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    THIN QUAD FLAT L-LEADED PACKAGE PLASTIC Search Results

    THIN QUAD FLAT L-LEADED PACKAGE PLASTIC Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    THIN QUAD FLAT L-LEADED PACKAGE PLASTIC Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC FPT-100P-M18 100-pin plastic TQFP Lead pitch 0.40 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold Length of flat portion of pins


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    PDF FPT-100P-M18 100-pin FPT-100P-M18) F100029S-1C-1

    TQFP120

    Abstract: THIN QUAD FLAT L-LEADED PACKAGE PLASTIC
    Text: THIN QUAD FLAT L-LEADED PACKAGE 120 PIN PLASTIC FPT-120P-M17 EIAJ code : ∗TQFP120-P-1414-1 120-pin plastic TQFP Lead pitch 0.40 mm Package width x package length 14 × 14 mm Lead shape Gullwing Sealing method Plastic mold Length of flat portion of pins


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    PDF FPT-120P-M17 TQFP120-P-1414-1 120-pin FPT-120P-M17) F120022S-1C-3 TQFP120 THIN QUAD FLAT L-LEADED PACKAGE PLASTIC

    TQFP064-P-1010-1

    Abstract: No abstract text available
    Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN PLASTIC To Top / Package Lineup / Package Index FPT-64P-M04 EIAJ code :∗TQFP064-P-1010-1 64-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 10 × 10 mm Lead shape


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    PDF FPT-64P-M04 TQFP064-P-1010-1 64-pin FPT-64P-M04) F64011S-2C-3 TQFP064-P-1010-1

    TQFP 80 PACKAGE

    Abstract: No abstract text available
    Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 80 PIN PLASTIC To Top / Package Lineup / Package Index FPT-80P-M15 80-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold


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    PDF FPT-80P-M15 80-pin FPT-80P-M15) F80028S-1C-1 TQFP 80 PACKAGE

    Untitled

    Abstract: No abstract text available
    Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC To Top / Package Lineup / Package Index FPT-100P-M09 EIAJ code : TQFP100-P-1414-1 100-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 14 × 14 mm Lead shape


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    PDF FPT-100P-M09 TQFP100-P-1414-1 100-pin FPT-100P-M09) F100011S-1C-2

    TQFP120

    Abstract: No abstract text available
    Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M17 EIAJ code :∗TQFP120-P-1414-1 120-pin plastic TQFP Lead pitch 0.40 mm Package width x package length 14 × 14 mm Lead shape


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    PDF FPT-120P-M17 TQFP120-P-1414-1 120-pin FPT-120P-M17) F120022S-1C-3 TQFP120

    Untitled

    Abstract: No abstract text available
    Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC To Top / Package Lineup / Package Index FPT-100P-M18 100-pin plastic TQFP Lead pitch 0.40 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold


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    PDF FPT-100P-M18 100-pin FPT-100P-M18) F100029S-1C-1

    Untitled

    Abstract: No abstract text available
    Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC To Top / Package Lineup / Package Index FPT-100P-M19 100-pin plastic TQFP Lead pitch 0.65 mm Package width x package length 14 × 20 mm Lead shape Gullwing Sealing method Plastic mold


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    PDF FPT-100P-M19 100-pin FPT-100P-M19) F100030S-2C-1

    9811

    Abstract: No abstract text available
    Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 144 PIN PLASTIC FPT-144P-M10 EIAJ code :∗P-TQFP-0144-2020-0.50 144-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 20.0 × 20.0 mm Lead shape Gullwing Sealing method Plastic mold


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    PDF FPT-144P-M10 P-TQFP-0144-2020-0 144-pin FPT-144P-M10) F144022S-1C-1 9811

    Untitled

    Abstract: No abstract text available
    Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC FPT-120P-M17 EIAJ code :∗TQFP120-P-1414-1 120-pin plastic TQFP Lead pitch 0.40 mm Package width x package length 14 × 14 mm Lead shape Gullwing Sealing method Plastic mold


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    PDF FPT-120P-M17 TQFP120-P-1414-1 120-pin FPT-120P-M17) F120022S-1C-3

