VICOR 20263
Abstract: ThermMate VICOR 20265 ThermMate mini 16299 ThermMate maxi 16297 ThermMate micro VI-J00 20267
Text: Thermal Management ThermMate Thermal Pads 10 pieces per package For use with Vicor modules, ThermMate thermal pads are a “dry” alternative to thermal compound and are pre-cut to the outline dimensions of the module.* 20266 Thermal Pad Part No. VI-200 (10 pieces)
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VI-200
VI-J00
VICOR 20263
ThermMate
VICOR 20265
ThermMate mini
16299
ThermMate maxi
16297
ThermMate micro
VI-J00
20267
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Athlon 64 motherboard design guide
Abstract: Thermal grease silicon thermal grease AMD Athlon 64 AMD xp datasheet amd Athlon xp mobile Athlon XP AMD ATHLON 64 X 2 soil "electrical conductivity" amd Athlon 64 processor data sheet
Text: Thermal Interface Material Comparison: Thermal Pads vs. Thermal Grease Publication # 26951 Revision: 3.00 Issue Date: April 2004 2004 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced
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QFN PACKAGE Junction to PCB thermal resistance
Abstract: en5322 double sided pcb, thermal via EN5322QI J-STD-020A double sided pcb thermal
Text: THERMAL NOTE EN5322QI DC-DC Converters September 2008 Thermal Characteristics The Enpirion EN5322QI DC-DC converter is packaged in 4x6x1.1mm, 24-pin QFN package. The QFN packages are constructed with copper lead frames that have exposed thermal pads. The recommended maximum junction temperature for
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EN5322QI
24-pin
QFN PACKAGE Junction to PCB thermal resistance
en5322
double sided pcb, thermal via
J-STD-020A
double sided pcb thermal
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Untitled
Abstract: No abstract text available
Text: Heat Transfer Pads THERMAL MANAGEMENT FOR SSR’s • Maximize Thermal Conductivity Crydom Heat Transfer Pads offer a clean, ease-to-use and grease-free alternative to conventional mica or grease while maximizing the thermal conductivity. Installation is simple, pads are die cut to
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AN569 in Motorola Power Applications
Abstract: motorola mosfet BASIC THERMAL MANAGEMENT OF POWER SEMICONDUCTORS MTP15N06V equivalent dpak DIODE ANODE COMMON motorola ir 722c motorola Power Applications Manual mtv32 DV240 AN1083
Text: Thermal Compendium Table of Contents Abstracts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Basic Semiconductor Thermal Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
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EN5336
Abstract: EN5366Q QFN "100 pin" PACKAGE thermal resistance QFN PACKAGE Junction to PCB thermal resistance EN5356 EN5365Q EN5335Q EN5365 J-STD-020A "thermal via"
Text: THERMAL NOTE EN5365Q/EN5366Q DC-DC Converters ENPIRION Thermal Characteristics The Enpirion EN5365Q and EN5366Q DC-DC converters are packaged in 12x10x1.85mm 58-pin QFN packages that have the same thermal characteristics. The QFN packages are constructed with copper lead frames that have exposed thermal
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EN5365Q/EN5366Q
EN5365Q
EN5366Q
12x10x1
58-pin
EN5336
QFN "100 pin" PACKAGE thermal resistance
QFN PACKAGE Junction to PCB thermal resistance
EN5356
EN5335Q
EN5365
J-STD-020A
"thermal via"
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SoftFlex
Abstract: No abstract text available
Text: DATASHEET SOFTFLEX GAP FILLER LIGHT FLEXIBLE THERMAL GAP FILLING PADS The Aavid SoftFlex series is our most flexible and diverse line of thermal conductive pads. The compressibility and adhesion features enable a dramatic reduction in thermal resistance when mounting. The unique flexibility of the SoftFlex base material provides
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400mm
x8122
SoftFlex
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D149
Abstract: D149 diode Interpoint HR300 TMP-002 TMP-003 TMP-004 TMP-005 7264 M
Text: FEATURES * –60° to +180°C temperature rating • Provides thermal transfer for Interpoint converters • 0.2°C in2/W 129°C mm2/W thermal resistance • 4000 Vac breakdown voltage typical TMP THERMAL PAD ACCESSORY TMP THERMAL PAD TMP-004 TMP-001 MODEL
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TMP-004
TMP-001
TMP-002
HR300
TMP-003
MK200
TMP-005
D149
D149 diode
Interpoint
HR300
TMP-002
TMP-003
TMP-004
TMP-005
7264 M
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k-952 TRANSISTOR
Abstract: transistor RJp 30
Text: Thermal Management Considerations for Super Flux LEDs Application Note 1149-4 Table of Contents Introduction Importance of Thermal Management for High-Power LED Assemblies . 2 Thermal management is critical in
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5968-1214E
5968-4415E
k-952 TRANSISTOR
transistor RJp 30
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CRYDOM ssr panel mount
Abstract: phase separator
Text: HSP Series Thermal Pads • Easy-to-use thermal interface Material designed for use with Standard Crydom single-phase and three-phase solid-state relays. • Excellent alternative to thermal grease HSP-1 For use with all single phase Panel mount SSR’s, Control modules and M50 power modules.
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15dules.
