D149
Abstract: D150 D2240 D257 D412 E595 IPC-TM650
Text: T-flex 600 Series Thermal Gap Filler global solutions : local support ™ T-flexTM 600 Series Thermal Gap Filler Exceptionally soft, highly compressible gap filler T-flex™ 600 is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3 W/mK. These
|
Original
|
A13512-00
T-FLEX600-0707
D149
D150
D2240
D257
D412
E595
IPC-TM650
|
PDF
|
D149
Abstract: D150 D2240 D257 D412 E595
Text: T-flex 600 Series Thermal Gap Filler global solutions : local support ™ T-flexTM 600 Series Thermal Gap Filler Exceptionally soft, highly compressible gap filler T-flex™ 600 is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3 W/mK. These
|
Original
|
|
PDF
|
D2240
Abstract: D257 E595
Text: TflexTM 700 Series Thermal Gap Filler Innovative Technology for a Connected World HIGH THERMAL CONDUCTIVITY COMPLIANT GAP FILLER Tflex 700 is a 5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. The soft interface pad conforms to component
|
Original
|
A15955-00
D2240
D257
E595
|
PDF
|
D149
Abstract: D150 D2240 D257 D412 E595
Text: T-flex 200V0 Series Thermal Gap Filler global solutions : local support ™ T-flexTM 200V0 Series Thermal Gap Filler Soft, freestanding gap filler T-flex™ 200 V0 is a very soft, freestanding gap filler that is more compliant than most other gap fillers.
|
Original
|
200V0
D149
D150
D2240
D257
D412
E595
|
PDF
|
Untitled
Abstract: No abstract text available
Text: TflexTM HR400 Series Thermal Gap Filler Innovative Technology for a Connected World MID-PERFORMANCE GAP FILLER WITH 1.8 W/MK Tflex HR400 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications.
|
Original
|
HR400
HR400â
A15958-00
|
PDF
|
Untitled
Abstract: No abstract text available
Text: TflexTM HR200 Series Thermal Gap Filler Innovative Technology for a Connected World PRELIMINARY MID-PERFORMANCE GAP FILLER WITH 1.6 W/MK Tflex HR200 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications.
|
Original
|
HR200
A16503-00
|
PDF
|
A15999-00
Abstract: D2240 ASTM D5470 ASTM-D-257 HR610FG D257 E595 HR600 HR6120 HR-60
Text: Tflex HR600 Series TM Thermal Gap Filler Innovative Technology for a Connected World Mid-Performance Gap Filler with 3 W/mK Tflex HR600 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications.
|
Original
|
HR600
A15999-00
D2240
ASTM D5470
ASTM-D-257
HR610FG
D257
E595
HR6120
HR-60
|
PDF
|
Thermal Gap Filler
Abstract: D149 D2240 D257 D412 E595
Text: TflexTM 200 V0 Series Thermal Gap Filler Innovative Technology for a Connected World SOFT, FREESTANDING GAP FILLER Tflex 200 V0 is a very soft, freestanding gap filler that is more compliant than most other gap fillers. Combining good thermal conductivity of 1.1 W/mK with high conformability, this
|
Original
|
A14175-00
Thermal Gap Filler
D149
D2240
D257
D412
E595
|
PDF
|
D149
Abstract: D150 D2240 D257 D412 E595 Outgassing
Text: T-flex 300 Series Thermal Gap Filler global solutions : local support ™ T-flexTM 300 Series Thermal Gap Filler Features and Benefits: Unique silicone gel offers compliancy, thermal resistance • Extreme compliancy allows material to “totally blanket” component s
|
Original
|
50psi,
/m750
D149
D150
D2240
D257
D412
E595
Outgassing
|
PDF
|
A16311
Abstract: XS460
Text: TflexTM XS400 Series Thermal Gap Filler Innovative Technology for a Connected World Compliant 2.0 W/mK Thermally Conductive Gap Filler Tflex XS400 is a compliant elastomer gap filler designed to provide moderate thermal performance. This soft interface pad conforms well with minimal pressure, resulting in little
|
Original
|
XS400
A16311-00
A16311
XS460
|
PDF
|
ADHESIVE GAP PAD
Abstract: D575 D2240 D257 E595 low outgassing materials
Text: TflexTM 500 Series Thermal Gap Filler Innovative Technology for a Connected World Compliant 2.8 W/mK Thermally Conductive Gap Filler Tflex 500 is a compliant elastomer gap filler designed to provide excellent thermal performance while remaining cost effective. This soft interface pad conforms well with
|
Original
|
A15958-00
ADHESIVE GAP PAD
D575
D2240
D257
E595
low outgassing materials
|
PDF
|
D149
Abstract: D150 D2240 D257 D412 E595
Text: TflexTM 600 Series Thermal Gap Filler Innovative Technology for a Connected World Exceptionally soft, highly compressible gap filler Tflex 600 is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a
|
Original
|
A13512-00
D149
D150
D2240
D257
D412
E595
|
PDF
|
BERGQUIST
Abstract: 3000S30 conductivity
Text: Gap Pad 3000S30 Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 3000S30 PROPERTY Color • Thermal conductivity: 3.0 W/m-K • Low “S-Class” thermal resistance at very low pressures
|
Original
|
3000S30
3000S30
BERGQUIST
conductivity
|
PDF
|
SoftFlex
Abstract: No abstract text available
Text: DATASHEET SOFTFLEX GAP FILLER LIGHT FLEXIBLE THERMAL GAP FILLING PADS The Aavid SoftFlex series is our most flexible and diverse line of thermal conductive pads. The compressibility and adhesion features enable a dramatic reduction in thermal resistance when mounting. The unique flexibility of the SoftFlex base material provides
|
Original
|
400mm
x8122
SoftFlex
|
PDF
|
|
|
ASF600
Abstract: No abstract text available
Text: TflexTM SF600 DF Series Thermal Gap Filler Innovative Technology for a Connected World COMPLIANT SILICONE-FREE 2.8-3.0 W/mK THERMALLY CONDUCTIVE GAP FILLER Tflex SF600 DF is a high performance, silicone-free thermal gap filler with a conductivity of 2.8 - 3.0 W/mK. Tflex™ SF600 DF is designed for applications which are silicone sensitive.
