Ablebond
Abstract: Ablecube ablebond 2815a 2815A ablestik ablebond 2815a ATM-0018 ablebond ablestik ablebond technical Ablestik Ablestik 2815
Text: DEVELOPMENTAL TECHNICAL DATASHEET ABLEBOND 2815A THERMALLY CONDUCTIVE DIE ATTACH ADHESIVE DESCRIPTION ABLEBOND® 2815A die attach adhesive offers high thermal conductivity to minimize thermal resistance between the chip and substrate. This adhesive is designed to provide improved workability for applications requiring high heat extraction from die.
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concord ca 2100
Abstract: fagor 2201 HS01U 104 csk 3554M TFT250-18 FAGOR f 948 Concord Electronics MS04/CAGE
Text: HEATSINKS, MATING SOCKETS, WASHERS, VENDORS ACCESSORIES INFORMATION M I C R O T E C H N O L O G Y HTTP://WWW.APEXMICROTECH.COM RECOMMENDATIONS FOR THERMALLY CONDUCTIVE WASHERS Apex thermal washers are also available from Power Devices. “Thermstrate” is the material trade name for these
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546-APEX
HS01U
concord ca 2100
fagor 2201
104 csk
3554M
TFT250-18
FAGOR f 948
Concord Electronics
MS04/CAGE
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Untitled
Abstract: No abstract text available
Text: Thermal Stress Relief In Beam Lead Diode Assembly Application Note 993-1 Introduction Unless specific precautions are taken in the mounting of beam lead diodes on soft substrates e.g., Teflon/glass , a strong potential exists for lead failure during exposure to elevated
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E6 DIODE
Abstract: diode assembly
Text: Thermal Stress Relief In Beam Lead Diode Assembly Application Note 993-1 Introduction Unless specific precautions are taken in the mounting of beam lead diodes on soft substrates e.g., Teflon/ glass , a strong potential exists for lead failure during exposure to elevated temperatures. Soft substrate materials have a high thermal coefficient of expansion and
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5952-0709E
E6 DIODE
diode assembly
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thermal conductive teflon
Abstract: No abstract text available
Text: Hola1 H A H Insulating caps and insolater sleeves Insulating caps different transistor flange levels will be compensated by the impressed sleeves B art. no. C IK 341 3 art. no. D IK 3 material pressed-in sleeves flammability polyamide, GF reinforced caps
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AL-155-10C
Abstract: belleville washer teflon OPA2541 midland 0804MC AB-037 MC76 MIL-A-8625 OPA512 OPA541
Text: APPLICATION BULLETIN Mailing Address: PO Box 11400 • Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd. • Tucson, AZ 85706 Tel: 602 746-1111 • Twx: 910-952-111 • Telex: 066-6491 • FAX (602) 889-1510 • Immediate Product Info: (800) 548-6132
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TO3 SILICONE MICA SHEET
Abstract: AL-155-10C belleville washer teflon 0804MC OPA2541 90-HS-11 midland Tubing Sleeving Non-shrink AB-037 SBOA020
Text: APPLICATION BULLETIN Mailing Address: PO Box 11400 • Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd. • Tucson, AZ 85706 Tel: 602 746-1111 • Twx: 910-952-111 • Telex: 066-6491 • FAX (602) 889-1510 • Immediate Product Info: (800) 548-6132
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ML-1 94V-0
Abstract: E-36952 TSE397C-333ML MIL-A-46106 str 6709 MIL-A-46146 str 6708 Mil-S-46163A semiconductors cross index semiconductors cross reference
Text: Why MG Chemicals? At MG Chemicals, we realize that our number one asset is you, our customer. ISO Quality Standards. Since 1955, M.G. Chemicals has provided the North American electronics industry with a full line of high performance chemicals and accessories. The M.G. Chemicals manufacturing facility operates
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835-P-20
8420-P
8701-10ML,
8702-10ML,
8703-10ML,
8704-10ML)
416-E
416-ES
416-K
416-RP
ML-1 94V-0
E-36952
TSE397C-333ML
MIL-A-46106
str 6709
MIL-A-46146
str 6708
Mil-S-46163A
semiconductors cross index
semiconductors cross reference
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JEDEC JESD22-B116 free
Abstract: SUMIKON EME-G700 EME-G700 ablebond 3230 SUMItomo EME-G700 Sumitomo EME-G700 material Ablebond 84-1*SR4 Ablebond 8390 sumitomo G700 Tg ablebond 8390 cure time
Text: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: SR-0212-02 DATE: 12/20/2002 Product Affected: TSOP package family (see attachment for affected part #s). Date Effective: 3/20/2003 Contact: George Snell
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SR-0212-02
EME-G700
JEDEC JESD22-B116 free
SUMIKON EME-G700
EME-G700
ablebond 3230
SUMItomo EME-G700
Sumitomo EME-G700 material
Ablebond 84-1*SR4
Ablebond 8390
sumitomo G700 Tg
ablebond 8390 cure time
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10K3A1-25
Abstract: 10K3A1IA Betatherm 10K3A1B Betatherm 10K3A1IB betatherm 3k3a1a 30K6A1B 36K53D1-RS1030 Betatherm 30K5A1B 36K53A1
Text: BetaTHERM Sensors BetaTHERM Sensors Products and Data Ireland 353-91-753238 U.S.A. 508-842-0516 BetaTHERM 51 Web: http://www.betatherm.com BetaTHERM Sensors BetaCurve Interchangeable Thermistor Series I BetaCurve Interchangeable Thermistor Series I Applications
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75mW/oC
-80oC
150oC.
