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    TI PACKING LABEL Search Results

    TI PACKING LABEL Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    83818-20100 Amphenol Communications Solutions Shield (Type II) 5mm. open back end, with label recess Visit Amphenol Communications Solutions
    83808-20100 Amphenol Communications Solutions Shield (Type II) closed end, with label recess Visit Amphenol Communications Solutions
    83808-21111 Amphenol Communications Solutions Shield (Type II ) 1xI/O, with shield insulator and label recess Visit Amphenol Communications Solutions
    83808-20110 Amphenol Communications Solutions Shield (Type II) closed end, with shield insulator and label recess Visit Amphenol Communications Solutions
    83808-22111 Amphenol Communications Solutions Shield (Type II ) 2xI/O, with shield insulator and label recess Visit Amphenol Communications Solutions

    TI PACKING LABEL Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    EIA and EIAJ standards 783

    Abstract: JEDEC tray standard dimension abstract for water level indicator EIA-481-x EIA standards 783 EIA 783 JEDEC Matrix Tray outlines QFP Shipping Trays EIA-783 EIA 481 TSSOP
    Text: Application Report SZZA021A – January 2000 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear and Logic ABSTRACT The Texas Instruments TI Semiconductor Group uses three packing methodologies to


    Original     		SZZA021A EIA and EIAJ standards 783 JEDEC tray standard dimension abstract for water level indicator EIA-481-x EIA standards 783 EIA 783 JEDEC Matrix Tray outlines QFP Shipping Trays EIA-783 EIA 481 TSSOP PDF

    transistor b941

    Abstract: B941 transistor 39 77 marking zener diode, sot323 or sot89 B941 marking codes IC sot-223 marking sot223 GY CEN526 marking code maxim label transistor gy sot-23 transistor gy sot-223
    Text: E n g in e e r in g S p e c if ic a t io n s Page Axial Lead Tape and Reel 228 TO-92 Tape and Reel 230 TO-92 Ammopack 233 DO-35 Radial Tape and Reel 236 DO-41 SP Radial Tape and Reel 239 Standard Packing Quantity 241 Package Labeling 243 Bar Code Labeling


    OCR Scan     		DO-35 DO-41 EIA-296-E. OD-80 OD-323 OT-23 OT-89 OT-143 OT-223 OT-323 transistor b941 B941 transistor 39 77 marking zener diode, sot323 or sot89 B941 marking codes IC sot-223 marking sot223 GY CEN526 marking code maxim label transistor gy sot-23 transistor gy sot-223 PDF

    ATMEL 740

    Abstract: atmel 830 ATMEL Tape and Reel drawing LQFP-44 ATMEL shipping label atmel 0635 ATMEL Tape and Reel QFN-64 QFN-64 atmel 1030 pj 54 diode
    Text: Packaging and Packing Information Packaging according to IEC 60286-3 for Tape and Reel, and IEC 60286-4 for tube packing. 1. Labels In general, on products coming out of Atmel ’s Heilbronn Germany location, two labels are on the inner cardboard: Atmel's standard bar code label and a customer


    Original     		JESD97. 4845C ATMEL 740 atmel 830 ATMEL Tape and Reel drawing LQFP-44 ATMEL shipping label atmel 0635 ATMEL Tape and Reel QFN-64 QFN-64 atmel 1030 pj 54 diode PDF

    Untitled

    Abstract: No abstract text available
    Text: Philips Semiconductors General Handling MOS devices ELECTROSTATIC CHARGES contents are sensitive to electrostatic discharge is shown by warning labels on both primary and secondary packing. Electrostatic charges can exist in many things; for example, man-made-fibre clothing, moving machinery, objects with air blowing


    OCR Scan     		PDF

    tk 19 209

    Abstract: atmel 0635 IC MC 14017 B
    Text: jflmëE W IR E L E S S * i/C Packaging and Packing Information Atmel Wireless & Microcontrollers Standard Bar-Code Labels The Atmel Wireless & Microcontrollers standard bar-code labels are printed at final packing areas. The labels are on each packing unit and contain Atmel Wireless & Microcontrollers’ specific data.


