Pin connection of bk 1085
Abstract: RICHTEK dk BK 1085 ti package designator SOT35 WBG SOT-23
Text: Analog and Logic Packaging The comprehensive guide to package solutions www.ti.com/analogpackaging 2011 Analog & Logic Packaging Solutions Data Analog & Logic Packaging Solutions Data Pin count Package type TI package designator Body length mm Min Max Body width (mm)
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PFM/TO--263/DDPAK
OT/SC-70
OT/SOT-23
OT/SOT-89
O-220
OT/SOT-223
OT-143
PFM/TO-263/DDPAK
Pin connection of bk 1085
RICHTEK dk
BK 1085
ti package designator
SOT35
WBG SOT-23
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LT1460BCS3-10
Abstract: marking code LTGG LTGF marking code sot 23 MARK LTGG LTKD MARKING CODE ltbw LM 3937 LT1460BCS3-2 LT1521CS8-3 LTHS
Text: PACKAGE PACKAGE CROSSDIMENSIONS REFERENCE LCC METAL CAN CERDIP Ceramic Dual-In-Line METAL CANS SSOP Shrink Small Outline TSSOP Thin Shrink Small Outline SIDE BRAZED PACKAGE OUTLINE DESCRIPTION LTC NSC MOT TI LINFIN MAXIM 8-Lead Side Brazed Hermetic D8 D
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20-Lead
20-Lead
28-Lead
LT1613CS5
LT1615CS5
LT1615CS5-1
LT1617CS5
LT1617CS5-1
LT1761ES5-1
LT1761ES5-2
LT1460BCS3-10
marking code LTGG
LTGF marking code sot 23
MARK LTGG
LTKD MARKING CODE
ltbw
LM 3937
LT1460BCS3-2
LT1521CS8-3
LTHS
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SZZA003
Abstract: thermal resistance of low power semiconductor
Text: Package Thermal Characterization Methodologies Application Report 1999 Printed in U.S.A 0399 SZZA003 Package Thermal Characterization Methodologies SZZA003 March 1999 1 IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products
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SZZA003
MIL-STD-883
SCAA022A
SZZA003
thermal resistance of low power semiconductor
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56QN50T18080
Abstract: Senju MO-220-compliant Theta JA of 64-pin BGA 56RGQ senju solder paste MO-220 SN74SSTV16859 IPC-9701 qfn jc jb
Text: Application Report SCEA032 - March 2003 56-Pin Quad Flatpack No-Lead Logic Package Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-Lead (QFN) 56-terminal package complies with JEDEC standard MO-220, allows for board miniaturization, and holds several advantages
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SCEA032
56-Pin
56-terminal
MO-220,
56QN50T18080
Senju
MO-220-compliant
Theta JA of 64-pin BGA
56RGQ
senju solder paste
MO-220
SN74SSTV16859
IPC-9701
qfn jc jb
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jesd 51-7
Abstract: 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000
Text: Application Report SZZA040 - December 2003 54BGA Package Frank Mortan SLL Package Development ABSTRACT The TI 54-ball low-profile, fine-pitch, ball grid array TFBGA meets dimensions specified in JEDEC MO-205, Variation DD. This 0.8-mm-pitch BGA allows economical OEM designs
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SZZA040
54BGA
54-ball
MO-205,
16-bit
jesd 51-7
63 ball Vfbga thermal resistance
56DL
metcal apr 5000
MO-205
56ZQL
BGA Ball Crack
054UG08C127
APR-5000
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117450
Abstract: TO253 lt941 ltc947 1624i LT 129i5 sm 2178a LT1510CGN sot23 1303 ltbw 83
Text: PACKAGE PACKAGE CROSSDIMENSIONS REFERENCE SIDE BRAZED PACKAGE OUTLINE DESCRIPTION LTC NSC MOT TI LINFIN MAXIM 8-Lead Side Brazed Hermetic D8 D D ADI/PMI — l — — DA 14-, 16-, 18- and 20-Lead Side Brazed (Hermetic) D D D YB QB XB L — — DD, DE, DN, DP
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20-Lead
20-Lead
O-220
117450
TO253
lt941
ltc947
1624i
LT 129i5
sm 2178a
LT1510CGN
sot23 1303
ltbw 83
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MS 34100
Abstract: bq24004 bq24005 bq24006
Text: bq24004/5/6 DualĆCell LiĆIon Charger With Integrated FET in TSSOPĆ20 Package EVM User’s Guide June 2002 Advanced Analog Products SLUU110A IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications,
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bq24004/5/6
TSSOP20
SLUU110A
SLUP051
MS 34100
bq24004
bq24005
bq24006