10K3A1-25
10K3A1IA
Betatherm 10K3A1B
Betatherm
10K3A1IB
betatherm 3k3a1a
30K6A1B
36K53D1-RS1030
Betatherm 30K5A1B
36K53A1
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Sony ACF
Abstract: ANISOLM upilex S 40 hitachi ACF upilex AC-7144 AC-7104 Hitachi 15 inch LCD HD66712TA0 acf film
Text: The Information of TCP Features of TCP TAB Technology Flexible Design The structure and materials used by Tape Carrier Package (TCP) give it the following features as compared with conventional packages: The following can be tailored to the design of the
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HD66120TA2
HD66120TA3
HD66300T00
HD66310T00
HD66330TA0
HD66503TA0
HD66503TB0
HD66520TA0
HD66520TB0
HD66712TA0
Sony ACF
ANISOLM
upilex S 40
hitachi ACF
upilex
AC-7144
AC-7104
Hitachi 15 inch LCD
acf film
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ASTM-F-150-72
Abstract: MIL-B-117 ASTM-D-991 FED-STD-101 ASTM-D991 Bipolar Static Induction Transistor cmos esd sensitivity MIL-M-55565 ASTM-D-257 SOAR-1
Text: R-FLOW ESD PROTECTION PROGRAM Linear Technology Corporation R-Flow Reliability has been a key focal point at Linear Technology Corporation LTC since its inception in 1981. Our standard product reliability is monitored closely and we have generated an extensive reliability database for both hermetic and plastic devices. This data is published on a
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MIL-STD-883
MIL-I-38534
MIL-M-55565
MIL-M-81705
FED-STD-101
EIA-625
ASTM-F-150-72
MIL-B-117
ASTM-D-991
FED-STD-101
ASTM-D991
Bipolar Static Induction Transistor
cmos esd sensitivity
MIL-M-55565
ASTM-D-257
SOAR-1
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Untitled
Abstract: No abstract text available
Text: Series 811 Mighty Mouse High Density HD Connectors The Ultraminiature Ruggedized Connector with High-Performance Micro TwistPin Contacts United States United Kingdom Germany France Nordic Italy Spain Japan Series 811 High DENSITY
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MIL-B-81705
Abstract: ASTM-D-257 ASTM-D991 ASTM-D-991 SOAR-1 ASTMF-150 ASTM-F-150 VZAP-90 20AWG MIL-B-117
Text: R-FLOW ESD PROTECTION PROGRAM Linear Technology Corporation R-Flow Reliability has been a key focal point at Linear Technology Corporation LTC since its inception in 1981. Our standard product reliability is monitored closely and we have generated an extensive reliability database for both hermetic and plastic devices. This data is published on a
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MIL-STD-883
MIL-PRF-38535
MIL-M-55565
MIL-B-81705
FED-STD-101
EIA-625
MIL-B-81705
ASTM-D-257
ASTM-D991
ASTM-D-991
SOAR-1
ASTMF-150
ASTM-F-150
VZAP-90
20AWG
MIL-B-117
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schematic WELDER
Abstract: gold melting furnace ultrasonic bond
Text: Bonding and Handling Procedures for Chip Devices DISCUSSION Chip diode devices for use in integrated circuit and hybrid integrated circuits have proliferated in the last few years. Today's circuit designer is faced with a multiplicity of alter natives in the selection of diodes and packaging with each
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OT-23
schematic WELDER
gold melting furnace
ultrasonic bond
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MIL-G-83528
Abstract: No abstract text available
Text: Field Replaceable SMA Jack 142 1701-501 142 1701-551 142 1701-601 142 1701-506 142 1701-556 142 1701-606 - - - - - - • Mechanically Captivated • Low RF Leakage • Mates with .012” Diameter Pin Part Number Flange Style Item 1 Body Item 3 Insulator 142-1701-501
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Mil-G-83528,
MIL-C-39012)
MIL-STD-202,
MIL-G-83528
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FR4 dielectric constant vs temperature
Abstract: FR4 substrate with dielectric constant 4
Text: THERMAL MANAGEMENT OF SURFACE MOUNT POWER DEVICES Prepared by Herb Fick Bergquist Reprinted with permission of POWERCONVERSION & INTELLIGENT MOTION August 1987 issue. 1987 Intertech Communications, Inc. All Rights Reserved. MOTOROLA Semiconductor Products Inc.
