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    THERMAL SHOCK STANDARD Search Results

    THERMAL SHOCK STANDARD Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TCTH011AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH022AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH021AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012BE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Open-drain type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation

    THERMAL SHOCK STANDARD Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Device Under Test: 90HBW08PT, 90HBW10PT, 90B08ST, 90B05ST, 90B10ST Environmental Test: Thermal Shock, Moisture resistance, Thermal aging, Resistance to Reflow Physical Test: Mechanical Life, Mechanical shock, Vibration Resistance, Terminal Strength Flammability, Solderability, Process seal


    Original     		PDF 90HBW08PT, 90HBW10PT, 90B08ST, 90B05ST, 90B10ST SM04-17 SM04-17 MIL-STD-202,

    kyocera bismuth titanate

    Abstract: composite elastic modulus Fracture Behavior of Ceramics Used in Multilayer crc avx
    Text: TECHNICAL INFORMATION FACTORS RESPONSIBLE FOR THERMAL SHOCK BEHAVIOR OF CHIP CAPACITORS By Bharat S. Rawal, Richard Ladew and Ricardo Garcia Abstract: Thermal shock behavior of multilayer ceramic chip capacitors was evaluated for different ceramic dielectrics with varying construction and design


    Original     		PDF S-FRTSB00M0900-C kyocera bismuth titanate composite elastic modulus Fracture Behavior of Ceramics Used in Multilayer crc avx

    Fracture Behavior of Ceramics Used in Multilayer

    Abstract: crc avx Film Microelectronics
    Text: TECHNICAL INFORMATION FACTORS RESPONSIBLE FOR THERMAL SHOCK BEHAVIOR OF CHIP CAPACITORS By Bharat S. Rawal, Richard Ladew and Ricardo Garcia Abstract: Thermal shock behavior of multilayer ceramic chip capacitors was evaluated for different ceramic dielectrics with varying construction and design


    Original     		PDF S-FRTSB00M0900-C Fracture Behavior of Ceramics Used in Multilayer crc avx Film Microelectronics

    EP1730-1

    Abstract: EP1730 stycast 2651
    Text: Amphenol Micro D Interconnects Micro D Series 100 Mil-C-83513 Qualified Materials Electrical Mechanical Shell Insulator Contacts Contact Finish Hardware Standard Epoxy High Temp Epoxy Current Durability Salt Spray Thermal Shock Physical Shock Fluid Immersion


    Original     		PDF Mil-C-83513 Mil-DTL-83513 EP1730-1 EP1730 stycast 2651

    M15x

    Abstract: M34X1 M32x1
    Text: MIL-DTL-38999 Series I, II, III, IV Filter Connectors Chip-on-Flex ITT’s new light weight Cannon Chip-on-Flex filter connector technology provides a significant performance improvement in thermal shock and vibration. In the new Cannon Chip-on-Flex design, the internal thermal shock stresses have


    Original     		PDF MIL-DTL-38999 M17X1-6g0 M20X1-6g0 M25X1-6g0 M28X1-6g0 M32X1-6g0 M35X1-6g0 M38X1-6g0 M41X1-6g0 M44X1-6g0 M15x M34X1 M32x1

    Untitled

    Abstract: No abstract text available
    Text: Axiohm Series Centohm Coated Axial Lead Wirewound Resistors 1.5 / 38.1 A B C D D ENVIRONMENTAL PERFORMANCE Test Temperature Coefficient Thermal Shock Short Time Overload Dielectric Low Temperature Storage High Temperature Exposure Moisture Resistance Shock


    Original     		PDF MIL-R-26 3CJ10K

    M39015

    Abstract: JM39015 RJ50FP504 RJ26F W 103 10 RT22C2L202 RJ50FP202 MIL-PRF-39035 RJR24 RJ12FY202 RTR22DX502M
    Text: Mil-Spec Numbering System – Defined Non-Wirewound RJ Styles High-Rel Wirewound Specification MIL-PRF-22097 Style Characteristic Temperature Coefficient Max. Contact Resistance Variation Max. Thermal Shock Humidity Shock Vibration Load Life Low Temperature


    Original     		PDF MIL-PRF-22097 RJ50FP100 RJ50FP200 RJ50FP500 RJ50FP101 RJ50FP201 RJ50FP501 RJ50FP102 RJ50FP202 RJ50FP502 M39015 JM39015 RJ50FP504 RJ26F W 103 10 RT22C2L202 RJ50FP202 MIL-PRF-39035 RJR24 RJ12FY202 RTR22DX502M

