Reel Packaging Solder Coated Nickel Barrier Pads Isolated and Bussed Circuits
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741X043
740X043
741C083
741X083
742C043
741X163
742C083
742X083
742C163
743C043
741C083
741X043
741X083
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RESISTORS 3.3K
Abstract: No abstract text available
Text: Resistor Chip Arrays Technical Data Features • • • • • • • • • Low Cost Thick Film Technology High Density Packaging Leadless Surface Mount Construction Tape and Reel Packaging Solder Coated Nickel Barrier Pads Isolated and Bussed Circuits
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741X043
742C043
742C083
745C101
745X101
741C083
742C163
743C043
743C083
744C043
RESISTORS 3.3K
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Untitled
Abstract: No abstract text available
Text: Resistor Chip Arrays Technical Data Features • • • • • • • • • Low Cost Thick Film Technology High Density Packaging Leadless Surface Mount Construction Tape and Reel Packaging Solder Coated Nickel Barrier Pads Isolated and Bussed Circuits
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742C08310R0F
741X043
742C043
742C083
745C101
745X101
741C083
742C163
743C043
743C083
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10K ohms 0805 package
Abstract: No abstract text available
Text: Resistor Chip Arrays Technical Data Features • • • • • • • • • • Low Cost Thick Film Technology High Density Packaging Leadless Surface Mount Construction Tape and Reel Packaging Solder Coated Nickel Barrier Pads Isolated and Bussed Circuits
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741X043
742C043
742C083
745C101
745X101
741C083
742C163
743C043
743C083
744C043
10K ohms 0805 package
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742C083
Abstract: array resistor resistor array 4.7k 740X043 741C083 741X043 741X083
Text: Chip Resistor Arrays Technical Data Features • • • • • • • • • Low Cost Thick Film Technology High Density Packaging Leadless Surface Mount Construction Tape and Reel Packaging Solder Coated Nickel Barrier Pads Isolated and Bussed Circuits
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742C08310R0F
741X043
740X043
741C083
741X083
742C043
741X163
742C083
742X083
742C163
742C083
array resistor
resistor array 4.7k
741C083
741X043
741X083
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Untitled
Abstract: No abstract text available
Text: Chip Resistor Arrays Technical Data Features • • • • • • • • • Low Cost Thick Film Technology High Density Packaging Leadless Surface Mount Construction Tape and Reel Packaging Solder Coated Nickel Barrier Pads Isolated and Bussed Circuits
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742C08310R0F
741X043
742C043
742C083
745C101
745X101
741C083
742C163
743C043
743C083
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Untitled
Abstract: No abstract text available
Text: Resistor Chip Arrays Technical Data Features • • • • • • • • • Low Cost Thick Film Technology High Density Packaging Leadless Surface Mount Construction Tape and Reel Packaging Solder Coated Nickel Barrier Pads Isolated and Bussed Circuits
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Original
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2C083
741X043
742C043
742C083
745C101
745X101
741C083
742C163
743C043
743C083
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resistor array 4.7k
Abstract: 744C083 Array chip resistors size 8 0402 data sheet of resistor 33k jrc lm2903 x16 3 marking -ddr -sdram -rimm -sram -flash -m 741C083 741X043 741X083 741X163
Text: Chip Resistor Arrays Technical Data Features • • • • • • • • • Low Cost Thick Film Technology High Density Packaging Leadless Surface Mount Construction Tape and Reel Packaging Solder Coated Nickel Barrier Pads Isolated and Bussed Circuits
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Original
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PDF
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741X043
741C083
741X083
742C043
741X163
742C083
742X083
742C163
743C043
743C083
resistor array 4.7k
744C083
Array chip resistors size 8 0402
data sheet of resistor 33k
jrc lm2903
x16 3 marking -ddr -sdram -rimm -sram -flash -m
741C083
741X043
741X083
741X163
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A006 A008
Abstract: No abstract text available
Text: Chip Resistor Arrays Technical Data Features • • • • • • • • • Low Cost Thick Film Technology High Density Packaging Leadless Surface Mount Construction Tape and Reel Packaging Solder Coated Nickel Barrier Pads Isolated and Bussed Circuits
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741X043
740X043
741C083
741X083
742C043
741X163
742C083
742X083
742C163
743C043
A006 A008
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|
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tmc 4.7k ohm
Abstract: 0603x8 49R9 740X043 741X163 742C083 742C083100JP 742C083102JP 742C083102J
