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    THERMAL PAD Search Results

    THERMAL PAD Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TCTH011AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH022AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH021AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012BE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Open-drain type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    SF Impression Pixel

    THERMAL PAD Price and Stock

    Wakefield-Vette CUSTOM THERMAL PAD

    Custom Thermal Pad 35Mm X 45Mm X1Mm Pn To Be Given Upon Po Rohs Compliant: Yes |Wakefield Thermal CUSTOM THERMAL PAD
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Newark CUSTOM THERMAL PAD Bulk 2,500
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    Phoenix Contact VL2 THERMAL PAD: 9MM 2.5

    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com VL2 THERMAL PAD: 9MM 2.5
    • 1 $134.05
    • 10 $111.65
    • 100 $103.95
    • 1000 $103.95
    • 10000 $103.95
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    Master Electronics VL2 THERMAL PAD: 9MM 2.5
    • 1 $134.05
    • 10 $111.65
    • 100 $103.95
    • 1000 $103.95
    • 10000 $103.95
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    Phoenix Contact VL2 THERMAL PAD: 7MM 2.5

    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com VL2 THERMAL PAD: 7MM 2.5
    • 1 $134.05
    • 10 $111.65
    • 100 $103.95
    • 1000 $103.95
    • 10000 $103.95
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    Master Electronics VL2 THERMAL PAD: 7MM 2.5
    • 1 $134.05
    • 10 $111.65
    • 100 $103.95
    • 1000 $103.95
    • 10000 $103.95
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    Vicor Corporation 20264 MINI THERMAL PAD 10-PACK

    Thermal Interface Pad for Mini-Size DC to DC Modules 58.92mm x 55.88mm x 0.17mm (Alt: 20264)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Abacus 20264 MINI THERMAL PAD 10-PACK 28 Weeks 1
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    Vicor Corporation 20263 MAXI THERMAL PAD 10-PACK

    THERMMATE MAXI (10PC) (Alt: 20263)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Abacus 20263 MAXI THERMAL PAD 10-PACK 28 Weeks 1
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    Find more THERMAL PAD price and stock on Findchips.com

    THERMAL PAD Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    VICOR 20263

    Abstract: ThermMate VICOR 20265 ThermMate mini 16299 ThermMate maxi 16297 ThermMate micro VI-J00 20267
    Text: Thermal Management ThermMate Thermal Pads 10 pieces per package For use with Vicor modules, ThermMate thermal pads are a “dry” alternative to thermal compound and are pre-cut to the outline dimensions of the module.* 20266 Thermal Pad Part No. VI-200 (10 pieces)


    Original     		PDF VI-200 VI-J00 VICOR 20263 ThermMate VICOR 20265 ThermMate mini 16299 ThermMate maxi 16297 ThermMate micro VI-J00 20267

    JTP 38 diode smd

    Abstract: p2w smd Transistor SMD SOT363 SC70 SC11 SC70-6 SO20 SSOP16 SSOP24 SC11 Thermal Considerations SOD61
    Text: DISCRETE SEMICONDUCTORS General Section Module Thermal Considerations Module: THC00X Valid for: SC11 Thermal Considerations Power Diodes 1998 Dec 09 Philips Semiconductors Power Diodes Thermal Considerations THERMAL CONSIDERATIONS Thermal resistance junction


    Original     		PDF THC00X OT404 JTP 38 diode smd p2w smd Transistor SMD SOT363 SC70 SC11 SC70-6 SO20 SSOP16 SSOP24 SC11 Thermal Considerations SOD61

    D149

    Abstract: D149 diode Interpoint HR300 TMP-002 TMP-003 TMP-004 TMP-005 7264 M
    Text: FEATURES * –60° to +180°C temperature rating • Provides thermal transfer for Interpoint converters • 0.2°C in2/W 129°C mm2/W thermal resistance • 4000 Vac breakdown voltage typical TMP THERMAL PAD ACCESSORY TMP THERMAL PAD TMP-004 TMP-001 MODEL


    Original     		PDF TMP-004 TMP-001 TMP-002 HR300 TMP-003 MK200 TMP-005 D149 D149 diode Interpoint HR300 TMP-002 TMP-003 TMP-004 TMP-005 7264 M

    D2240

    Abstract: D257 E595
    Text: TflexTM 700 Series Thermal Gap Filler Innovative Technology for a Connected World HIGH THERMAL CONDUCTIVITY COMPLIANT GAP FILLER Tflex 700 is a 5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. The soft interface pad conforms to component


    Original     		PDF A15955-00 D2240 D257 E595

    APP4646

    Abstract: MAX16815 PWM simulation matlab
    Text: Maxim > App Notes > Display Drivers Power-Supply Circuits Temperature Sensors and Thermal Management Keywords: Transient thermal behavior, IC thermal behavior, thermal-body model, RC network model, predict thermal behavior Feb 25, 2010 APPLICATION NOTE 4646