    176 TQFP pins

    Abstract: TQFP 132 PACKAGE 176pin
    Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 176 PIN PLASTIC FPT-176P-M06 EIAJ code :∗P-TQFP-0176-2020-0.40 176-pin plastic TQFP Lead pitch 0.40 mm Package width x package length 20.0 × 20.0 mm Lead shape Gullwing Sealing method Plastic mold


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    PDF FPT-176P-M06 P-TQFP-0176-2020-0 176-pin FPT-176P-M06) F176012S-1C-1 176 TQFP pins TQFP 132 PACKAGE 176pin

    TQFP100

    Abstract: No abstract text available
    Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC FPT-100P-M09 EIAJ code : TQFP100-P-1414-1 100-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 14 × 14 mm Lead shape Gullwing Sealing method Plastic mold FPT-100P-M09


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    PDF FPT-100P-M09 TQFP100-P-1414-1 100-pin FPT-100P-M09) F100011S-1C-2 TQFP100

    Untitled

    Abstract: No abstract text available
    Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 80 PIN PLASTIC FPT-80P-M15 80-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.20 mm MAX FPT-80P-M15


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    PDF FPT-80P-M15 80-pin FPT-80P-M15) F80028S-1C-1

    FPT-64P-M04

    Abstract: No abstract text available
    Text: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN PLASTIC FPT-64P-M04 EIAJ code :∗TQFP064-P-1010-1 64-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 10 × 10 mm Lead shape Gullwing Sealing method Plastic mold FPT-64P-M04


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    PDF FPT-64P-M04 TQFP064-P-1010-1 64-pin FPT-64P-M04) F64011S-2C-3 FPT-64P-M04

    tQFP pitch

    Abstract: TQFP100
    Text: THIN QUAD FLAT L-LEADED PACKAGE 100 PIN PLASTIC FPT-100P-M09 EIAJ code : TQFP100-P-1414-1 100-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 14x14 mm Lead shape Gullwing Sealing method Plastic mold FPT-100P-M09 100-pin plastic TQFP (FPT-100P-M09)


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    PDF FPT-100P-M09 TQFP100-P-1414-1 100-pin FPT-100P-M09) F100011S-1C-2 tQFP pitch TQFP100

    Untitled

    Abstract: No abstract text available
    Text: THIN QUAD FLAT L-LEADED PACKAGE 64 PIN PLASTIC FPT-64P-M04 EIAJ code : ∗TQFP064-P-1010-1 64-pin plastic TQFP Lead pitch 0.50mm Package width x package length 10 × 10mm Lead shape Gullwing Sealing method Plastic mold FPT-64P-M04 64-pin plastic TQFP (FPT-64P-M04)


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    PDF FPT-64P-M04 TQFP064-P-1010-1 64-pin FPT-64P-M04)

    CY7C024-55AC DATASHEET

    Abstract: A12L CY7C024 CY7C0241 CY7C025 CY7C0251
    Text: CY7C024/0241 CY7C025/0251 4K x 16/18 and 8K x 16/18 Dual-Port Static RAM with SEM, INT, BUSY Features Functional Description • True Dual-Ported memory cells which allow simultaneous reads of the same memory location • 4K x 16 organization CY7C024 • 4K x 18 organization (CY7C0241)


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    PDF CY7C024/0241 CY7C025/0251 CY7C024) CY7C0241) CY7C025) CY7C0251) 65-micron CY7C024/0241, CY7C024-55AC DATASHEET A12L CY7C024 CY7C0241 CY7C025 CY7C0251

    ZHX1000

    Abstract: ZHX1010 ZHX1200 ZHX1201 ZHX1403 ZHX1810 ZHX1820 ZHX2010 ZHX3403 MKT71C1176-00
    Text: Packaging Product Specification PS007208-0502 ZiLOG Worldwide Headquarters • 532 Race Street • San Jose, CA 95126-3432 Telephone: 408.558.8500 • Fax: 408.558.8300 • www.ZiLOG.com This publication is subject to replacement by a later edition. To determine whether a later edition


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    PDF PS007208-0502 ZHX1000 ZHX1010 ZHX1200 ZHX1201 ZHX1403 ZHX1810 ZHX1820 ZHX2010 ZHX3403 MKT71C1176-00

