Untitled
Abstract: No abstract text available
Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC FPT-100P-M18 100-pin plastic TQFP Lead pitch 0.40 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold Length of flat portion of pins
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FPT-100P-M18
100-pin
FPT-100P-M18)
F100029S-1C-1
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TQFP120
Abstract: THIN QUAD FLAT L-LEADED PACKAGE PLASTIC
Text: THIN QUAD FLAT L-LEADED PACKAGE 120 PIN PLASTIC FPT-120P-M17 EIAJ code : ∗TQFP120-P-1414-1 120-pin plastic TQFP Lead pitch 0.40 mm Package width x package length 14 × 14 mm Lead shape Gullwing Sealing method Plastic mold Length of flat portion of pins
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FPT-120P-M17
TQFP120-P-1414-1
120-pin
FPT-120P-M17)
F120022S-1C-3
TQFP120
THIN QUAD FLAT L-LEADED PACKAGE PLASTIC
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TQFP064-P-1010-1
Abstract: No abstract text available
Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN PLASTIC To Top / Package Lineup / Package Index FPT-64P-M04 EIAJ code :∗TQFP064-P-1010-1 64-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 10 × 10 mm Lead shape
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FPT-64P-M04
TQFP064-P-1010-1
64-pin
FPT-64P-M04)
F64011S-2C-3
TQFP064-P-1010-1
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TQFP 80 PACKAGE
Abstract: No abstract text available
Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 80 PIN PLASTIC To Top / Package Lineup / Package Index FPT-80P-M15 80-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold
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FPT-80P-M15
80-pin
FPT-80P-M15)
F80028S-1C-1
TQFP 80 PACKAGE
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Untitled
Abstract: No abstract text available
Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC To Top / Package Lineup / Package Index FPT-100P-M09 EIAJ code : TQFP100-P-1414-1 100-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 14 × 14 mm Lead shape
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FPT-100P-M09
TQFP100-P-1414-1
100-pin
FPT-100P-M09)
F100011S-1C-2
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TQFP120
Abstract: No abstract text available
Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M17 EIAJ code :∗TQFP120-P-1414-1 120-pin plastic TQFP Lead pitch 0.40 mm Package width x package length 14 × 14 mm Lead shape
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FPT-120P-M17
TQFP120-P-1414-1
120-pin
FPT-120P-M17)
F120022S-1C-3
TQFP120
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Untitled
Abstract: No abstract text available
Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC To Top / Package Lineup / Package Index FPT-100P-M18 100-pin plastic TQFP Lead pitch 0.40 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold
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FPT-100P-M18
100-pin
FPT-100P-M18)
F100029S-1C-1
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Untitled
Abstract: No abstract text available
Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC To Top / Package Lineup / Package Index FPT-100P-M19 100-pin plastic TQFP Lead pitch 0.65 mm Package width x package length 14 × 20 mm Lead shape Gullwing Sealing method Plastic mold
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FPT-100P-M19
100-pin
FPT-100P-M19)
F100030S-2C-1
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9811
Abstract: No abstract text available
Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 144 PIN PLASTIC FPT-144P-M10 EIAJ code :∗P-TQFP-0144-2020-0.50 144-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 20.0 × 20.0 mm Lead shape Gullwing Sealing method Plastic mold
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FPT-144P-M10
P-TQFP-0144-2020-0
144-pin
FPT-144P-M10)
F144022S-1C-1
9811
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Untitled