    Original     		PDF MAX16815: MAX16828: com/an4646 AN4646, APP4646, Appnote4646, APP4646 MAX16815 PWM simulation matlab

    Athlon 64 motherboard design guide

    Abstract: Thermal grease silicon thermal grease AMD Athlon 64 AMD xp datasheet amd Athlon xp mobile Athlon XP AMD ATHLON 64 X 2 soil "electrical conductivity" amd Athlon 64 processor data sheet
    Text: Thermal Interface Material Comparison: Thermal Pads vs. Thermal Grease Publication # 26951 Revision: 3.00 Issue Date: April 2004 2004 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: PC93 Non-Silicone Thermal Conductive Pad Features Low contact thermal impedance Good thermal conductivity Silicone free Long term stability Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /


    Original     		PDF 320-320mm D2240

    Untitled

    Abstract: No abstract text available
    Text: PC94 Non-Silicone Thermal Conductive Pad Features Low contact thermal impedance Good thermal conductivity Silicone free Long term stability Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /


    Original     		PDF 320-320mm D2240

    Untitled

    Abstract: No abstract text available
    Text: PC93 Non-Silicone Thermal Conductive Pad Features Low contact thermal impedance Good thermal conductivity Silicone free Long term stability Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /


    Original     		PDF 320-320mm D2240

    Untitled

    Abstract: No abstract text available
    Text: PC94 Non-Silicone Thermal Conductive Pad Features Low contact thermal impedance Good thermal conductivity Silicone free Long term stability Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /


    Original     		PDF 320-320mm D2240

    D149

    Abstract: HR300 TMP-002 TMP-003 TMP-005 astm D149 Interpoint
    Text: Crane Aerospace & Electronics Power Solutions TMP Thermal Pad Accessory FEATURES • -60°C to +200°C temperature rating • Provides thermal transfer for Interpoint converters • 0.46°C in2/W 297°C mm2/W thermal impedance • 4000 VAC breakdown voltage typical


    Original     		PDF TMP-007 TMP-001 TMP-003 TMP-002 HR300 TMP-005 D149 HR300 TMP-002 TMP-003 TMP-005 astm D149 Interpoint

    APP3879

    Abstract: MAX9704 MAX9741 MAX9742 MAX9744 MAX9768 CLASS D class d Audio amplifier 24v Highly Efficiency Audio Amplifier CLASS D amplifier
    Text: Maxim > App Notes > AUDIO CIRCUITS Keywords: class D, thermal, performance, heatsink, exposed, pad, TQFN Aug 16, 2006 APPLICATION NOTE 3879 Thermal Considerations for a Class D Amplifier Abstract: A Class D amplifier provides much better efficiency and thermal performance than a comparable


    Original     		PDF MAX9704: MAX9741: MAX9742: MAX9744: MAX9768: AN3879, APP3879, Appnote3879, APP3879 MAX9704 MAX9741 MAX9742 MAX9744 MAX9768 CLASS D class d Audio amplifier 24v Highly Efficiency Audio Amplifier CLASS D amplifier

    TMP-005

    Abstract: TMP-003 c 129 transistor MPE SERIES D149 HR300 TMP-002 interpoint tmp007
    Text: Crane Aerospace & Electronics Power Solutions TMP Thermal Pad Accessory FEATURES • –60° to +180°C temperature rating • Provides thermal transfer for Interpoint converters • 0.2°C in2/W 129°C mm2/W thermal resistance • 4000 Vac breakdown voltage typical


    Original     		PDF TMP-007 TMP-001 TMP-003 TMP-002 HR300 TMP-005 TMP-005 TMP-003 c 129 transistor MPE SERIES D149 HR300 TMP-002 interpoint tmp007

    QFN PACKAGE Junction to PCB thermal resistance

    Abstract: en5322 double sided pcb, thermal via EN5322QI J-STD-020A double sided pcb thermal
    Text: THERMAL NOTE EN5322QI DC-DC Converters September 2008 Thermal Characteristics The Enpirion EN5322QI DC-DC converter is packaged in 4x6x1.1mm, 24-pin QFN package. The QFN packages are constructed with copper lead frames that have exposed thermal pads. The recommended maximum junction temperature for


    Original     		PDF EN5322QI 24-pin QFN PACKAGE Junction to PCB thermal resistance en5322 double sided pcb, thermal via J-STD-020A double sided pcb thermal

    FR4 epoxy pcb double sided

    Abstract: SA transistor thermal resistance of low power semiconductor
    Text: Philips Semiconductors Thermal considerations PowerMOS Transistors The elements of thermal resistance shown in Fig.2 are defined as follows: THERMAL CONSIDERATIONS Thermal resistance Circuit performance and long-term reliability are affected by the temperature of the transistor die. Normally, both are