Text: Chip Resistor Arrays Series 74x FEATURES • Low Cost • Thick Film Technology • High Density Packaging • Leadless Surface Mount Construction • Tape and Reel Packaging • Solder Coated Nickel Barrier Pads • Isolated and Bussed Circuits • Concave and Convex Terminations
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742C083
tmc 4.7k ohm
0603x8
49R9
740X043
741X163
742C083100JP
742C083102JP
742C083102J
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Untitled
Abstract: No abstract text available
Text: Chip Resistor Arrays Series 74x FEATURES • Low Cost • Thick Film Technology • High Density Packaging • • • • • • • • - Up to 30% less space per resistor than 0603 chip resistors - Up to 75% less space per resistor than 0805 chip resistors
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2005/95/EC
742C083
741X043
741X083
745C102
741X163
745X1
742C043
742C163
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49R9
Abstract: 740X043 741X163 742C083 742C083100JP 745x102
Text: Chip Resistor Arrays Series 74x FEATURES • Low Cost • Thick Film Technology • High Density Packaging • • • • • • • • - Up to 30% less space per resistor than 0603 chip resistors - Up to 75% less space per resistor than 0805 chip resistors
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2005/95/EC
742C083
741X043
741X083
745C102
741X163
745X1
742C043
742C163
49R9
740X043
741X163
742C083
742C083100JP
745x102
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Untitled
Abstract: No abstract text available
Text: Chip Resistor Arrays Series 74x FEATURES • Low Cost • Thick Film Technology • High Density Packaging • Leadless Surface Mount Construction • Tape and Reel Packaging • Solder Coated Nickel Barrier Pads • Isolated and Bussed Circuits • Concave and Convex Terminations
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Original
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PDF
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742C083
|
Untitled
Abstract: No abstract text available
Text: Chip Resistor Arrays Series 74x FEATURES • Low Cost • Thick Film Technology • High Density Packaging • • • • • • • • - Up to 30% less space per resistor than 0603 chip resistors - Up to 75% less space per resistor than 0805 chip resistors
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2011/65/EU
741X043
741X083
745C102
741X163
745X1
742C043
742C083
742C163
745X102
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75K ohm 1 resistor
Abstract: EX1001 RES 0402 620K 1
Text: Chip Resistor Arrays Series 74x FEATURES • Low Cost • Thick Film Technology • High Density Packaging • • • • • • • • - Up to 30% less space per resistor than 0603 chip resistors - Up to 75% less space per resistor than 0805 chip resistors
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2005/95/EC
742C083
741X043
741X083
741X163
745X1
745X102
742C043
742C163
75K ohm 1 resistor
EX1001
RES 0402 620K 1
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Untitled
Abstract: No abstract text available
Text: Chip Resistor Arrays Series 74x FEATURES • Low Cost • Thick Film Technology • High Density Packaging • • • • • • • • - Up to 30% less space per resistor than 0603 chip resistors - Up to 75% less space per resistor than 0805 chip resistors
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2005/95/EC
742C083
741X043
741X083
745C102
741X163
745X1
742C043
742C163
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.024 ohm resistors
Abstract: 222 thick film chip resistor 49R9 740X043 741X163 742C083 742C083100JP chip resistor 683
Text: Chip Resistor Arrays Series 74x FEATURES • Low Cost • Thick Film Technology • High Density Packaging • Leadless Surface Mount Construction • Tape and Reel Packaging • Solder Coated Nickel Barrier Pads • Isolated and Bussed Circuits • Concave and Convex Terminations
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742C083
.024 ohm resistors
222 thick film chip resistor
49R9
740X043
741X163
742C083100JP
chip resistor 683
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EX 470
Abstract: No abstract text available
Text: Chip Resistor Arrays Series 74x FEATURES • Low Cost • Thick Film Technology • High Density Packaging • • • • • • • • - Up to 30% less space per resistor than 0603 chip resistors - Up to 75% less space per resistor than 0805 chip resistors
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2005/95/EC
742C083
741X043
741X083
741X163
745X1
745X102
742C043
742C163
EX 470
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sec 743
Abstract: No abstract text available
Text: Series 742,743,744, and •M: Technical i Thick film chip resistor arrays • Low cost • High density packaging • Leadless surface mount construction • Tape & reel packaging • Low profile suitable for PCMCIA applications • Solder coated nickel barrier pads
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OCR Scan
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489-3111/FAX:
5M-1-95I
sec 743
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