    OCR Scan     		U6043 2800PCS19 V20010129528448OB-2L1IC 284480B-2L tk 19 209 atmel 0635 IC MC 14017 B PDF

    JEDEC Matrix Tray outlines

    Abstract: ti packing label dck3 QFP Shipping Trays tray bga 64 EIA-468 label location EIA standards 783 EIA-481-x dbv4 EIA-783
    Text: Application Report SZZA021C − September 2005 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare


    Original     		SZZA021C JEDEC Matrix Tray outlines ti packing label dck3 QFP Shipping Trays tray bga 64 EIA-468 label location EIA standards 783 EIA-481-x dbv4 EIA-783 PDF

    EIA and EIAJ standards 783

    Abstract: EIA standards 783 EIA 783 eia783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B tray matrix bga ti packing label
    Text: Application Report SZZA021B – September 2001 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare


    Original     		SZZA021B EIA and EIAJ standards 783 EIA standards 783 EIA 783 eia783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B tray matrix bga ti packing label PDF

    TI Wafermap format

    Abstract: barcode reader circuit laser barcode reader circuit
    Text: Tag-it HF-I Standard Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY October 2007 SCBU047 11-09-21-064 Tag-it HF-I Standard Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY Literature Number: SCBU047 (11-09-21-064) October 2007


    Original     		SCBU047 TI Wafermap format barcode reader circuit laser barcode reader circuit PDF

    TI Wafermap format

    Abstract: laser barcode reader circuit tiris antenna TI Assembly Factory Code wafer map ISO15693 tiris rfid 15693 FSK RF-HDT-SJLE 0013e0
    Text: Tag-it HF-I Standard Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY October 2007 SCBU047 11-09-21-064 Tag-it HF-I Standard Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY Literature Number: SCBU047 (11-09-21-064) October 2007


    Original     		SCBU047 TI Wafermap format laser barcode reader circuit tiris antenna TI Assembly Factory Code wafer map ISO15693 tiris rfid 15693 FSK RF-HDT-SJLE 0013e0 PDF

    laser barcode reader circuit

    Abstract: TI Wafermap format ti packing label tiris rfid 13.56 TI Assembly Factory Code ISO15693 TIRIS RFID systems map disco code marking ti map IC Lot Code Identification
    Text: Tag-it HF-I Pro Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY October 2007 SCBU045 11-09-21-065 Tag-it HF-I Pro Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY Literature Number: SCBU045 (11-09-21-065) October 2007 Contents


    Original     		SCBU045 laser barcode reader circuit TI Wafermap format ti packing label tiris rfid 13.56 TI Assembly Factory Code ISO15693 TIRIS RFID systems map disco code marking ti map IC Lot Code Identification PDF

    TI Wafermap format

    Abstract: No abstract text available
    Text: Tag-it HF-I Pro Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY October 2007 SCBU045 11-09-21-065 Tag-it HF-I Pro Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY Literature Number: SCBU045 (11-09-21-065) October 2007 Contents


    Original     		SCBU045 TI Wafermap format PDF

    TI Wafermap format

    Abstract: laser barcode reader circuit ISO15693 1 out of 4 inventory request texas instruments packing label TI Assembly Factory Code ISO15693 RF-HDT-SJLC automotive transponder silica Tiris barcode reader circuit
    Text: Tag-it HF-I Plus Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY October 2007 SCBU046 11-09-21-063 Tag-it HF-I Plus Transponder IC Reference Guide A TEXAS INSTRUMENTS TECHNOLOGY Literature Number: SCBU046 (11-09-21-063) October 2007 Contents


    Original     		SCBU046 TI Wafermap format laser barcode reader circuit ISO15693 1 out of 4 inventory request texas instruments packing label TI Assembly Factory Code ISO15693 RF-HDT-SJLC automotive transponder silica Tiris barcode reader circuit PDF

    Ion Chromatography

    Abstract: No abstract text available
    Text: Application Report SZZA042 - November 2003 Use of Polystyrene for Bare-Die Carrier-Tape Shipping Applications Michael Hayden, Lee Lewis, and Lance Wright Standard Linear & Logic ABSTRACT The packing and shipping of bare-die product is relatively new, especially in the tape-and-reel


    Original     		SZZA042 Ion Chromatography PDF

    Untitled

    Abstract: No abstract text available
    Text: Tag-it HF-I Pro Transponder Inlays Reference Guide Literature Number: SCBU009B December 2005 – Revised September 2011 2 SCBU009B – December 2005 – Revised September 2011 Submit Documentation Feedback Copyright 2005–2011, Texas Instruments Incorporated


    Original     		SCBU009B PDF

    56mm carrier tape

    Abstract: 28 pin ic TM 1628
    Text: u Chapter 13 Packing Methods and Labels CHAPTER 13 PACKING METHODS AND LABELS Introduction Quality Pack Program Packing for Tubes Packing for Trays Packing for Tape and Reels Packing for Jewel Boxes Box Labeling Packages and Packing Publication Revision A 3/1/03


    Original     		3027b 56mm carrier tape 28 pin ic TM 1628 PDF

    MARKING AHW

    Abstract: PEAK tray drawing ScansU9X28
    Text: SHARP LHP V 5 6 2 S 1 Contents 1. General .*. 2 2. Features . . 2 3. Pin Configuration and Pin Description -. 3 .


