TIM1112-8
Abstract: No abstract text available
Text: TOSHIBA TIM1112-8 MICROWAVE POWER GaAs FET Internally Matched Power GaAs FETs X, Ku-Band Features • High power - P1dB = 39.5 dBm at 11.7 GHz to 12.7 GHz • High gain - G1dB = 5.0 dB at 11.7 GHz to 12.7 GHz • Broadband internally matched • Hermetically sealed package
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TIM1112-8
2-11C1B)
MW50200196
TIM1112-8
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TIM1112-4
Abstract: No abstract text available
Text: TOSHIBA TIM1112-4 MICROWAVE POWER GaAs FET Internally Matched Power GaAs FETs X, Ku-Band Features • High power - P1dB = 36.5 dBm at 11.7 GHz to 12.7 GHz • High gain - G1dB = 7.5 dB at 11.7 GHz to 12.7 GHz • Broadband internally matched • Hermetically sealed package
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TIM1112-4
MW50190196
TIM1112-4
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TIM1112-15L
Abstract: No abstract text available
Text: MICROWAVE POWER GaAs FET TIM1112-15L MICROWAVE SEMICONDUCTOR TECHNICAL DATA FEATURES n HIGH POWER P1dB=42.0dBm at 11.7GHz to 12.7GHz n HIGH GAIN G1dB=6.0dB at 11.7GHz to 12.7GHz n BROAD BAND INTERNALLY MATCHED FET n HERMETICALLY SEALED PACKAGE RF PERFORMANCE SPECIFICATIONS Ta= 25°C
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TIM1112-15L
TIM1112-15L
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Untitled
Abstract: No abstract text available
Text: MICROWAVE POWER GaAs FET TIM1112-2 MICROWAVE SEMICONDUCTOR TECHNICAL DATA FEATURES n HIGH POWER n BROAD BAND INTERNALLY MATCHED FET P1dB=33.5dBm at 11.7GHz to 12.7GHz n HIGH GAIN n HERMETICALLY SEALED PACKAGE G1dB=7.5dB at 11.7GHz to 12.7GHz RF PERFORMANCE SPECIFICATIONS Ta= 25°C
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TIM1112-2
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Untitled
Abstract: No abstract text available
Text: MICROWAVE POWER GaAs FET TIM1112-4UL MICROWAVE SEMICONDUCTOR TECHNICAL DATA FEATURES HIGH POWER P1dB=36.5dBm at 11.7GHz to 12.7GHz HIGH GAIN G1dB=9.5dB at 11.7GHz to 12.7GHz BROAD BAND INTERNALLY MATCHED FET HERMETICALLY SEALED PACKAGE RF PERFORMANCE SPECIFICATIONS
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TIM1112-4UL
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Untitled
Abstract: No abstract text available
Text: MICROWAVE POWER GaAs FET TIM1112-2 FEATURES ・BROAD BAND INTERNALLY MATCHED FET ・HIGH POWER P1dB= 33.5dBm at 11.7GHz to 12.7GHz ・HIGH GAIN G1dB= 7.5dB at 11.7GHz to 12.7GHz ・HERMETICALLY SEALED PACKAGE RF PERFORMANCE SPECIFICATIONS CHARACTERISTICS SYMBOL
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TIM1112-2
No1143
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TIM1112-2
Abstract: No abstract text available
Text: MICROWAVE POWER GaAs FET TIM1112-2 MICROWAVE SEMICONDUCTOR TECHNICAL DATA FEATURES HIGH POWER BROAD BAND INTERNALLY MATCHED FET P1dB=33.5dBm at 11.7GHz to 12.7GHz HIGH GAIN HERMETICALLY SEALED PACKAGE G1dB=7.5dB at 11.7GHz to 12.7GHz RF PERFORMANCE SPECIFICATIONS
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TIM1112-2
TIM1112-2
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TIM1112-8
Abstract: No abstract text available
Text: MICROWAVE POWER GaAs FET TIM1112-8 MICROWAVE SEMICONDUCTOR TECHNICAL DATA FEATURES HIGH POWER BROAD BAND INTERNALLY MATCHED FET P1dB=39.5dBm at 11.7GHz to 12.7GHz HIGH GAIN HERMETICALLY SEALED PACKAGE G1dB=5.0dB at 11.7GHz to 12.7GHz RF PERFORMANCE SPECIFICATIONS
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TIM1112-8
TIM1112-8
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TIM1112-4
Abstract: No abstract text available
Text: MICROWAVE POWER GaAs FET TIM1112-4 MICROWAVE SEMICONDUCTOR TECHNICAL DATA FEATURES HIGH POWER BROAD BAND INTERNALLY MATCHED FET P1dB=36.5dBm at 11.7GHz to 12.7GHz HIGH GAIN HERMETICALLY SEALED PACKAGE G1dB=7.5dB at 11.7GHz to 12.7GHz RF PERFORMANCE SPECIFICATIONS