Abstract: No abstract text available
Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC FPT-120P-M17 EIAJ code :∗TQFP120-P-1414-1 120-pin plastic TQFP Lead pitch 0.40 mm Package width x package length 14 × 14 mm Lead shape Gullwing Sealing method Plastic mold
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FPT-120P-M17
TQFP120-P-1414-1
120-pin
FPT-120P-M17)
F120022S-1C-3
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176 TQFP pins
Abstract: TQFP 132 PACKAGE 176pin
Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 176 PIN PLASTIC FPT-176P-M06 EIAJ code :∗P-TQFP-0176-2020-0.40 176-pin plastic TQFP Lead pitch 0.40 mm Package width x package length 20.0 × 20.0 mm Lead shape Gullwing Sealing method Plastic mold
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FPT-176P-M06
P-TQFP-0176-2020-0
176-pin
FPT-176P-M06)
F176012S-1C-1
176 TQFP pins
TQFP 132 PACKAGE
176pin
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TQFP100
Abstract: No abstract text available
Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC FPT-100P-M09 EIAJ code : TQFP100-P-1414-1 100-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 14 × 14 mm Lead shape Gullwing Sealing method Plastic mold FPT-100P-M09
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FPT-100P-M09
TQFP100-P-1414-1
100-pin
FPT-100P-M09)
F100011S-1C-2
TQFP100
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Untitled
Abstract: No abstract text available
Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 80 PIN PLASTIC FPT-80P-M15 80-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.20 mm MAX FPT-80P-M15
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FPT-80P-M15
80-pin
FPT-80P-M15)
F80028S-1C-1
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FPT-64P-M04
Abstract: No abstract text available
Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN PLASTIC FPT-64P-M04 EIAJ code :∗TQFP064-P-1010-1 64-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 10 × 10 mm Lead shape Gullwing Sealing method Plastic mold FPT-64P-M04
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FPT-64P-M04
TQFP064-P-1010-1
64-pin
FPT-64P-M04)
F64011S-2C-3
FPT-64P-M04
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tQFP pitch
Abstract: TQFP100
Text: THIN QUAD FLAT L-LEADED PACKAGE 100 PIN PLASTIC FPT-100P-M09 EIAJ code : TQFP100-P-1414-1 100-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 14x14 mm Lead shape Gullwing Sealing method Plastic mold FPT-100P-M09 100-pin plastic TQFP (FPT-100P-M09)
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FPT-100P-M09
TQFP100-P-1414-1
100-pin
FPT-100P-M09)
F100011S-1C-2
tQFP pitch
TQFP100
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Untitled
Abstract: No abstract text available
Text: THIN QUAD FLAT L-LEADED PACKAGE 64 PIN PLASTIC FPT-64P-M04 EIAJ code : ∗TQFP064-P-1010-1 64-pin plastic TQFP Lead pitch 0.50mm Package width x package length 10 × 10mm Lead shape Gullwing Sealing method Plastic mold FPT-64P-M04 64-pin plastic TQFP (FPT-64P-M04)
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FPT-64P-M04
TQFP064-P-1010-1
64-pin
FPT-64P-M04)
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CY7C024-55AC DATASHEET
Abstract: A12L CY7C024 CY7C0241 CY7C025 CY7C0251
Text: CY7C024/0241 CY7C025/0251 4K x 16/18 and 8K x 16/18 Dual-Port Static RAM with SEM, INT, BUSY Features Functional Description • True Dual-Ported memory cells which allow simultaneous reads of the same memory location • 4K x 16 organization CY7C024 • 4K x 18 organization (CY7C0241)
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CY7C024/0241
CY7C025/0251
CY7C024)
CY7C0241)
CY7C025)
CY7C0251)
65-micron
CY7C024/0241,
CY7C024-55AC DATASHEET
A12L
CY7C024
CY7C0241
CY7C025
CY7C0251
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ZHX1000
Abstract: ZHX1010 ZHX1200 ZHX1201 ZHX1403 ZHX1810 ZHX1820 ZHX2010 ZHX3403 MKT71C1176-00