    OCR Scan     		LHPV562S 0017m LH5PV16256Sâ TSOP44-P-400 AA1117 172DD CV704 DG172D1 MARKING AHW PEAK tray drawing ScansU9X28 PDF

    Date Code wolfson

    Abstract: WM8725ED MH1082 WOLFSON date code Date Code format wolfson EH11 MH10 WOLFSON MICROELECTRONICS WM8199SCDS ti packing label
    Text: w WTN_0226 Inner Product and Outer Shipping Label Specifications INTRODUCTION This document specifies the dimensions, content, layout and placement of Wolfson Microelectronics labels used for inner packaging and outer shipping containers. These are target specifications –


    Original     		PDF

    "0.4mm" bga "ball collapse" height

    Abstract: Modified Coffin-Manson Equation Calculations 65X65 nFBGA SN 29733 TEXAS INSTRUMENTS, Mold Compound, CSP 12x12 bga thermal resistance 385Z SPRAA99 72ZST
    Text: Application Report SPRAA99 – March 2008 nFBGA Packaging Robert Furtaw . ABSTRACT This application report gives you technical background on nFBGA packages and


    Original     		SPRAA99 "0.4mm" bga "ball collapse" height Modified Coffin-Manson Equation Calculations 65X65 nFBGA SN 29733 TEXAS INSTRUMENTS, Mold Compound, CSP 12x12 bga thermal resistance 385Z SPRAA99 72ZST PDF

    Untitled

    Abstract: No abstract text available
    Text: LH53C32600N 32M Mask ROM Model No.: LHMC56xx Spec No.: EL097186 Issue Date: August 5, 1997 SHARP LH53C32600N # Handle this docuaent carefully for it contains aaterial protected by international copyright law. Any reproduction, full or in part, of this laterial is prohibited


    OCR Scan     		LH53C32600N LHMC56xx EL097186 S0P44-P-600 AA10S0 CV648 PDF

    Feeder 12/16 mm

    Abstract: electronic assembly tape hitachi feeder
    Text: 12-mm Tape-and-Reel Component-Delivery System SLZA001 August 1998 1 IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest


    Original     		12-mm SLZA001 Feeder 12/16 mm electronic assembly tape hitachi feeder PDF

    TI lead finish

    Abstract: No abstract text available
    Text: SHARP 1 SPEC No. ISSUE: EL 0 8 I 0 7 2 A Slav. 24. 1996 T o ; S P EC I F I C A T I O N S Product 2 5 6k Type SRAM LH 5 2 2 5 6 C N - 8 5 L L Model No. { LH 5 2 5 C 8 N »This s p e c i f i c a t i o n s c on tains 1 6 pages including the cover and appendix.


    OCR Scan     		LH525C8N 52256C OP28-P-45Û AA93L CV607 TI lead finish PDF

    Date Code wolfson

    Abstract: MH1082 EH11 MH10 ti packing label INNER CARTON LABEL inner product
    Text: w WTN_0226 Inner Product and Outer Shipping Label Specifications INTRODUCTION This document specifies the dimensions, content, layout and placement of Wolfson Microelectronics labels used for inner packaging and outer shipping containers. These are target specifications – differences may occur due to manufacturing route variations.


    Original     		PDF

    TM056KDH01

    Abstract: TM056KDH TS056KAAAD01-01 nf lcd tv CIE1931 IEC60068-2-1 IEC60068-2-2 tianma lcd 20 pin
    Text: MA AN TI NF ID EN CO TI AL SHANGHAI TIANMA MICRO-ELECTRONICS TM056KDH01 V2.2 Table of Contents Coversheet. 1 Table of Contents . 2


    Original     		TM056KDH01 TM056KDH TS056KAAAD01-01 nf lcd tv CIE1931 IEC60068-2-1 IEC60068-2-2 tianma lcd 20 pin PDF

    Marking ZB

    Abstract: No abstract text available
    Text: Module no:3011041 LabelId:3011041 Operator:Phoenix 18:56:18, Donnerstag, 28. Juni 2001 DLK 2,5-PE Terminal width 6.2 rigid IEC [mm ] solid DIN VDE 0611 0.2-4 2 flexible stranded AWG 0.2-2.5 24-12 I U [A] [V] 26 400 H CAg Description color Type Order No.


    Original     		10-position, 10-section, Marking ZB PDF