    CY7C025

    Abstract: CY7C0251 A12L CY7C024 CY7C0241 cy7c02435axc
    Text: CY7C024/0241 CY7C025/0251 4K x 16/18 and 8K x 16/18 Dual-Port Static RAM with SEM, INT, BUSY Features Functional Description • True Dual-Ported memory cells which allow simultaneous reads of the same memory location • 4K x 16 organization CY7C024 • 4K x 18 organization (CY7C0241)


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    PDF CY7C024/0241 CY7C025/0251 CY7C024) CY7C0241) CY7C025) CY7C0251) 65-micron CY7C024/0241, CY7C025 CY7C0251 A12L CY7C024 CY7C0241 cy7c02435axc

    CY7C025-15AXI

    Abstract: 0241 CY7C024 CY7C0241 CY7C025 CY7C0251 CY7C024A-25JXC
    Text: CY7C024/024A/0241 CY7C025/0251 4K x 16/18 and 8K x 16/18 Dual-Port Static RAM with SEM, INT, BUSY Features Functional Description • True dual-ported memory cells, which allow simultaneous reads of the same memory location ■ 4K x 16 organization CY7C024/024A[1]


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    PDF CY7C024/024A/0241 CY7C025/0251 CY7C024/024A CY7C0241) CY7C025) CY7C0251) CY7C024/024A/0241 CY7C025/0251 CY7C024/ CY7C025-15AXI 0241 CY7C024 CY7C0241 CY7C025 CY7C0251 CY7C024A-25JXC

    P80C32

    Abstract: P80C52 80C51 SC80C51 P51XA-G3
    Text: Philips Semiconductors Ordering Information MICROCONTROLLER PRODUCTS Example: P8 X CX X X E B P N Philips North America Package Code A = Plastic Leaded Chip Carrier PLCC B = Quad Flat Pack (QFP) FA = Hermetic Cerdip (window) KA = CerQuad (window) N = Plastic Dual In-Line


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    PDF P80C32 P80C52 12MHz 16MHz 20MHz 32kHz 16MHz, P80C32 P80C52 80C51 SC80C51 P51XA-G3

    sqfp 14x20

    Abstract: 74ALSXX P51XA-G3 OTP-e PC 74 HCT 32 P sQFP 14X14 TDA1308 equivalent SG 2368 tqfp 14x14 tray TDA1308 application notes
    Text: Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308 FEATURES GENERAL DESCRIPTION • Wide temperature range The TDA1308 is an integrated class AB stereo headphone driver contained in an SO8 or a DIP8 plastic package. The device is fabricated in a 1 mm CMOS process and has


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    PDF 30MHz 80C51 sqfp 14x20 74ALSXX P51XA-G3 OTP-e PC 74 HCT 32 P sQFP 14X14 TDA1308 equivalent SG 2368 tqfp 14x14 tray TDA1308 application notes

    P80C32

    Abstract: P80C52 ROMless P80C31 80C51 P-80C31 p80c32 16 p80c32 philips
    Text: Philips Semiconductors Ordering Information MICROCONTROLLER PRODUCTS Example: P8 X CX X X E B P N Philips North America Package Code A = Plastic Leaded Chip Carrier PLCC B = Quad Flat Pack (QFP) FA = Hermetic Cerdip (window) KA = CerQuad (window) N = Plastic Dual In-Line


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    PDF P80C31, P80C32 P80C87, P80C52 12MHz 16MHz 20MHz 32kHz 12MH12 P80C32 P80C52 ROMless P80C31 80C51 P-80C31 p80c32 16 p80c32 philips

    Untitled

    Abstract: No abstract text available
    Text: Philips Semiconductors Ordering Information MICROCONTROLLER PRODUCTS Example: 5 3 7 9 = = = = = P8 X C X X X E B P N Philips North America Package Code A = Plastic Leaded Chip Carrier PLCC B = Quad Flat Pack (QFP) FA = Hermetic Cerdip (window) KA = CerQuad (window)


    OCR Scan
    PDF P80C31, P80C32 P80C87, P80C52 24MHz, 33MHz, P51XA 80C51