    Original     		PDF MBB446 MBB447 FR4 epoxy pcb double sided SA transistor thermal resistance of low power semiconductor

    AN569 in Motorola Power Applications

    Abstract: motorola mosfet BASIC THERMAL MANAGEMENT OF POWER SEMICONDUCTORS MTP15N06V equivalent dpak DIODE ANODE COMMON motorola ir 722c motorola Power Applications Manual mtv32 DV240 AN1083
    Text: Thermal Compendium Table of Contents Abstracts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Basic Semiconductor Thermal Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7


    Original     		PDF

    "exposed pad" PCB via

    Abstract: "thermal via" thermal pcb guidelines AIC1573 copper thermal
    Text: Thermal Design Considerations of Exposed Pad IC As the miniaturization of electronic devices, the small area and close proximity of ICs in these modules demands small packages with excellent thermal properties. Thermal performance is a system level concern, impacted by IC packaging as well as PCB design.


    Original     		PDF im1573 "exposed pad" PCB via "thermal via" thermal pcb guidelines AIC1573 copper thermal

    EN5336

    Abstract: EN5366Q QFN "100 pin" PACKAGE thermal resistance QFN PACKAGE Junction to PCB thermal resistance EN5356 EN5365Q EN5335Q EN5365 J-STD-020A "thermal via"
    Text: THERMAL NOTE EN5365Q/EN5366Q DC-DC Converters ENPIRION Thermal Characteristics The Enpirion EN5365Q and EN5366Q DC-DC converters are packaged in 12x10x1.85mm 58-pin QFN packages that have the same thermal characteristics. The QFN packages are constructed with copper lead frames that have exposed thermal


    Original     		PDF EN5365Q/EN5366Q EN5365Q EN5366Q 12x10x1 58-pin EN5336 QFN "100 pin" PACKAGE thermal resistance QFN PACKAGE Junction to PCB thermal resistance EN5356 EN5335Q EN5365 J-STD-020A "thermal via"

    D149

    Abstract: D150 D2240 D257 D412 E595
    Text: T-flex 600 Series Thermal Gap Filler global solutions : local support ™ T-flexTM 600 Series Thermal Gap Filler Exceptionally soft, highly compressible gap filler T-flex™ 600 is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3 W/mK. These


    Original     		PDF

    D149

    Abstract: D150 D2240 D257 D412 E595 IPC-TM650
    Text: T-flex 600 Series Thermal Gap Filler global solutions : local support ™ T-flexTM 600 Series Thermal Gap Filler Exceptionally soft, highly compressible gap filler T-flex™ 600 is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3 W/mK. These


    Original     		PDF A13512-00 T-FLEX600-0707 D149 D150 D2240 D257 D412 E595 IPC-TM650

    SoftFlex

    Abstract: No abstract text available
    Text: DATASHEET SOFTFLEX GAP FILLER LIGHT FLEXIBLE THERMAL GAP FILLING PADS The Aavid SoftFlex series is our most flexible and diverse line of thermal conductive pads. The compressibility and adhesion features enable a dramatic reduction in thermal resistance when mounting. The unique flexibility of the SoftFlex base material provides


    Original     		PDF 400mm x8122 SoftFlex

    k-952 TRANSISTOR

    Abstract: transistor RJp 30
    Text: Thermal Management Considerations for Super Flux LEDs Application Note 1149-4 Table of Contents Introduction Importance of Thermal Management for High-Power LED Assemblies . 2 Thermal management is critical in


    Original     		PDF 5968-1214E 5968-4415E k-952 TRANSISTOR transistor RJp 30

    CRYDOM ssr panel mount

    Abstract: phase separator
    Text: HSP Series Thermal Pads • Easy-to-use thermal interface Material designed for use with Standard Crydom single-phase and three-phase solid-state relays. • Excellent alternative to thermal grease HSP-1 For use with all single phase Panel mount SSR’s, Control modules and M50 power modules.


    Original     		PDF 53TP/53RV) 15dules. CRYDOM ssr panel mount phase separator

    Loctite 3873

    Abstract: T-PCM905C Loctite 3873 rework TPCM585 T-pcm585 datasheet of Z40-12.7B heat sink TPCM905C of Z40-12.7B heat sink Theta JC of FBGA JESD51-X
    Text: Thermal Management for FPGAs Thermal Management for FPGAs AN-358-3.0 Application Note This application note provides guidance on thermal management of Altera devices and helps you determine the thermal performance for your application. The factors you must consider in evaluating heat dissipation include evaluating the


    Original     		PDF AN-358-3 Loctite 3873 T-PCM905C Loctite 3873 rework TPCM585 T-pcm585 datasheet of Z40-12.7B heat sink TPCM905C of Z40-12.7B heat sink Theta JC of FBGA JESD51-X