Text: Packaging Product Specification PS007208-0502 ZiLOG Worldwide Headquarters • 532 Race Street • San Jose, CA 95126-3432 Telephone: 408.558.8500 • Fax: 408.558.8300 • www.ZiLOG.com This publication is subject to replacement by a later edition. To determine whether a later edition
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PS007208-0502
ZHX1000
ZHX1010
ZHX1200
ZHX1201
ZHX1403
ZHX1810
ZHX1820
ZHX2010
ZHX3403
MKT71C1176-00
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CY7C025
Abstract: CY7C0251 A12L CY7C024 CY7C0241 cy7c02435axc
Text: CY7C024/0241 CY7C025/0251 4K x 16/18 and 8K x 16/18 Dual-Port Static RAM with SEM, INT, BUSY Features Functional Description • True Dual-Ported memory cells which allow simultaneous reads of the same memory location • 4K x 16 organization CY7C024 • 4K x 18 organization (CY7C0241)
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CY7C024/0241
CY7C025/0251
CY7C024)
CY7C0241)
CY7C025)
CY7C0251)
65-micron
CY7C024/0241,
CY7C025
CY7C0251
A12L
CY7C024
CY7C0241
cy7c02435axc
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CY7C025-15AXI
Abstract: 0241 CY7C024 CY7C0241 CY7C025 CY7C0251 CY7C024A-25JXC
Text: CY7C024/024A/0241 CY7C025/0251 4K x 16/18 and 8K x 16/18 Dual-Port Static RAM with SEM, INT, BUSY Features Functional Description • True dual-ported memory cells, which allow simultaneous reads of the same memory location ■ 4K x 16 organization CY7C024/024A[1]
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CY7C024/024A/0241
CY7C025/0251
CY7C024/024A
CY7C0241)
CY7C025)
CY7C0251)
CY7C024/024A/0241
CY7C025/0251
CY7C024/
CY7C025-15AXI
0241
CY7C024
CY7C0241
CY7C025
CY7C0251
CY7C024A-25JXC
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P80C32
Abstract: P80C52 80C51 SC80C51 P51XA-G3
Text: Philips Semiconductors Ordering Information MICROCONTROLLER PRODUCTS Example: P8 X CX X X E B P N Philips North America Package Code A = Plastic Leaded Chip Carrier PLCC B = Quad Flat Pack (QFP) FA = Hermetic Cerdip (window) KA = CerQuad (window) N = Plastic Dual In-Line
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P80C32
P80C52
12MHz
16MHz
20MHz
32kHz
16MHz,
P80C32
P80C52
80C51
SC80C51
P51XA-G3
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sqfp 14x20
Abstract: 74ALSXX P51XA-G3 OTP-e PC 74 HCT 32 P sQFP 14X14 TDA1308 equivalent SG 2368 tqfp 14x14 tray TDA1308 application notes
Text: Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308 FEATURES GENERAL DESCRIPTION • Wide temperature range The TDA1308 is an integrated class AB stereo headphone driver contained in an SO8 or a DIP8 plastic package. The device is fabricated in a 1 mm CMOS process and has
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30MHz
80C51
sqfp 14x20
74ALSXX
P51XA-G3
OTP-e
PC 74 HCT 32 P
sQFP 14X14
TDA1308 equivalent
SG 2368
tqfp 14x14 tray
TDA1308 application notes
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P80C32
Abstract: P80C52 ROMless P80C31 80C51 P-80C31 p80c32 16 p80c32 philips
Text: Philips Semiconductors Ordering Information MICROCONTROLLER PRODUCTS Example: P8 X CX X X E B P N Philips North America Package Code A = Plastic Leaded Chip Carrier PLCC B = Quad Flat Pack (QFP) FA = Hermetic Cerdip (window) KA = CerQuad (window) N = Plastic Dual In-Line
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P80C31,
P80C32
P80C87,
P80C52
12MHz
16MHz
20MHz
32kHz
12MH12
P80C32
P80C52
ROMless
P80C31
80C51
P-80C31
p80c32 16
p80c32 philips
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Untitled
Abstract: No abstract text available
Text: Philips Semiconductors Ordering Information MICROCONTROLLER PRODUCTS Example: 5 3 7 9 = = = = = P8 X C X X X E B P N Philips North America Package Code A = Plastic Leaded Chip Carrier PLCC B = Quad Flat Pack (QFP) FA = Hermetic Cerdip (window) KA = CerQuad (window)
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OCR Scan
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P80C31,
P80C32
P80C87,
P80C52
24MHz,
33MHz,
P51XA
80C51
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