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Untitled
Abstract: No abstract text available
Text: AV DI TH AIL ST RO AB RI U LE BU GH TI ON 3361 1/4 ˝ Square SMD Trimming Potentiometer Features • Compatible with surface mount Sealed ■ Miniature package ■ Rotor designed for automatic machine adjust interface ■ Withstands harsh environments and
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greater30
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Untitled
Abstract: No abstract text available
Text: AV DI TH AIL ST RO AB RI U LE BU GH TI ON Features • ■ ■ 33 62 3 ■ Single-Turn / Cermet / Industrial / Sealed Miniature package Rotor designed for automatic machine adjust interface Withstands harsh environments and immersion cleaning processes ■
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3362U-1
3362P-1
1000/REEL/BOX
750/REEL
1000/BOX
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3362P
Abstract: 3362H 3362M 3362R 3362S 3362X H-90
Text: AV DI TH AIL ST RO AB RI U LE BU GH TI ON Features • ■ ■ ■ 33 62 3 Single-Turn / Cermet / Industrial / Sealed Miniature package Rotor designed for automatic machine adjust interface Withstands harsh environments and immersion cleaning processes ■
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3362P-1
750/REEL
1000/BOX
3362P
3362H
3362M
3362R
3362S
3362X
H-90
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SPRU811
Abstract: BGA reflow guide ionograph ionograph spec SZZA021B bga dye pry EndoScope schematic endoscope case to board cte table flip chip substrate
Text: Flip Chip Ball Grid Array Package Reference Guide Literature Number: SPRU811A May 2005 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue
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SPRU811A
SPRU811
SPRU811
BGA reflow guide
ionograph
ionograph spec
SZZA021B
bga dye pry
EndoScope
schematic endoscope
case to board
cte table flip chip substrate
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OPA341
Abstract: 04022F104Z7B20D 0402YD333KAT2A CDC7005 DB-25P-PCB J27-15
Text: CDC7005 BGA Package Evaluation Module Manual High Performance Analog/CDC User’s Guide 2005 Clock Drivers SCAU005D IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue
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CDC7005
SCAU005D
OPA341
04022F104Z7B20D
0402YD333KAT2A
CDC7005
DB-25P-PCB
J27-15
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Untitled
Abstract: No abstract text available
Text: User's Guide SLUUA44A – December 2012 – Revised August 2013 bq51013xEVM-764 Evaluation Module WCSP Package The bq51013xEVM (HPA764-001 and HPA764-003) wireless power receiver evaluation kit from TI is a high-performance, easy-to-use development kit for the design of wireless power solutions. It helps
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SLUUA44A
bq51013xEVM-764
bq51013xEVM
HPA764-001
HPA764-003)
bq51013A
bq51013B
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Untitled
Abstract: No abstract text available
Text: CDCM7005 BGA Package Evaluation Module Manual HPA/High Speed Communications User’s Guide 2005 Clock Drivers SCAU013A IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue
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CDCM7005
SCAU013A
10KR69
SN74LV125
C72100n
CDCM7005EVM
CDCM7005
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Untitled
Abstract: No abstract text available
Text: CDCM7005 QFN Package Evaluation Module Manual HPA/High Speed Communications User’s Guide 2005 Clock Drivers SCAU015A IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue
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CDCM7005
SCAU015A
10KR69
SN74LV125U3
C72100n
CDCM7005EVM
CDCM7005
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Untitled
Abstract: No abstract text available
Text: CDC7005 BGA Package Evaluation Module Manual High Performance Analog/CDC User’s Guide 2006 Clock Drivers SCAU005E IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue
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CDC7005
SCAU005E
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SLMA002