|
Original
|
SF600
010-inch
060-inch
010-inch
A16373-00
ASF600
|
PDF
|
Untitled
Abstract: No abstract text available
Text: TflexTM 200T V0 Series Thermal Gap Filler Innovative Technology for a Connected World THIN THERMALLY CONDUCTIVITY ELASTOMERIC INTERFACE MATERIAL Tflex 200T V0 is a specially formulated thin gap filler thermal interface material designed for thin interfaces that require a combination good thermal performance with great reliability. The elastomeric property of Tflex™ 200T V0 provides good thermal performance in
|
Original
|
A15922-00
|
PDF
|
D150
Abstract: D2240 D257 D412 E595 D149 TPLITM220
Text: T-pli 200 Series Gap Filler global solutions : local support ™ T-pliTM 200 Series Gap Filler Features and Benefits: Exceptionally soft, highly compressible gap filler • Thermal performance leader T-pli™ 200 is a premium gap filler. A unique blend of boron
|
Original
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: TputtyTM 506 Series Gap Filler Material Innovative Technology for a Connected World SOFT, SILICONE PUTTY Tputty 506 is a soft, single part, silicone putty thermal gap filler in which no cure is required. This gap filler is ideal for applications where large gap tolerances are present and in which traditional gap filler
|
Original
|
A16421-00
|
PDF
|
CR200
Abstract: No abstract text available
Text: TflexTM CR200 Series Gap Filler Material Preliminary TWO-PART CURE IN PLACE GAP FILLER Tflex CR200 is a two-part, silicone-based thermal gap filler that has low viscosity prior to curing. Tflex™ CR200 is ideal for applications where large gap tolerances are present.
|
Original
|
CR200
50ral
A16845-00
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Laird Technologies Web site: www.LairdTech.com Tflex 300 Series Gap Filler Material Ultra Compliant, Thermal Gap Filler for High-Speed Computing and Telecommunications Applications Tflex™ 300 is a silicone gel combined with a ceramic powder to offer an unique combination of compliancy, thermal
|
Original
|
|
PDF
|
bergquist
Abstract: No abstract text available
Text: Gap Filler 1000 Two-Part Thermally Conductive, Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 1000 PROPERTY Color / Part A • Thermal conductivity: 1.0 W/m-K • Ultra-conforming, designed for fragile and low-stress applications
|
Original
|
D2196
bergquist
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Gap Filler1000SR Two-Part Thermally Conductive, Liquid Gap Filler Material Features and Benefits • Thermal Conductivity: 1.0 W/m-K • Excellent slump resistance (stays in place) TYPICAL PROPERTIES OF GAP FILLER 1000SR PROPERTY Color / Part A IMPERIAL VALUE
|
Original
|
Filler1000SR
1000SR
D5099
GF1000SR
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Gap Filler 1100SF Two-Part Thermally Conductive, Silicone-Free, Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 1100SF PROPERTY Color / Part A • Thermal conductivity: 1.1 W/m-K • No silicone outgassing or extraction
|
Original
|
100SF
1100SF
1100SF
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Gap Filler 1500 Two-Part Thermally Conductive Liquid Gap Filling Material Features and Benefits T YPICAL PROPERT IES OF GAP FILLER 1500 • Thermal conductivity:1.8 W/mK PROPERTY Color / Part A IMPERIAL VALUE Yellow • Optimized shear thinning characteristics for
|
Original
|
D2196
D2240
|
PDF
|