    JM39015

    Abstract: MIL-R-39035 m39015/3-009 M39015 RJ26FW102 RT24C2P502 JM39015/3 jm39015/3-008 m39015/2 M39015/3-007
    Text: Mil-Spec Numbering System – Defined Non-Wirewound RJ Styles High-Rel Wirewound Specification MIL-R-22097 Style Characteristic Temperature Coefficient Max. Contact Resistance Variation Max. Thermal Shock Humidity Shock Vibration Load Life Low Temperature


    Original     		PDF MIL-R-22097 RJ50FP100 RJ50FP200 RJ50FP500 RJ50FP101 RJ50FP201 RJ50FP501 RJ50FP102 RJ50FP202 RJ50FP502 JM39015 MIL-R-39035 m39015/3-009 M39015 RJ26FW102 RT24C2P502 JM39015/3 jm39015/3-008 m39015/2 M39015/3-007

    JM39015

    Abstract: JM39015/3 RTR22DX502M 3292 bourns m39015 M39015/3-009XP M39015/3-008 RT22C2X102 RT26C2W102 RJ26FW102
    Text: Mil-Spec Numbering System – Defined Non-Wirewound RJ Styles High-Rel Wirewound Specification MIL-PRF-22097 Style Characteristic Temperature Coefficient Max. Contact Resistance Variation Max. Thermal Shock Humidity Shock Vibration Load Life Low Temperature


    Original     		PDF MIL-PRF-22097 RJ50FP100 RJ50FP200 RJ50FP500 RJ50FP101 RJ50FP201 RJ50FP501 RJ50FP102 RJ50FP202 RJ50FP502 JM39015 JM39015/3 RTR22DX502M 3292 bourns m39015 M39015/3-009XP M39015/3-008 RT22C2X102 RT26C2W102 RJ26FW102

    m39015

    Abstract: M39015/3
    Text: Mil-Spec Numbering System – Defined Non-Wirewound RJ Styles High-Rel Wirewound Specification MIL-R-22097 Style Characteristic Temperature Coefficient Max. Contact Resistance Variation Max. Thermal Shock Humidity Shock Vibration Load Life Low Temperature


    Original     		PDF MIL-R-22097 MIL-R-39015 RJ50F_ RJ50FP100 RJ50FP200 RJ50FP500 RJ50FP101 RJ50FP201 RJ50FP501 RJ50FP102 m39015 M39015/3

    Axiohm

    Abstract: MIL-R-26 OHMITE
    Text: Axiohm Series Centohm Coated Axial Lead Wirewound Resistors 1.5 / 38.1 A B C D D ENVIRONMENTAL PERFORMANCE Test Temperature Coefficient Thermal Shock Short Time Overload Dielectric Low Temperature Storage High Temperature Exposure Moisture Resistance Shock


    Original     		PDF 30ppm 100ppm 200ppm MIL-R-26 Axiohm OHMITE

    384M

    Abstract: 850C GBS308 RH20
    Text: ECM Crystal Oscillator GBS308 Series ƒ ƒ ƒ ƒ ƒ ƒ Environmental & Mechanical 50m/s2 11mS Duration Mechanical 250kHz – 125.0MHz Shock Output Enable -55 +1250C duration 10mins Thermal Universal Output 3 cycles Shock 3.3V Supply Available 10-55Hz / 0.762mm


    Original     		PDF GBS308 50m/s2 250kHz 1250C 10mins 762mm 10-55Hz GBS308 250kHz /-25ppm 384M 850C RH20

    Microtherm F11

    Abstract: U185 Microtherm F20 Microtherm F11 160 GB14536 F11A 095 UL3398 16 g700 F20B THERMAL MOTOR PROTECTOR
    Text: Thermal motor protector Temperature limiter Thermal cut-out 11 12 20 21 Applications - Motors - Transformers - Coils - Electronics, sensors Benefits - Small dimensions - Shock and vibration tested - Leadframe version - Tested for audio, video applications EN 60065


    Original     		PDF F20A12005ACFA06E UL3398 2011/JAN Microtherm F11 U185 Microtherm F20 Microtherm F11 160 GB14536 F11A 095 16 g700 F20B THERMAL MOTOR PROTECTOR

    Untitled

    Abstract: No abstract text available
    Text: EURO QUARTZ SQXO2ATHG OSCILLATOR High Temp./ High Shock Oscillator 32.768kHz to 50.0MHz Page 1 of 2 FEATURES High temperature operation <200°C Excellent stability over temperature High shock resistance CMOS Output Through-hole leaded package Reduces mechanical and thermal mounting stresses


