Power Semiconductor Applications Philips Semiconductors
Abstract: "Power Semiconductor Applications" Philips "CHAPTER 1 Introduction to Power Semiconductors" CHAPTER 1 Introduction to Power Semiconductors "static induction thyristor" varistor 503 static induction Thyristor TELEVISION EHT TRANSFORMERS 201 Static Induction Thyristor varistor 10c 471
Text: Thermal Management Power Semiconductor Applications Philips Semiconductors CHAPTER 7 Thermal Management 7.1 Thermal Considerations 553 Thermal Management Power Semiconductor Applications Philips Semiconductors Thermal Considerations 555 Thermal Management
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Phase Change
Abstract: ultrastick phase-change AAVID THERMALLOY COMPOUND 250
Text: Aavid Ultrastick Phase-Change Thermal Interface Compound ULTRASTICK™ PHASE-CHANGE THERMAL INTERFACE COMPOUND Aavid’s Ultrastick™ is a unique phase-change thermal interface material that surpasses grease in thermal performance and long-term stability. This solid, siliconefree, paraffin-based thermal compound changes phase at
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AAVID THERMALLOY COMPOUND 250
Abstract: 100300F00000
Text: Aavid Ultrastick Phase-Change Thermal Interface Compound ULTRASTICK™ PHASE-CHANGE THERMAL INTERFACE COMPOUND Aavid’s Ultrastick™ is a unique phase-change thermal interface material that surpasses grease in thermal performance and long-term stability. This solid, silicone-free,
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Athlon 64 motherboard design guide
Abstract: Thermal grease silicon thermal grease AMD Athlon 64 AMD xp datasheet amd Athlon xp mobile Athlon XP AMD ATHLON 64 X 2 soil "electrical conductivity" amd Athlon 64 processor data sheet
Text: Thermal Interface Material Comparison: Thermal Pads vs. Thermal Grease Publication # 26951 Revision: 3.00 Issue Date: April 2004 2004 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced
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TGREASE-980
Abstract: No abstract text available
Text: TgreaseTM 980 Thermal Grease Innovative Technology for a Connected World ENVIRONMENTALLY FRIENDLY THERMALLY CONDUCTIVE GREASE Tgrease 980 is a silicone-based thermal grease for use in high performance CPUs and GPUs. Tgrease 980 has a high thermal conductivity of 3.8 W/mK and superior wetting characteristics, resulting in a very low thermal resistance and excellent long term reliability.
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Untitled
Abstract: No abstract text available
Text: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal
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0-320P
73-7-320A
173-7-330P
173-7-340P
173-7-350P
173-7-410P
173-7-510P
173-7-520P
173-7-610P
173-7-710P
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Untitled
Abstract: No abstract text available
Text: Heat Transfer Pads THERMAL MANAGEMENT FOR SSR’s • Maximize Thermal Conductivity Crydom Heat Transfer Pads offer a clean, ease-to-use and grease-free alternative to conventional mica or grease while maximizing the thermal conductivity. Installation is simple, pads are die cut to
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MIL-C-47113
Abstract: KS-21343 KS21343 KS213
Text: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal
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126-4S
126-5LB
MIL-C-47113
KS-21343
KS21343
KS213
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Laird thermal grease
Abstract: viscometer D257 transistors IGBT A15296-00
Text: TgreaseTM 880 Series Thermal Grease Innovative Technology for a Connected World ENVIRONMENTALLY FRIENDLY THERMALLY CONDUCTIVE GREASE TgreaseTM 880 is a silicone based, high performance thermal grease designed to meet the thermal, reliability and price requirements of high end CPUs, GPUs and custom ASICS chips.