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TIM1112-4
TIM1112-4
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TIM1112-15L
Abstract: No abstract text available
Text: MICROWAVE POWER GaAs FET TIM1112-15L MICROWAVE SEMICONDUCTOR TECHNICAL DATA FEATURES HIGH POWER P1dB=42.0dBm at 11.7GHz to 12.7GHz HIGH GAIN G1dB=6.0dB at 11.7GHz to 12.7GHz BROAD BAND INTERNALLY MATCHED FET HERMETICALLY SEALED PACKAGE RF PERFORMANCE SPECIFICATIONS
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TIM1112-15L
TIM1112-15L
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TIM1112-2
Abstract: No abstract text available
Text: TOSHIBA TIM1112-2 MICROWAVE POWER GaAs FET Internally Matched Power GaAs FETs X, Ku-Band Features • High power - P1dB = 33.5 dBm at 11.7 GHz to 12.7 GHz • High gain - G1dB = 7.5 dB at 11.7 GHz to 12.7 GHz • Broadband internally matched • Hermetically sealed package
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TIM1112-2
MW50180196
TIM1112-2
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Untitled
Abstract: No abstract text available
Text: MICROWAVE POWER GaAs FET TIM1112-4 MICROWAVE SEMICONDUCTOR TECHNICAL DATA FEATURES n HIGH POWER n BROAD BAND INTERNALLY MATCHED FET P1dB=36.5dBm at 11.7GHz to 12.7GHz n HIGH GAIN n HERMETICALLY SEALED PACKAGE G1dB=7.5dB at 11.7GHz to 12.7GHz RF PERFORMANCE SPECIFICATIONS Ta= 25°C
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TIM1112-4
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STM32F429N
Abstract: STM32F429Ni
Text: STM32F427xx STM32F429xx ARM Cortex-M4 32b MCU+FPU, 225DMIPS, up to 2MB Flash/256+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 20 comm. interfaces, camera & LCD-TFT Datasheet - production data Features &"'! • Core: ARM 32-bit Cortex®-M4 CPU with FPU,
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STM32F427xx
STM32F429xx
225DMIPS,
Flash/256
32-bit
64-KB
DocID024030
STM32F429N
STM32F429Ni
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Untitled
Abstract: No abstract text available
Text: STM32F437xx STM32F439xx ARM Cortex-M4 32b MCU+FPU, 225DMIPS, up to 2MB Flash/256+4KB RAM, crypto, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 20 comm. interfaces, camera&LCD-TFT Datasheet - production data Features &"'! • Core: ARM 32-bit Cortex®-M4 CPU with FPU,
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STM32F437xx
STM32F439xx
225DMIPS,
Flash/256
32-bit
64-KB
DocID024244
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Untitled
Abstract: No abstract text available
Text: STM32L15xx6/8/B-A Ultra-low-power 32-bit MCU ARM -based Cortex®-M3, 128KB Flash, 32KB SRAM, 4KB EEPROM, LCD, USB, ADC, DAC Datasheet - production data Features • Ultra-low-power platform – 1.65 V to 3.6 V power supply – -40°C to 85°C/105°C temperature range
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STM32L15xx6/8/B-A
32-bit
128KB
C/105Â
DocID024330
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stm32f205
Abstract: STM32F207 STM32F2xx stm32f20 SMT32F stm32f10x errata PM0059 PM0062 AN2606 stm32 timer RM00033
Text: AN2606 Application note STM32 microcontroller system memory boot mode Introduction The bootloader is stored in the internal boot ROM memory system memory of STM32 devices. It is programmed by ST during production. Its main task is to download the application program to the internal Flash memory through one of the available serial
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AN2606
STM32TM
STM32
stm32f205
STM32F207
STM32F2xx
stm32f20
SMT32F
stm32f10x errata
PM0059
PM0062
AN2606 stm32 timer
RM00033
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arm stm32 f103
Abstract: stm32f103z STM32F103VG STM32F103VF STM32F103ZG stm32f103xg stm32 f103 100 pin STM32F103Rx LQFP100 LQFP144