    Original     		PDF 768kHz

    MS51957

    Abstract: MS51957-26 "Schematic Diagrams"
    Text: Inertial Sensor Products Redmond 200 Series Thermal Switches Honeywell's 200 Series snap-action thermal switches are specifically designed for applications requiring high current capacity in high vibration and shock environment. The hermetic all-welded construction of the 200 Series


    Original     		PDF ISO-9001 TS200 MS51957 MS51957-26 "Schematic Diagrams"

    CTS 750 series

    Abstract: CTS Series 750 Resistor Network CTS 750 series custom
    Text: Single-In-Line Series 750 Bussed CTS Schematic #1 – 0.250 High Schematic #2 – 0.350 High A PART NUMBER CTS DATE 3.18 0.125 Solid Ceramic Machine Insertable SIP Products CTS’ solid ceramic construction withstands thermal shock during soldering and extended thermal


    Original     		PDF 750103R4 CTS 750 series CTS Series 750 Resistor Network CTS 750 series custom

    745101103J

    Abstract: 742-08-3-103-J 742083103J 49ppm array resistor datasheet mil array resistor mil array resistor mil data sheet FC 0137 744083101J
    Text: PERFORMANCE DATA CTS Chip Resistor Arrays CTS Part Number 742083103J BL# 19817-L2 Updated 7/26/95 DLP PERCENT VALUE CHANGE TEST DESCRIPTION TEST STANDARD MIN MAX ABS AVG #Tested #Failed -Thermal Shock


    Original     		PDF 742083103J 19817-L2 MIL-R-83401E MIL-R-84401E -49ppm -32ppm 39ppm 745101103J 742-08-3-103-J 742083103J 49ppm array resistor datasheet mil array resistor mil array resistor mil data sheet FC 0137 744083101J

    CTS 750 series

    Abstract: CTS 750 series custom
    Text: Single-In-Line Series 750 Bussed CTS Schematic #1 – 0.250 High Schematic #2 – 0.350 High A PART NUMBER CTS DATE 3.18 0.125 Solid Ceramic Machine Insertable SIP Products CTS’ solid ceramic construction withstands thermal shock during soldering and extended thermal


    Original     		PDF 750103R4 CTS 750 series CTS 750 series custom

    CBN-L-RM-B-P-BK-DP

    Abstract: A440
    Text: 1 2 3 4 5 6 7 8 9 A A B B Item 1 2 3 4 1/2-28UNEF-2B 5 6 C SPECIFICATIONS Voltage range: Frequency range: Contact plating: D E F Contact resistance: Ground terminal: Impedance: 50 ohms Insul. resistance: Withstanding: Body: Insulator: Thermal shock: Physical shock:


    Original     		PDF 1/2-28UNEF-2B UL94HB UL94V-0 CBN-L-RM-B-P-BK-DP A440

    Untitled

    Abstract: No abstract text available
    Text: L37-5 Thermal Conductive Pad Features Good thermal conductivity Ultra soft and high compresibility Natural tack Easy to assemble Good insulator Shock and vibration absorber Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /


    Original     		PDF L37-5 L37-5 320-320mm D2240

    Untitled

    Abstract: No abstract text available
    Text: H48-2 Thermal Conductive Pad Features Good thermal conductivity Ultra soft and high compressibility Natural tack Easy to assemble Good insulator Shock and vibration absorber Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /


    Original     		PDF H48-2 H48-2 320-320mm D2240

    Untitled

    Abstract: No abstract text available
    Text: L37-5 Thermal Conductive Pad Features Good thermal conductivity Ultra soft and high compresibility Natural tack Easy to assemble Good insulator Shock and vibration absorber Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /


    Original     		PDF L37-5 L37-5 320-320mm D2240

    Untitled

    Abstract: No abstract text available
    Text: Single-In-Line Series 750 Bussed CTS Schematic #1 – 0.250 High Schematic #2 – 0.350 High Solid Ceramic Machine Insertable SIP Products CTS’ solid ceramic construction withstands thermal shock during soldering and extended thermal cycling. This is possible because CTS’ products are


    Original     		PDF 750103R4

    H48-2-

    Abstract: No abstract text available
    Text: H48-2 Thermal Conductive Pad Features Good thermal conductivity Ultra soft and high compressibility Natural tack Easy to assemble Good insulator Shock and vibration absorber Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /


    Original     		PDF H48-2 H48-2 320-320mm D2240 H48-2-