Abstract: land pattern for tSOP56 double sided pcb, thermal via "x-ray machine" TQFP64 land package cut template DRAWING tsop20 TQFP100 TQFP64 TSOP24
Text: PowerPAD Thermally Enhanced Package TECHNICAL BRIEF: SLMA002 Mixed Signal Products Semiconductor Group 21 November 1997 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information
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SLMA002
SLMA002
land pattern for tSOP56
double sided pcb, thermal via
"x-ray machine"
TQFP64 land package
cut template DRAWING
tsop20
TQFP100
TQFP64
TSOP24
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Solder bar of Senju M705
Abstract: senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100
Text: Application Report SCBA017D – February 2004 Quad Flatpack No-Lead Logic Packages Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold
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SCBA017D
14/16/20-terminal
MO-241,
Solder bar of Senju M705
senju M31 GRN360
Senju
senju m31
JESD
Senju 7100 reflow profile
16QN50T23030
JESD 51-7, ambient measurement
qfn 32 land pattern
Senju paste 7100
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bq27000
Abstract: bq27010 bq27200 bq27210 bq27500 bq27510
Text: HARDWARE COMMUNICATION FIRMWARE GAUGING ALGORITHM Application package designator package size device pin BAT pin Voltage Divider Register backup Thermistor GPIO count internal LDO interface bq27000 SON-DRK 4x3mm 10 No through RBI pin internal 1 None required
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bq27000
bq27200
bq27010
bq27210
bq27500
bq27510
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ADS5500
Abstract: OPA695 OPA847 THS3201 THS3202 THS4503 THS9001 TQFP-64 ADS5500 HTQFP-64
Text: ADS5500 SBAS303C − DECEMBER 2003 − REVISED MARCH 2004 14ĆBit, 125MSPS AnalogĆtoĆDigital Converter ADS5500 www.ti.com SBAS303C − DECEMBER 2003 − REVISED MARCH 2004 PACKAGE/ORDERING INFORMATION 1 PRODUCT PACKAGE−LEAD PACKAGE DESIGNATOR SPECIFIED
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ADS5500
SBAS303C
14Bit,
125MSPS
14-Bit
125MSPS
100MHz
82dBc
578mW
ADS5500
OPA695
OPA847
THS3201
THS3202
THS4503
THS9001
TQFP-64
ADS5500 HTQFP-64
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Untitled
Abstract: No abstract text available
Text: R EG 103 REG REG103 103 REG 103 SBVS010D – JANUARY 2000 – REVISED SEPTEMBER 2005 DMOS 500mA Low-Dropout Regulator FEATURES DESCRIPTION ● NEW DMOS TOPOLOGY: Ultra Low Dropout Voltage: 115mV Typ at 500mA and 3.3V Output Output Capacitor NOT Required for Stability
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REG103
SBVS010D
500mA
115mV
OT223-5,
REG103
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TPS658629I
Abstract: No abstract text available
Text: TPS658629-Q1 SLVSAT6 – JUNE 2011 www.ti.com Advanced Power Management Unit Check for Samples: TPS658629-Q1 1 INTRODUCTION 1.1 MAIN FEATURES 1 • Qualified for Automotive Applications • INTEGRATED POWER SUPPLIES – 3 Programmable Step-Down Converters
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TPS658629-Q1
TPS658629I
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TSC20141
Abstract: TSC2014I touch screen bus I2C
Text: TSC2014 www.ti.com SBAS522 – SEPTEMBER 2010 1.2V to 3.6V, 12-Bit, Nanopower, 4-Wire TOUCH SCREEN CONTROLLER with I2C Interface Check for Samples: TSC2014 FEATURES APPLICATIONS • • • • • • • • • • • 1 23 • • • • • • 4-Wire Touch Screen Interface
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TSC2014
SBAS522
12-Bit,
10-Bit
12-Bit
430mW
50SSPS
320mW
TSC20141
TSC2014I
touch screen bus I2C
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Untitled
Abstract: No abstract text available
Text: ACTS541MS Semiconductor Radiation Hardened Octal Three-State Buffer/Line Driver January 1996 Features Pinouts • Devices QM L Qualified in Accordance with MIL-PRF-38535 20 LEAD CERAMIC DUAL-IN-LINE MIL-STD-1835 DESIGNATOR, CDIP2-T20, LEAD FINISH C TOP VIEW
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OCR Scan
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ACTS541MS
MIL-STD-1835
CDIP2-T20,
MIL-PRF-38535
600mm
ACTS541
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