Text: STM32F103xF STM32F103xG XL-density performance line ARM-based 32-bit MCU with 768 KB to 1 MB Flash, USB, CAN, 17 timers, 3 ADCs, 13 communication interfaces Preliminary data Features FBGA • Core: ARM 32-bit Cortex -M3 CPU with MPU – 72 MHz maximum frequency,
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STM32F103xF
STM32F103xG
32-bit
arm stm32 f103
stm32f103z
STM32F103VG
STM32F103VF
STM32F103ZG
stm32f103xg
stm32 f103 100 pin
STM32F103Rx
LQFP100
LQFP144
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Untitled
Abstract: No abstract text available
Text: TOSHIBA MICROWAVE POWER GaAs FET TIM1112-4 Internally Matched Power GaAs FETs X, Ku-Band Features • High power - P1dB = 36.5 dBm at 11.7 GHz to 12.7 GHz • High gain - G-|dB = 7.5 dB at 11.7 GHz to 12.7 GHz • Broadband internally matched • Hermetically sealed package
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TIM1112-4
MW50190196
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30yA
Abstract: TIM1112-2
Text: TOSHIBA MICROWAVE POWER GaAs FET M/CROtVAVE SEMICONDUCTOR TIM1112-2 TECHNICAL DATA FEATURES: • HIGH POWER PìdB = 33.5 dBm at 11.7 GHz to 12.7 GHz ■ HIGH GAIN GidB = 7.5 dB at 11.7 GHz to 12.7 GHz ■ BROAD BAND INTERNALLY MATCHED HERMETICALLY SEALED PACKAGE
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TIM1112-2
30yA
TIM1112-2
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Untitled
Abstract: No abstract text available
Text: TOSHIBA MICROW AVE POWER GaAs FET TIM1112-8 internally Matched Power G aAs FETs X, Ku-Band Features * High power - P1dB = 39.5 dBm at 11.7 GHz to 12.7 GHz * High gain G1dB = 5.0 dB at 11.7 GHz to 12.7 GHz • Broadband internally matched • Hermetically sealed package
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TIM1112-8
2-11C1B)
MW50200196
MW5O2O0196
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PDF
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Untitled
Abstract: No abstract text available
Text: TOSHIBA MICROWAVE POWER GaAs FET TIM1112-2 Internally Matched Power GaAs FETs X, Ku-Band Features • High power - P1dB = 33.5 dBm at 11.7 GHz to 12.7 GHz • High gain - G-|dB = 7.5 dB at 11.7 GHz to 12.7 GHz • Broadband internally matched • Hermetically sealed package
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OCR Scan
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TIM1112-2
MW50180196
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PDF
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Untitled
Abstract: No abstract text available
Text: TOSHIBA MICROW AVE POWER GaAs FET MICROWAVE SEMICONDUCTOR TIM1112-8 TECHNICAL DATA FEATURES: • HIGH POWER PidB = 39.5 dBm at 11.7 GHz to 12.7 GHz ■ BROAD BAND INTERNALLY MATCHED ■ HIGH GAIN GidB = 5.0 dB at 11.7 GHz to 12.7 GHz ■ HERMETICALLY SEALED PACKAGE
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TIM1112-8
2-11C1B)
TIM1112-8--------------POWER
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TIM1112-4
Abstract: No abstract text available
Text: TOSHIBA MICROWAVE MICROWAVE POWER GaAs F ET S E M IC O N D U C T O R TIM1112-4 TECHNICAL DATA FEATURES: • HIGH POWER PidB = 36.5 dBm at 11.7 GHz to 12.7 GHz ■ HIGH GAIN GidB = 7.5 dB at 11.7 GHz to 12.7 GHz BROAD BAND INTERNALLY MATCHED ■ HERMETICALLY SEALED PACKAGE
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TIM1112-4
TIM1112-4
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Untitled
Abstract: No abstract text available
Text: TOSHIBA MICROWAVE POWER GaAs FET TIM1112-8 Internally Matched Power GaAs FETs X, Ku-Band Features • High power - P1dB = 39.5 dBm at 11.7 GHz to 12.7 GHz • High gain - G-|dB = 5.0 dB at 11.7 GHz to 12.7 GHz • Broadband internally matched • Hermetically sealed package
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OCR Scan
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TIM1112-8
2-11C1B)
MW50200196
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PDF
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