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A15092-00
Laird thermal grease
viscometer
D257
transistors IGBT
A15296-00
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Untitled
Abstract: No abstract text available
Text: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal
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AN569 in Motorola Power Applications
Abstract: motorola mosfet BASIC THERMAL MANAGEMENT OF POWER SEMICONDUCTORS MTP15N06V equivalent dpak DIODE ANODE COMMON motorola ir 722c motorola Power Applications Manual mtv32 DV240 AN1083
Text: Thermal Compendium Table of Contents Abstracts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Basic Semiconductor Thermal Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
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heatsink
Abstract: heatsink design
Text: APPLICATION NOTE ST6x86 Thermal Design Considerations 1.0 Introduction This Application Report serves as a guide in the thermal design of a personal computer that uses the SGS-Thomson ST6x86 Microprocessor. A simplified thermal model is presented that utilizes thermal
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ST6x86
heatsink
heatsink design
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TS54PAIO
Abstract: TS54P-AIO st6x86p166
Text: APPLICATION NOTE ST6x86 Thermal Design Considerations 1.0 Introduction This Application Report serves as a guide in the thermal design of a personal computer that uses the SGS-Thomson ST6x86 Microprocessor. A simplified thermal model is presented that utilizes thermal
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ST6x86
TS54PAIO
TS54P-AIO
st6x86p166
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MIL-C-47113
Abstract: t405 6000 e595 Chomerics* T-405 deltabond ARCLAD 8223 T-412 chomerics KS21343 thermal grease Chomerics T710 174-9-250P
Text: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal
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O-220
MIL-C-47113
t405 6000
e595
Chomerics* T-405
deltabond
ARCLAD 8223
T-412 chomerics
KS21343 thermal grease
Chomerics T710
174-9-250P
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Wakefield 120-320
Abstract: No abstract text available
Text: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of
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173-7-220P
173-7-230P
173-7-240P
173-7-1212P
73-7-240A
173-9-210P
173-9-230P
173-9-240P
173-9-1212P
174-9-310P
Wakefield 120-320
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D149
Abstract: D149 diode Interpoint HR300 TMP-002 TMP-003 TMP-004 TMP-005 7264 M
Text: FEATURES * –60° to +180°C temperature rating • Provides thermal transfer for Interpoint converters • 0.2°C in2/W 129°C mm2/W thermal resistance • 4000 Vac breakdown voltage typical TMP THERMAL PAD ACCESSORY TMP THERMAL PAD TMP-004 TMP-001 MODEL
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TMP-004
TMP-001
TMP-002
HR300
TMP-003
MK200
TMP-005
D149
D149 diode
Interpoint
HR300
TMP-002
TMP-003
TMP-004
TMP-005
7264 M
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wacker P12
Abstract: graphite foil PG-3504 keratherm graphite foil thermal interface resistance htc electrolube 1000-1 POWER MODULE TIC4000 thermal grease p12 uscan
Text: Application Note AN-10-001 Revision: Issue Date: 2010-03-30 Prepared by: Dieter Esau Key Words: Thermal paste THERMAL PASTE APPLICATION Designated use of thermal interface material TIM . 1
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AN-10-001
wacker P12
graphite foil
PG-3504
keratherm
graphite foil thermal interface resistance
htc electrolube
1000-1 POWER MODULE
TIC4000
thermal grease p12
uscan
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CRYDOM ssr panel mount
Abstract: phase separator
Text: HSP Series Thermal Pads • Easy-to-use thermal interface Material designed for use with Standard Crydom single-phase and three-phase solid-state relays. • Excellent alternative to thermal grease HSP-1 For use with all single phase Panel mount SSR’s, Control modules and M50 power modules.
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53TP/53RV)
15dules.
CRYDOM ssr panel mount
phase separator
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Untitled
Abstract: No abstract text available
Text: Application Note Thermal Resistance, Thermal Spreading and Temperature Measurement Thermal Characterization of a Power Module Application Note no.: AN_2013_09_001-v01 Table of Contents 1 A bs tr ac t . 4
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Laird thermal grease
Abstract: viscometer
Text: TgreaseTM 2500 Series Thermal Grease Innovative Technology for a Connected World ENVIRONMENTALLY FRIENDLY THERMALLY CONDUCTIVE GREASE Tgrease 2500 is a silicone-free thermal grease for use in high performance CPU’s and GPU’s. With a high thermal conductivity of 3.8 W/mK, Tgrease™ 2500 thoroughly wets
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A14265-00
Laird thermal grease
viscometer
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Loctite 3873
Abstract: T-PCM905C Loctite 3873 rework TPCM585 T-pcm585 datasheet of Z40-12.7B heat sink TPCM905C of Z40-12.7B heat sink Theta JC of FBGA JESD51-X
Text: Thermal Management for FPGAs Thermal Management for FPGAs AN-358-3.0 Application Note This application note provides guidance on thermal management of Altera devices and helps you determine the thermal performance for your application. The factors you must consider in evaluating heat dissipation include evaluating the
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AN-358-3
Loctite 3873
T-PCM905C
Loctite 3873 rework
TPCM585
T-pcm585
datasheet of Z40-12.7B heat sink
TPCM905C
of Z40-12.7B heat sink
Theta JC of FBGA
JESD51-X
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Untitled
Abstract: No abstract text available
Text: Improved Thermal Interface for Direct Pressed Power Modules Temesi Ernö, Michael Frisch - Vincotech - Hungary, Germany The grease causes about half of the total value of the thermal resistant between junction and heat sink. The thermal resistance of the Vincotech flow0 and flow1 modules given in the datasheet is based on
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Abstract: No abstract text available
Text: HSP Series Thermal Pads • Easy-to-use thermal interfaceMaterial designed for use with Standard Crydom single-phase and three-phase solid-state relays. • Excellent alternative to thermal grease • Adhesive on one side HSP-2 For use with all single phase Panel mount SSR’s, Control modules and M50 power modules.
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53TP/53RV)
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PH300S280-5
Abstract: air cooled heatsink step7 HAA-083 ph300s
Text: PH300S,600S-SERIES Thermal Design PH300S, 600S Thermal Design 1. Thermal Design 2. Standard Heatsink DWG NO. : C113-04-13 APPD CHK DWG ¡y I l/wR/'fi ¿/my?* & NM C-U M BD A PH300S,600S-SERIES Thermal Design • 1. Thermal Design To ensure proper operation of power modules, it is
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PH300S
600S-SERI
PH300S,
C113-04-13
600S-SERIES
PH300S280-5.
HAA-083)
PH300S
HAA-146)
PH300S280-5
air cooled heatsink
step7
HAA-083
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