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AR302/D
FR4 dielectric constant vs temperature
FR4 substrate with dielectric constant 4
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Untitled
Abstract: No abstract text available
Text: 142 1701-511 142 1701-561 142 1701-611 Field Replaceable SMA Jack 142 1701-516 142 1701-566 142 1701-616 - - - - - - • Mechanically Captivated • Low RF Leakage • Mates with .015" Diameter Pin Part Number Flange Style Item 1 Body Item 2 Contact 142-1701-511
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Mil-G-83528,
MIL-C-39012)
MIL-STD-202,
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Untitled
Abstract: No abstract text available
Text: Field Replaceable SMA Jack 142 1701-521 142 1701-571 142 1701-621 142 1701-526 142 1701-576 142 1701-626 - - - - - - i : • Mechanically Captivated • Low RF Leakage • Mates with .018" Diameter Pin Ite m 3 In s u la to r Ite m 4 EMI G A S K E T P a rt
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Mil-G-83528,
MIL-C-39012)
MIL-STD-202,
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Untitled
Abstract: No abstract text available
Text: 142 1801-501 142 1801-551 142 1801-601 - Field Replaceable SMA Plug 142 1801-506 142 1801-556 142 1801-606 - • Mechanically Captivated • Low RF Leakage • Mates with .012" Diameter Pin Part Number Flange Style Item 1 Body Item 2 Contact Item 3 Insulator
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MIL-C-39012)
MIL-STD-202,
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Untitled
Abstract: No abstract text available
Text: Field Replaceable SMA Plug 142 1801-516 142 1801-566 142 1801-616 142 1801-511 142 1801-561 142 1801-611 - - - - - - • Mechanically Captivated • Low RF Leakage • Mates with .015" Diameter Pin Part R a nge Ite m l Item 2 Item 3 Item 4 Item 5 Ite m s Num ber
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MIL-C-39012)
MIL-STD-202,
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Untitled
Abstract: No abstract text available
Text: 142 1801-521 142 1801-571 142 1801-621 - - Field Replaceable SMA Plug 142 1801-526 142 1801-576 142 1801-626 - - - • Low RF Leakage • Mates with .018" Diameter Pin Part Number Flange Style Item 1 Body Item 2 Contact Item 3 Insulator Item 4 Coupling Nut
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2HoleX223
000Mating
MIL-C-39012)
MIL-STD-202,
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HUGHES mcw 550
Abstract: hughes welder welder hughes mcw 550 ECCOBOND 56c SN62PRMAB3 relative permittivity beryllium copper ferrite welder ECCOBOND 300 kester Re SOLDER PASTE mcw-550
Text: Ferrodisc and Drop-In* Devices Overview Ferrodisc and Drop-In circulators and isolators manufactured by M/A-COM are ex tremely well suited for all types of microwave integrated circuits MIC’s . The rapidly growing awareness and utilization of these devices in microwave systems of all
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Untitled
Abstract: No abstract text available
Text: REVISIONS P/N CAPTIVATION METHOD BASIC CC NONE EPOXY ONLY SF NONE CCSF EPOXY ONLY CCCE EPOXY WITH CONDUCTIVE CCCESF EPOXY WITH CONDUCTIVE ZONE REV. - A DESCRIPTION S DATE ECO 19541 BY 09.01.06 DKN (.550) (.325) — (.312 HEX) — MATERIAL(S): ELECTRICAL(S):
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D-1710.
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