CRYDOM ssr panel mount
phase separator
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Loctite 3873
Abstract: T-PCM905C Loctite 3873 rework TPCM585 T-pcm585 datasheet of Z40-12.7B heat sink TPCM905C of Z40-12.7B heat sink Theta JC of FBGA JESD51-X
Text: Thermal Management for FPGAs Thermal Management for FPGAs AN-358-3.0 Application Note This application note provides guidance on thermal management of Altera devices and helps you determine the thermal performance for your application. The factors you must consider in evaluating heat dissipation include evaluating the
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AN-358-3
Loctite 3873
T-PCM905C
Loctite 3873 rework
TPCM585
T-pcm585
datasheet of Z40-12.7B heat sink
TPCM905C
of Z40-12.7B heat sink
Theta JC of FBGA
JESD51-X
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pt100 to92
Abstract: Pt100 i2c ntc 1k thermometer maxim pt100 interface PT100 RTD signal conditioning noise problem pt100 temperature controller based on microcontroller MAX6675 pt100 maxim 24V FAN CONTROL BY USING THERMISTOR zetex transistor to92
Text: Thermal Management Handbook TM Introduction: Thermal Management in Electronic Temperature-Sensing Technologies .4
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Pt100,
pt100 to92
Pt100 i2c
ntc 1k thermometer
maxim pt100 interface
PT100 RTD signal conditioning noise problem
pt100 temperature controller based on microcontroller
MAX6675
pt100 maxim
24V FAN CONTROL BY USING THERMISTOR
zetex transistor to92
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Untitled
Abstract: No abstract text available
Text: HSP Series Thermal Pads • Easy-to-use thermal interfaceMaterial designed for use with Standard Crydom single-phase and three-phase solid-state relays. • Excellent alternative to thermal grease • Adhesive on one side HSP-2 For use with all single phase Panel mount SSR’s, Control modules and M50 power modules.
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hot wire anemometer
Abstract: TA7802 G43-87 THE POWER OF MYTH JESD 51-7, ambient measurement FLUID level measurement kapton 5413 G30-88 G38-87 G42-88
Text: u Chapter 5 Package Characterization CHAPTER 5 PACKAGE CHARACTERIZATION Introduction Terminology Measurement Methods Thermal Characterization Parameter ψJT Thermal Test Boards Thermal Data Reports Electrical Characterization Methodology Bond Wire Series Inductance and Resistance
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Abstract: No abstract text available
Text: HSP Series Thermal Pads • Easy-to-use thermal interface Material designed for use with Standard Crydom single-phase and three-phase solid-state relays. • Excellent alternative to thermal grease • Shipped in packs of 25 HSP-1 For use with all single phase Panel mount SSR’s, Control modules and M50 power modules.
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Untitled
Abstract: No abstract text available
Text: HSP Series Thermal Pads • Easy-to-use thermal interface Material designed for use with Standard Crydom single-phase and three-phase solid-state relays. • Excellent alternative to thermal grease • Shipped in packs of 25 HSP1 For use with all single phase Panel mount SSR’s, Control modules and M50 power modules.
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Abstract: No abstract text available
Text: HSP Series Thermal Pads • Easy-to-use thermal interface Material designed for use with Standard Crydom single-phase and three-phase solid-state relays. • Excellent alternative to thermal grease • Shipped in packs of 25 HSP-1 For use with all single phase Panel mount SSR’s, Control modules and M50 power modules.
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Untitled
Abstract: No abstract text available
Text: HSP Series Thermal Pads • Easy-to-use thermal interface Material designed for use with Standard Crydom single-phase and three-phase solid-state relays. • Excellent alternative to thermal grease • Adhesive on one side HSP-2 For use with all single phase Panel mount SSR’s, Control modules and M50 power modules.
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Crydom
Abstract: CRYDOM ssr panel mount
Text: HSP Series Thermal Pads • Easy-to-use thermal interface Material designed for use with Standard Crydom single-phase and three-phase solid-state relays. • Excellent alternative to thermal grease • Adhesive on one side HSP-2 For use with all single phase Panel mount SSR’s, Control modules and M50 power modules.
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Crydom
CRYDOM ssr panel mount
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thermal pads
Abstract: No abstract text available
Text: HSP Series Thermal Pads • Easy-to-use thermal interface Material designed for use with Standard Crydom single-phase and three-phase solid-state relays. • Excellent alternative to thermal grease • Adhesive on one side HSP-2 For use with all single phase Panel mount SSR’s, Control modules and M50 power modules.
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010in/0
thermal pads
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Untitled
Abstract: No abstract text available
Text: HSP Series Thermal Pads • Easy-to-use thermal interface Material designed for use with Standard Crydom single-phase and three-phase solid-state relays. • Excellent alternative to thermal grease • Shipped in packs of 25 HSP-1 For use with all single phase Panel mount SSR’s, Control modules and M50 power modules.
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010in/0
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Untitled
Abstract: No abstract text available
Text: HSP Series Thermal Pads • Easy-to-use thermal interface Material designed for use with Standard Crydom single-phase and three-phase solid-state relays. • Excellent alternative to thermal grease • Adhesive on one side HSP-2 For use with all single phase Panel mount SSR’s, Control modules and M50 power modules.
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tantalum capacitor avx ian salisbury
Abstract: No abstract text available
Text: TECHNICAL INFORMATION THERMAL MANAGEMENT OF SURFACE MOUNTED TANTALUM CAPACITORS Ian Salisbury AVX-Kyocera Group Company Paignton, England TQ4 7ER Abstract: This paper covers thermal management of surface mounted tantalum capacitors, and explores the thermal characteristics
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tantalum capacitor avx ian salisbury
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Untitled
Abstract: No abstract text available
Text: TECHNICAL INFORMATION THERMAL MANAGEMENT OF SURFACE MOUNTED TANTALUM CAPACITORS Ian Salisbury AVX-Kyocera Group Company Paignton, England TQ4 7ER Abstract: This paper covers thermal management of surface mounted tantalum capacitors, and explores the thermal characteristics
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past80-539-1501
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